Inventor · disambiguated record
I-Chia Lin
Also filed as: LIN I-CHIA
7 granted patents·95 citations·filing 2003–2019
84Inventor score
Top patents by PatentIndex Score
7 records- 0195US9269673B1Semiconductor device packagesADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Feb 23, 2016·43 cites·20 claims
- 0290US9871005B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Jan 16, 2018·8 cites·22 claims
- 0389US8704341B2Semiconductor packages with thermal dissipation structures and EMI shieldingLIN I-CHIA·Filed 2012·Granted Apr 22, 2014·25 cites·19 claims
- 0484US9153542B2Semiconductor package having an antenna and manufacturing method thereofLIN I-CHIA·Filed 2012·Granted Oct 6, 2015·14 cites·17 claims
- 0576US10431554B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Oct 1, 2019·2 cites·19 claims
- 0648US7036649B2Auto-bill-dispensing machineINT CURRENCY TECH·Filed 2003·Granted May 2, 2006·3 cites·7 claims
- 0745US11277917B2Embedded component package structure, embedded type panel substrate and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Mar 15, 2022·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →