Inventor · disambiguated record
I-Chih Chen
Also filed as: CHEN I-CHIH
37 granted patents·11 pending applications·67 citations·filing 2008–2025
96Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD40HON HAI PREC IND CO LTD4TAIWAN SEMICONDUCTOR MFG2VIA TECH INC2
Top patents by PatentIndex Score
48 records- 0195US12020933B2Trench etching process for photoresist line roughness improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 25, 2024·2 cites·20 claims
- 0293US11955484B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 9, 2024·2 cites·20 claims
- 0392US11527406B2Trench etching process for photoresist line roughness improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 13, 2022·3 cites·12 claims
- 0489US9812569B2Semiconductor device and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 7, 2017·6 cites·4 claims
- 0588US10090392B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 2, 2018·9 cites·19 claims
- 0686US12463035B2Trench etching process for photoresist line roughness improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Nov 4, 2025·0 cites·20 claims
- 0786US9728637B2Mechanism for forming semiconductor device with gateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 8, 2017·4 cites·20 claims
- 0885US9768221B2Pad structure layout for semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 19, 2017·8 cites·19 claims
- 0983US9252180B2Bonding pad on a back side illuminated image sensorTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 2, 2016·5 cites·20 claims
- 1083US2025072082A1Semiconductor device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1182US9281215B2Mechanism for forming gateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Mar 8, 2016·5 cites·13 claims
- 1282US2025311406A1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1381US2025366142A1Method of fabricating transistor having expanded gate structure, and transistor fabricated therebyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1480US11404413B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 2, 2022·2 cites·20 claims
- 1580US10680103B2Method of forming semiconductor device with gateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 9, 2020·2 cites·20 claims
- 1679US10096672B2Semiconductor device having barrier layer to prevent impurity diffusionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 9, 2018·2 cites·20 claims
- 1778US12389625B2Semiconductor device with gateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 12, 2025·0 cites·20 claims
- 1878US11011566B2Bonding pad on a back side illuminated image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 18, 2021·2 cites·20 claims
- 1978US10608094B2Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Mar 31, 2020·2 cites·20 claims
- 2077US12159921B2Semiconductor device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 3, 2024·0 cites·20 claims
- 2177US10056455B1Semiconductor device and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 21, 2018·2 cites·20 claims
- 2277US9728598B2Semiconductor device having barrier layer to prevent impurity diffusionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 8, 2017·2 cites·17 claims
- 2375US9659859B2Metal pad offset for multi-layer metal layoutTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 23, 2017·2 cites·20 claims
- 2474US9490345B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 8, 2016·3 cites·20 claims
- 2572US2025275217A1Method of fabricating transistor having expanded gate structure, and transistor fabricated therebyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2671US11437495B2Semiconductor device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 6, 2022·0 cites·20 claims
- 2769US11600727B2Method of forming semiconductor device with gateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 7, 2023·0 cites·20 claims
- 2869US9865731B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 9, 2018·2 cites·20 claims
- 2967US2025210513A1Semiconductor device having back end of line via to metal line margin improvement and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3066US2021273009A1Bonding Pad on a Back Side Illuminated Image SensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Application pending·0 cites
- 3165US9450093B2Semiconductor device structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 20, 2016·1 cites·20 claims
- 3264US12255134B2Method of back end of line via to metal line margin improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 18, 2025·0 cites·20 claims
- 3364US9093430B2Metal pad offset for multi-layer metal layoutTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 28, 2015·1 cites·21 claims
- 3461US10903336B2Semiconductor device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 26, 2021·0 cites·16 claims
- 3556US10516048B2Fabrication of semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 24, 2019·0 cites·20 claims
- 3655US11532728B2Method semiconductor device fabrication with improved epitaxial source/drain proximity controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 20, 2022·0 cites·20 claims
- 3754US11271111B2Source/drain structure with barrier in FinFET device and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 8, 2022·0 cites·20 claims
- 3853US11627390B2Encoding method, playing method and apparatus for image stabilization of panoramic video, and method for evaluating image stabilization algorithmVIA TECH INC·Filed 2019·Granted Apr 11, 2023·0 cites·13 claims
- 3951US11145760B2Structure having improved fin critical dimension controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 12, 2021·0 cites·20 claims
- 4051US10361287B2Method for manufacturing semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 23, 2019·0 cites·20 claims
- 4150US10804378B2Method for semiconductor device fabrication with improved epitaxial source/drain proximity controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 13, 2020·0 cites·20 claims
- 4249US2013278397A1Remote control method and system and mobile device of the systemHON HAI PREC IND CO LTD·Filed 2013·Application pending·0 cites
- 4348US11276638B2Back end of line via to metal line margin improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 15, 2022·0 cites·20 claims
- 4446US2009300700A1Replayable tv systemHON HAI PREC IND CO LTD·Filed 2008·Application pending·0 cites
- 4544US10153278B1Fin-type field effect transistor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 11, 2018·0 cites·20 claims
- 4643US2013276016A1Set top box and system parameter setting methodHON HAI PREC IND CO LTD·Filed 2013·Application pending·0 cites
- 4743US2010037259A1Epg server and epg processing methodHON HAI PREC IND CO LTD·Filed 2009·Application pending·0 cites
- 4836US2022164605A1System and Method for Adjusting Input Data of Neural NetworkVIA TECH INC·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →