Inventor · disambiguated record
Hye-Seung Yu
Also filed as: YU HYE-SEUNG
12 granted patents·2 pending applications·26 citations·filing 2014–2024
86Inventor score
Top patents by PatentIndex Score
14 records- 0186US9870808B2Memory device for performing calibration operationSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jan 16, 2018·8 cites·20 claims
- 0283US10078110B2Short circuit detecting device of stacked memory chips and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Sep 18, 2018·3 cites·20 claims
- 0379US10243584B2Memory device including parity error detection circuitSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Mar 26, 2019·4 cites·12 claims
- 0478US9959935B2Input-output circuit for supporting multiple-input shift register (MISR) function and memory device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 1, 2018·5 cites·15 claims
- 0571US10938416B2Memory device including parity error detection circuitSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 2, 2021·1 cites·6 claims
- 0670US9966126B2Delay circuit of a semiconductor memory device, a semiconductor memory device and a method of operating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 8, 2018·3 cites·20 claims
- 0760US12475933B2Memory module and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Nov 18, 2025·0 cites·20 claims
- 0859US10908212B2Semiconductor memory device including a shift registerSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 2, 2021·0 cites·19 claims
- 0958US10651156B2Memory package and memory device utilizing an intermediate chipSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 12, 2020·1 cites·20 claims
- 1057US9306569B2Compensation circuit for use with input buffer and method of operating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Apr 5, 2016·1 cites·17 claims
- 1154US10509070B2Short circuit detecting device of stacked memory chips and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 17, 2019·0 cites·15 claims
- 1248US9379693B2Self bias buffer circuit and memory device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jun 28, 2016·0 cites·20 claims
- 1336US2018026013A1Memory device including interposer and system-in-package including the sameYUN WON-JOO·Filed 2017·Application pending·0 cites
- 1434US2017345754A1Three-dimensional inductor structure and stacked semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →