Inventor · disambiguated record
I-Hsuan Peng
Also filed as: PENG I-HSUAN
52 granted patents·17 pending applications·195 citations·filing 2004–2023
98Inventor score
Top patents by PatentIndex Score
69 records- 0198US11410936B2Semiconductor package structureMEDIATEK INC·Filed 2020·Granted Aug 9, 2022·7 cites·10 claims
- 0297US12183723B2Semiconductor package with dummy MIM capacitor dieMEDIATEK INC·Filed 2022·Granted Dec 31, 2024·3 cites·12 claims
- 0395US11854930B2Semiconductor chip package and fabrication method thereofMEDIATEK INC·Filed 2022·Granted Dec 26, 2023·2 cites·18 claims
- 0495US11222850B2Electronic package with rotated semiconductor dieMEDIATEK INC·Filed 2020·Granted Jan 11, 2022·4 cites·17 claims
- 0595US9786632B2Semiconductor package structure and method for forming the sameMEDIATEK INC·Filed 2016·Granted Oct 10, 2017·11 cites·32 claims
- 0694US11830820B2Electronic package with rotated semiconductor dieMEDIATEK INC·Filed 2021·Granted Nov 28, 2023·2 cites·14 claims
- 0794US9704836B2Semiconductor package assemblyMEDIATEK INC·Filed 2016·Granted Jul 11, 2017·11 cites·41 claims
- 0892US11948895B2Semiconductor package structureMEDIATEK INC·Filed 2022·Granted Apr 2, 2024·1 cites·9 claims
- 0991US11469152B2Semiconductor chip package and fabrication method thereofMEDIATEK INC·Filed 2020·Granted Oct 11, 2022·2 cites·18 claims
- 1091US10784211B2Semiconductor package structureMEDIATEK INC·Filed 2018·Granted Sep 22, 2020·5 cites·20 claims
- 1191US10483211B2Fan-out package structure and method for forming the sameMEDIATEK INC·Filed 2017·Granted Nov 19, 2019·8 cites·28 claims
- 1291US10217724B2Semiconductor package assembly with embedded IPDMEDIATEK INC·Filed 2016·Granted Feb 26, 2019·8 cites·25 claims
- 1391US10079192B2Semiconductor chip package assembly with improved heat dissipation performanceMEDIATEK INC·Filed 2016·Granted Sep 18, 2018·8 cites·15 claims
- 1491US10032756B2Semiconductor package assembly with facing active surfaces of first and second semiconductor die and method for forming the sameMEDIATEK INC·Filed 2016·Granted Jul 24, 2018·7 cites·22 claims
- 1589US11508707B2Semiconductor package with dummy MIM capacitor dieMEDIATEK INC·Filed 2020·Granted Nov 22, 2022·2 cites·20 claims
- 1689US10692789B2Stacked fan-out package structureMEDIATEK INC·Filed 2018·Granted Jun 23, 2020·5 cites·15 claims
- 1788US10424563B2Semiconductor package assembly and method for forming the sameMEDIATEK INC·Filed 2016·Granted Sep 24, 2019·5 cites·29 claims
- 1887US11646295B2Semiconductor package structure having an annular frame with truncated cornersMEDIATEK INC·Filed 2021·Granted May 9, 2023·1 cites·18 claims
- 1987US7411306B2Packaging structure and method of an image sensor moduleIND TECH RES INST·Filed 2005·Granted Aug 12, 2008·17 cites·11 claims
- 2086US11171113B2Semiconductor package structure having an annular frame with truncated cornersMEDIATEK INC·Filed 2019·Granted Nov 9, 2021·3 cites·17 claims
- 2185US11302592B2Semiconductor package having a stiffener ringMEDIATEK INC·Filed 2018·Granted Apr 12, 2022·4 cites·16 claims
- 2285US9711488B2Semiconductor package assemblyMEDIATEK INC·Filed 2016·Granted Jul 18, 2017·4 cites·23 claims
- 2384US9245773B2Semiconductor device packaging methods and structures thereofLIN JING-CHENG·Filed 2012·Granted Jan 26, 2016·6 cites·20 claims
- 2484US8791912B2Display system and methodCHEN YEN-WEN·Filed 2011·Granted Jul 29, 2014·12 cites·14 claims
- 2582US7091592B2Stacked package for electronic elements and packaging method thereofIND TECH RES INST·Filed 2004·Granted Aug 15, 2006·30 cites·18 claims
- 2681US7572676B2Packaging structure and method of an image sensor moduleIND TECH RES INST·Filed 2007·Granted Aug 11, 2009·10 cites·12 claims
- 2780US11728292B2Semiconductor package assembly having a conductive electromagnetic shield layerMEDIATEK INC·Filed 2020·Granted Aug 15, 2023·1 cites·18 claims
- 2880US11264337B2Semiconductor package structureMEDIATEK INC·Filed 2019·Granted Mar 1, 2022·2 cites·18 claims
- 2979US12388026B2Electronic package with rotated semiconductor dieMEDIATEK INC·Filed 2023·Granted Aug 12, 2025·0 cites·16 claims
- 3079US12142598B2Semiconductor package structure having an annular frame with truncated cornersMEDIATEK INC·Filed 2023·Granted Nov 12, 2024·0 cites·20 claims
- 3179US9978729B2Semiconductor package assemblyMEDIATEK INC·Filed 2015·Granted May 22, 2018·3 cites·30 claims
- 3278US10497689B2Semiconductor package assembly and method for forming the sameMEDIATEK INC·Filed 2018·Granted Dec 3, 2019·2 cites·20 claims
- 3377US10177125B2Semiconductor package assemblyMEDIATEK INC·Filed 2017·Granted Jan 8, 2019·2 cites·20 claims
- 3475US9859181B2Underfill dispensing in 3D IC using metrologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 2, 2018·2 cites·20 claims
- 3571US11862578B2Semiconductor package structureMEDIATEK INC·Filed 2022·Granted Jan 2, 2024·0 cites·17 claims
- 3671US10957611B2Semiconductor package including lid structure with opening and recessMEDIATEK INC·Filed 2018·Granted Mar 23, 2021·1 cites·24 claims
- 3771US10256210B2Semiconductor package structure and method for forming the sameMEDIATEK INC·Filed 2017·Granted Apr 9, 2019·1 cites·22 claims
- 3869US10199318B2Semiconductor package assemblyMEDIATEK INC·Filed 2017·Granted Feb 5, 2019·1 cites·28 claims
- 3968US11728232B2Semiconductor package having a stiffener ringMEDIA TEK INC·Filed 2022·Granted Aug 15, 2023·0 cites·20 claims
- 4068US10410969B2Semiconductor package assemblyMEDIATEK INC·Filed 2018·Granted Sep 10, 2019·1 cites·26 claims
- 4165US11688655B2Semiconductor package including lid structure with opening and recessMEDIATEK INC·Filed 2021·Granted Jun 27, 2023·0 cites·19 claims
- 4265US9941260B2Fan-out package structure having embedded package substrateMEDIATEK INC·Filed 2016·Granted Apr 10, 2018·1 cites·26 claims
- 4361US12444715B2Semiconductor package structureMEDIATEK INC·Filed 2023·Granted Oct 14, 2025·0 cites·14 claims
- 4459US10903198B2Semiconductor package assembly and method for forming the sameMEDIATEK INC·Filed 2019·Granted Jan 26, 2021·0 cites·20 claims
- 4558US11670596B2Semiconductor package structureMEDIATEK INC·Filed 2021·Granted Jun 6, 2023·0 cites·20 claims
- 4657US10468341B2Semiconductor package assemblyMEDIATEK INC·Filed 2018·Granted Nov 5, 2019·0 cites·28 claims
- 4755US11830851B2Semiconductor package structureMEDIATEK INC·Filed 2021·Granted Nov 28, 2023·0 cites·14 claims
- 4855US2025210568A1Redistribution layer structure for high-density semiconductor package assemblyMEDIATEK INC·Filed 2023·Application pending·0 cites
- 4953US9997498B2Semiconductor package assemblyMEDIATEK INC·Filed 2017·Granted Jun 12, 2018·0 cites·21 claims
- 5053US2019252351A1Semiconductor package structure having an antenna pattern electrically coupled to a first redistribution layer (rdl)MEDIATEK INC·Filed 2019·Application pending·0 cites
Showing the top 50 of 69 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →