Inventor · disambiguated record
Ii Kwon Shim
Also filed as: SHIM II KWON · SHIM IL KWON
5 granted patents·81 citations·filing 2006–2014
80Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0197US8004095B2Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layerSTATS CHIPPAC LTD·Filed 2010·Granted Aug 23, 2011·50 cites·25 claims
- 0291US9449943B2Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper patternSTATS CHIPPAC LTD·Filed 2014·Granted Sep 20, 2016·10 cites·23 claims
- 0385US8704349B2Integrated circuit package system with exposed interconnectsCHOW SENG GUAN·Filed 2006·Granted Apr 22, 2014·14 cites·8 claims
- 0477US7986032B2Semiconductor package system with substrate having different bondable heights at lead finger tipsSTATS CHIPPAC LTD·Filed 2009·Granted Jul 26, 2011·7 cites·18 claims
- 0552US8067272B2Integrated circuit package system for package stacking and manufacturing method thereofKIM YOUNG CHEOL·Filed 2009·Granted Nov 29, 2011·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →