Inventor · disambiguated record
I-Chung Tung
Also filed as: TUNG I-CHUNG
6 granted patents·4 pending applications·88 citations·filing 1994–2006
84Inventor score
Files withPHOENIX PREC TECHNOLOGY CORP6
Top patents by PatentIndex Score
10 records- 0169US6475327B2Attachment of a stiff heat spreader for fabricating a cavity down plastic chip carrierPHOENIX PREC TECHNOLOGY CORP·Filed 2001·Granted Nov 5, 2002·22 cites·40 claims
- 0265US7098126B2Formation of electroplate solder on an organic circuit board for flip chip joints and board to board solder jointsPHOENIX PREC TECHNOLOGY CORP·Filed 2001·Granted Aug 29, 2006·16 cites·10 claims
- 0362US6910264B2Method for making a multilayer circuit board having embedded passive componentsPHOENIX PREC TECHNOLOGY CORP·Filed 2003·Granted Jun 28, 2005·10 cites·22 claims
- 0462US6574863B2Thin core substrate for fabricating a build-up circuit boardPHOENIX PREC TECHNOLOGY CORP·Filed 2001·Granted Jun 10, 2003·10 cites·10 claims
- 0554US6543676B2Pin attachment by a surface mounting method for fabricating organic pin grid array packagesPHOENIX PREC TECHNOLOGY CORP·Filed 2001·Granted Apr 8, 2003·5 cites·10 claims
- 0652US5468429AUltrasound-enhanced devolatilization of thermoplastic plasticsFiled 1994·Granted Nov 21, 1995·25 cites·3 claims
- 0744US2006201997A1Fine pad pitch organic circuit board with plating solder and method for fabricating the samePHOENIX PREC TECHNOLOGY CORP·Filed 2006·Application pending·0 cites
- 0835US2004084206A1Fine pad pitch organic circuit board for flip chip joints and board to board solder joints and methodFiled 2002·Application pending·0 cites
- 0934US2002182374A1Lamination method of embedding passive components in an organic circuit boardFiled 2002·Application pending·0 cites
- 1034US2002124955A1Attachment of a heat spreader for fabricating a cavity down plastic chip carrierFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →