Inventor · disambiguated record
Ian J. Brown
Also filed as: BROWN IAN · BROWN IAN J · BROWN IAN S
28 granted patents·10 pending applications·335 citations·filing 1984–2019
96Inventor score
Files withTOKYO ELECTRON LTD24BROWN IAN J5AVERY DENNISON CORP3OXFORD MAGNET TECH2OXFORD MEDICAL LTD1
Top patents by PatentIndex Score
38 records- 0196US7795148B2Method for removing damaged dielectric materialTOKYO ELECTRON LTD·Filed 2006·Granted Sep 14, 2010·47 cites·25 claims
- 0294US8795952B2Line pattern collapse mitigation through gap-fill material applicationSOMERVELL MARK H·Filed 2011·Granted Aug 5, 2014·13 cites·20 claims
- 0390US6820016B2Leak detection apparatus and methodPALMER ENVIRONMENTAL LTD·Filed 2001·Granted Nov 16, 2004·58 cites·17 claims
- 0490US4587504AMagnet assembly for use in NMR apparatusOXFORD MAGNET TECH·Filed 1984·Granted May 6, 1986·55 cites·10 claims
- 0589US9454081B2Line pattern collapse mitigation through gap-fill material applicationTOKYO ELECTRON LTD·Filed 2014·Granted Sep 27, 2016·4 cites·20 claims
- 0686US9735026B2Controlling cleaning of a layer on a substrate using nozzlesTOKYO ELECTRON LTD·Filed 2013·Granted Aug 15, 2017·7 cites·20 claims
- 0785US7723237B2Method for selective removal of damaged multi-stack bilayer filmsTOKYO ELECTRON LTD·Filed 2006·Granted May 25, 2010·12 cites·21 claims
- 0881US8083862B2Method and system for monitoring contamination on a substrateBROWN IAN J·Filed 2007·Granted Dec 27, 2011·8 cites·16 claims
- 0979US7288483B1Method and system for patterning a dielectric filmTOKYO ELECTRON LTD·Filed 2006·Granted Oct 30, 2007·6 cites·22 claims
- 1076US5492950APressure-sensitive adhesives based on emulsion polymersAVERY DENNISON CORP·Filed 1993·Granted Feb 20, 1996·33 cites·18 claims
- 1173US9513556B2Method and system of process chemical temperature control using an injection nozzleTOKYO ELECTRON LTD·Filed 2013·Granted Dec 6, 2016·2 cites·20 claims
- 1272US6586510B1Removable emulsion pressure-sensitive adhesivesAVERY DENNISON CORP·Filed 1999·Granted Jul 1, 2003·35 cites·34 claims
- 1370US10490402B2UV-assisted stripping of hardened photoresist to create chemical templates for directed self-assemblyTOKYO ELECTRON LTD·Filed 2014·Granted Nov 26, 2019·2 cites·22 claims
- 1469US9852920B2Etch system and method for single substrate processingTOKYO ELECTRON LTD·Filed 2016·Granted Dec 26, 2017·1 cites·20 claims
- 1569US9257292B2Etch system and method for single substrate processingBROWN IAN J·Filed 2011·Granted Feb 9, 2016·2 cites·30 claims
- 1660US11538684B2UV-assisted stripping of hardened photoresist to create chemical templates for directed self-assemblyTOKYO ELECTRON LTD·Filed 2019·Granted Dec 27, 2022·0 cites·14 claims
- 1760USRE36782EMagnet assembly for use in NMR apparatusOXFORD MEDICAL LTD·Filed 1996·Granted Jul 18, 2000·23 cites·12 claims
- 1855US6547887B1Multilayer pressure-sensitive adhesive label constructionsAVERY DENNISON CORP·Filed 1999·Granted Apr 15, 2003·20 cites·45 claims
- 1955US2016363868A1Line pattern collapse mitigation through gap-fill material applicationTOKYO ELECTRON LTD·Filed 2016·Application pending·0 cites
- 2049US10828680B2System and method for enhanced removal of metal hardmask using ultra violet treatmentTOKYO ELECTRON LTD·Filed 2014·Granted Nov 10, 2020·0 cites·20 claims
- 2149US10347503B2Method and hardware for enhanced removal of post etch polymer and hardmask removalTOKYO ELECTRON LTD·Filed 2014·Granted Jul 9, 2019·0 cites·20 claims
- 2246US2013319465A1Method and system for rapid mixing of process chemicals using an injection nozzleTOKYO ELECTRON LTD·Filed 2012·Application pending·0 cites
- 2346US2015136186A1System for processing substrates with two or more ultraviolet light sources that provide different wavelengths of lightTOKYO ELECTRON LTD·Filed 2014·Application pending·0 cites
- 2444US10490399B2Systems and methodologies for vapor phase hydroxyl radical processing of substratesTOKYO ELECTRON LTD·Filed 2017·Granted Nov 26, 2019·0 cites·15 claims
- 2544US10249509B2Substrate cleaning method and system using atmospheric pressure atomic oxygenTOKYO ELECTRON LTD·Filed 2013·Granted Apr 2, 2019·0 cites·20 claims
- 2644US2007136426A1Process of Decentralized Distribution of E-mail MessagesSMITH MATTHEW T·Filed 2005·Application pending·0 cites
- 2743US9966280B2Process gas generation for cleaning of substratesTOKYO ELECTRON LTD·Filed 2013·Granted May 8, 2018·0 cites·33 claims
- 2843US2017301567A9System of controlling treatment liquid dispense for spinning substratesTOKYO ELECTRON LTD·Filed 2013·Application pending·0 cites
- 2942US9327322B2Sonic energy to generate active species for surface preparation, cleaning, and etchingTOKYO ELECTRON LTD·Filed 2012·Granted May 3, 2016·0 cites·26 claims
- 3042US4584549AMagnet systemOXFORD MAGNET TECH·Filed 1984·Granted Apr 22, 1986·7 cites·8 claims
- 3141US9875916B2Method of stripping photoresist on a single substrate systemTOKYO ELECTRON LTD·Filed 2012·Granted Jan 23, 2018·0 cites·23 claims
- 3239US8940103B2Sequential stage mixing for single substrate strip processingBROWN IAN J·Filed 2012·Granted Jan 27, 2015·0 cites·13 claims
- 3338US9075318B2Sequential stage mixing for a resist batch strip processBROWN IAN J·Filed 2012·Granted Jul 7, 2015·0 cites·25 claims
- 3438US2017278695A1Polymer removal using chromophores and light exposureTOKYO ELECTRON LTD·Filed 2017·Application pending·0 cites
- 3537US2017345665A1Atomic layer etching systems and methodsTOKYO ELECTRON LTD·Filed 2017·Application pending·0 cites
- 3636US2017092484A1Method and apparatus for drying semiconductor substrates using liquid carbon dioxideTOKYO ELECTRON LTD·Filed 2016·Application pending·0 cites
- 3736US2016358786A1Techniques for Spin-on-Carbon PlanarizationTOKYO ELECTRON LTD·Filed 2016·Application pending·0 cites
- 3836US2012248061A1Increasing masking layer etch rate and selectivityBROWN IAN J·Filed 2011·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Ian J. Brown files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →