Inventor · disambiguated record
I-Tai Liu
Also filed as: LIU I-TAI
4 granted patents·108 citations·filing 2006–2010
76Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0195US7719122B2System-in-package packaging for minimizing bond wire contamination and yield lossTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted May 18, 2010·72 cites·6 claims
- 0291US7659632B2Solder bump structure and method of manufacturing sameTAIWAN SEMINCONDUCTOR MFG CO L·Filed 2006·Granted Feb 9, 2010·30 cites·20 claims
- 0372US7679180B2Bond pad design to minimize dielectric crackingTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Mar 16, 2010·6 cites·14 claims
- 0439US8217520B2System-in-package packaging for minimizing bond wire contamination and yield lossTSAO PEI-HAW·Filed 2010·Granted Jul 10, 2012·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →