Inventor · disambiguated record
Igor J. Malik
Also filed as: MALIK IGOR · MALIK IGOR J · MALIK IGOR JAN
19 granted patents·5 pending applications·1,177 citations·filing 1996–2010
97Inventor score
Top patents by PatentIndex Score
24 records- 0197US6448152B1Method and system for generating a plurality of donor wafers and handle wafers prior to an order being placed by a customerSILICON GENESIS CORP·Filed 2001·Granted Sep 10, 2002·149 cites·29 claims
- 0296US6969668B1Treatment method of film quality for the manufacture of substratesSILICON GENESIS CORP·Filed 2000·Granted Nov 29, 2005·104 cites·23 claims
- 0395US7094666B2Method and system for fabricating strained layers for the manufacture of integrated circuitsSILICON GENESIS CORP·Filed 2005·Granted Aug 22, 2006·34 cites·32 claims
- 0494US6881644B2Smoothing method for cleaved films made using a release layerSILICON GENESIS CORP·Filed 2002·Granted Apr 19, 2005·84 cites·34 claims
- 0594US6287941B1Surface finishing of SOI substrates using an EPI processSILICON GENESIS CORP·Filed 1999·Granted Sep 11, 2001·142 cites·13 claims
- 0694US6171965B1Treatment method of cleaved film for the manufacture of substratesSILICON GENESIS CORP·Filed 1999·Granted Jan 9, 2001·136 cites·20 claims
- 0793US7391047B2System for forming a strained layer of semiconductor materialSILICON GENESIS CORP·Filed 2006·Granted Jun 24, 2008·19 cites·1 claims
- 0892US6455399B2Smoothing method for cleaved films made using thermal treatmentSILICON GENESIS CORP·Filed 2001·Granted Sep 24, 2002·59 cites·17 claims
- 0991US7390724B2Method and system for lattice space engineeringSILICON GENESIS CORP·Filed 2005·Granted Jun 24, 2008·24 cites·38 claims
- 1089US7598153B2Method and structure for fabricating bonded substrate structures using thermal processing to remove oxygen speciesSILICON GENESIS CORP·Filed 2006·Granted Oct 6, 2009·26 cites·48 claims
- 1189US6265328B1Wafer edge engineering method and deviceSILICON GENESIS CORP·Filed 1999·Granted Jul 24, 2001·124 cites·17 claims
- 1288US7595499B2Method and system for fabricating strained layers for the manufacture of integrated circuitsSILICON GENESIS CORP·Filed 2008·Granted Sep 29, 2009·11 cites·14 claims
- 1384US6221774B1Method for surface treatment of substratesSILICON GENESIS CORP·Filed 1999·Granted Apr 24, 2001·71 cites·33 claims
- 1484US6204151B1Smoothing method for cleaved films made using thermal treatmentSILICON GENESIS CORP·Filed 1999·Granted Mar 20, 2001·65 cites·20 claims
- 1581US7147709B1Non-contact etch annealing of strained layersSILICON GENESIS CORP·Filed 2003·Granted Dec 12, 2006·25 cites·15 claims
- 1679US6274059B1Method to remove metals in a scrubberLAM RES CORP·Filed 1996·Granted Aug 14, 2001·55 cites·19 claims
- 1770US5919311AControl of SiO2 etch rate using dilute chemical etchants in the presence of a megasonic fieldMEMC ELECTRONIC MATERIALS·Filed 1996·Granted Jul 6, 1999·38 cites·30 claims
- 1858US7253081B2Surface finishing of SOI substrates using an EPI processSILICON GENESIS CORP·Filed 2001·Granted Aug 7, 2007·6 cites·17 claims
- 1951US8187377B2Non-contact etch annealing of strained layersMALIK IGOR J·Filed 2002·Granted May 29, 2012·5 cites·20 claims
- 2051US2007051299A1Non-contact etch annealing of strained layersSILICON GENESIS CORP·Filed 2006·Application pending·0 cites
- 2151US2007259526A1Surface finishing of SOI substrates using an EPI processSILICON GENESIS CORP·Filed 2007·Application pending·0 cites
- 2250US2010282292A1Structure and method for electrical interconnects for solar systemsMALIK IGOR JAN·Filed 2010·Application pending·0 cites
- 2339US2005247668A1Method for smoothing a film of material using a ring structureSILICON GENESIS CORP·Filed 2004·Application pending·0 cites
- 2437US2002173872A1Computer memory product for substrate surface treatment applicationsSILICON GENESIS·Filed 2002·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Igor J. Malik files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →