Inventor · disambiguated record
Isao Sugaya
Also filed as: SUGAYA ISAO
36 granted patents·17 pending applications·193 citations·filing 1996–2025
97Inventor score
Top patents by PatentIndex Score
53 records- 0194US9919508B2Substrate aligning apparatus, substrate bonding apparatus, substrate aligning method and substrate bonding methodNIKON CORP·Filed 2015·Granted Mar 20, 2018·10 cites·25 claims
- 0291US11842905B2Stacked substrate manufacturing method, stacked substrate manufacturing apparatus, stacked substrate manufacturing system, and substrate processing apparatusNIKON CORP·Filed 2019·Granted Dec 12, 2023·6 cites·34 claims
- 0391US11004686B2Bonding method, bonding device, and holding memberNIKON CORP·Filed 2019·Granted May 11, 2021·7 cites·18 claims
- 0488US10483212B2Apparatus for stacking substrates and method for the sameNIKON CORP·Filed 2017·Granted Nov 19, 2019·4 cites·24 claims
- 0587US9539800B2Substrate bonding apparatus, substrate holding apparatus, substrate bonding method, substrate holding method, multilayered semiconductor device, and multilayered substrateNIKON CORP·Filed 2013·Granted Jan 10, 2017·9 cites·27 claims
- 0686US10026768B2Detector, detector with lock-in amplifier, substrate, and method for manufacturing a detectorNIKON CORP·Filed 2016·Granted Jul 17, 2018·5 cites·23 claims
- 0784US5870634AImage blur suppression device utilizing a vibration motorNIKON CORP·Filed 1996·Granted Feb 9, 1999·21 cites·28 claims
- 0883US2024413093A1Apparatus for stacking substrates and method for the sameNIKON CORP·Filed 2024·Application pending·0 cites
- 0982US11211338B2Apparatus for stacking substrates and method for the sameNIKON CORP·Filed 2019·Granted Dec 28, 2021·2 cites·29 claims
- 1082US5872417AMultiple degrees of freedom vibration actuatorNIKON CORP·Filed 1996·Granted Feb 16, 1999·40 cites·36 claims
- 1181US10182190B2Light detecting apparatus, image capturing apparatus and image sensorNIKON CORP·Filed 2017·Granted Jan 15, 2019·3 cites·18 claims
- 1277US2024387177A1Bonding method, bonding device, and holding memberNIKON CORP·Filed 2024·Application pending·0 cites
- 1375US12100667B2Apparatus for stacking substrates and method for the sameNIKON CORP·Filed 2021·Granted Sep 24, 2024·0 cites·18 claims
- 1475US10825707B2Stacking apparatus and stacking methodNIKON CORP·Filed 2018·Granted Nov 3, 2020·1 cites·26 claims
- 1574US2024404987A1Method and device for manufacturing stacked substrateNIKON CORP·Filed 2024·Application pending·0 cites
- 1671US8436465B2Semiconductor device and method for manufacturing the semiconductor deviceSUGAYA ISAO·Filed 2008·Granted May 7, 2013·4 cites·13 claims
- 1771US8436680B2Multi-layered semiconductor apparatusSUGAYA ISAO·Filed 2012·Granted May 7, 2013·2 cites·103 claims
- 1871US2024021447A1Stacked substrate manufacturing method, stacked substrate manufacturing apparatus, stacked substrate manufacturing system, and substrate processing apparatusNIKON CORP·Filed 2023·Application pending·0 cites
- 1969US12080554B2Bonding method, bonding device, and holding memberNIKON CORP·Filed 2021·Granted Sep 3, 2024·0 cites·39 claims
- 2069US8856722B2System for semiconductor device, method for manufacturing semiconductor device, semiconductor device and method for bonding substratesNIKON CORP·Filed 2013·Granted Oct 7, 2014·2 cites·23 claims
- 2166US11823935B2Stacking apparatus and stacking methodNIKON CORP·Filed 2020·Granted Nov 21, 2023·0 cites·32 claims
- 2265US2025355377A1Substrate processing system, computation apparatus, exposure apparatus, computation method, exposure method, and method for manufacturing electronic deviceNIKON CORP·Filed 2025·Application pending·0 cites
- 2364US11791223B2Substrate bonding apparatus and substrate bonding methodNIKON CORP·Filed 2018·Granted Oct 17, 2023·1 cites·25 claims
- 2464US9159640B2Semiconductor device and method for manufacturing the semiconductor deviceNIKON CORP·Filed 2013·Granted Oct 13, 2015·1 cites·20 claims
- 2564US2024014079A1Substrate bonding apparatus and substrate bonding methodNIKON CORP·Filed 2023·Application pending·0 cites
- 2660US12107068B2Method and device for manufacturing stacked substrateNIKON CORP·Filed 2020·Granted Oct 1, 2024·0 cites·25 claims
- 2760US6611081B1Vibration actuator with two vibration modesNIKON CORP·Filed 2000·Granted Aug 26, 2003·7 cites·28 claims
- 2859US5723935AVibration driven motorNIKON CORP·Filed 1996·Granted Mar 3, 1998·18 cites·20 claims
- 2958US11362059B2Manufacturing method and manufacturing apparatus for stacked substrate, and programNIKON CORP·Filed 2020·Granted Jun 14, 2022·0 cites·8 claims
- 3058US2020335472A1Substrate Bonding Apparatus and Substrate Bonding MethodNIKON CORP·Filed 2020·Application pending·0 cites
- 3157US5831370AVibration actuatorNIKON CORP·Filed 1996·Granted Nov 3, 1998·17 cites·18 claims
- 3256US7189155B2Polishing body, polishing apparatus, semiconductor device, and semiconductor device manufacturing methodNIKON CORP·Filed 2004·Granted Mar 13, 2007·5 cites·11 claims
- 3354US12506111B2Alignment method and alignment apparatusNIKON CORP·Filed 2020·Granted Dec 23, 2025·0 cites·18 claims
- 3454US12165902B2Substrate bonding apparatus and substrate bonding methodNIKON CORP·Filed 2021·Granted Dec 10, 2024·0 cites·16 claims
- 3553US5854529AVibration actuatorNIKON CORP·Filed 1996·Granted Dec 29, 1998·15 cites·17 claims
- 3653US2020091015A1Substrate bonding method, multilayer substrate manufacturing method, multilayer substrate manufacturing apparatus, and multilayer substrate manufacturing systemNIKON CORP·Filed 2019·Application pending·0 cites
- 3752US2015083786A1Substrate Bonding Apparatus and Substrate Bonding MethodNIKON CORP·Filed 2014·Application pending·0 cites
- 3852US2013271211A1Multi-layered semiconductor apparatusNIKON CORP·Filed 2013·Application pending·0 cites
- 3951US8878358B2Semiconductor deviceSUGAYA ISAO·Filed 2012·Granted Nov 4, 2014·0 cites·28 claims
- 4051US8183686B2Semiconductor deviceSUGAYA ISAO·Filed 2008·Granted May 22, 2012·0 cites·10 claims
- 4149US10424557B2Substrate bonding apparatus and substrate bonding methodNIKON CORP·Filed 2018·Granted Sep 24, 2019·0 cites·16 claims
- 4249US8299848B2Multi-layered semiconductor apparatusSUGAYA ISAO·Filed 2010·Granted Oct 30, 2012·0 cites·69 claims
- 4347US8370789B2System for semiconductor device, method for manufacturing semiconductor device, semiconductor device and method for bonding substratesNIKON CORP·Filed 2010·Granted Feb 5, 2013·0 cites·31 claims
- 4443US2014345805A1Substrate holder and substrate bonding apparatusNIKON CORP·Filed 2014·Application pending·0 cites
- 4542US5763981AVibration actuatorNIKON CORP·Filed 1996·Granted Jun 9, 1998·9 cites·14 claims
- 4641US2019027462A1Substrate bonding apparatus and substrate bonding methodNIKON CORP·Filed 2018·Application pending·0 cites
- 4739US9054140B2Substrate holder system, substrate holder, fastening mechanism, substrate bonding apparatus and method for manufacturing devicesSUGAYA ISAO·Filed 2012·Granted Jun 9, 2015·0 cites·30 claims
- 4838US2005000943A1Processing apparatus, method for fabrication of semiconductor device by using the processing apparatus, and semiconductor device fabricated by this methodNIKON CORP·Filed 2004·Application pending·0 cites
- 4936US2002013122A1Process and apparatus for chemimechanically polishing a substrateNIKON CORP·Filed 2001·Application pending·0 cites
- 5035US2012214290A1Substrate holder, pair of substrate holders, substrate bonding apparatus and method for manufacturing devicesSUGAYA ISAO·Filed 2012·Application pending·0 cites
Showing the top 50 of 53 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →