Inventor · disambiguated record
Issei Yamamoto
Also filed as: YAMAMOTO ISSEI
36 granted patents·4 pending applications·110 citations·filing 2008–2024
95Inventor score
Top patents by PatentIndex Score
40 records- 0197US10256195B2Module and method for manufacturing sameMURATA MANUFACTURING CO·Filed 2017·Granted Apr 9, 2019·57 cites·13 claims
- 0294US8426889B2ESD protection device and method for manufacturing the sameADACHI JUN·Filed 2011·Granted Apr 23, 2013·18 cites·11 claims
- 0393US10455748B2High-frequency moduleMURATA MANUFACTURING CO·Filed 2017·Granted Oct 22, 2019·6 cites·7 claims
- 0490US11510311B2Electronic component module and method for manufacturing electronic component moduleMURATA MANUFACTURING CO·Filed 2021·Granted Nov 22, 2022·2 cites·20 claims
- 0584US11658405B2Antenna-attached substrate and antenna moduleMURATA MANUFACTURING CO·Filed 2020·Granted May 23, 2023·2 cites·20 claims
- 0682US11322830B2Substrate equipped with antenna and antenna moduleMURATA MANUFACTURING CO·Filed 2020·Granted May 3, 2022·2 cites·20 claims
- 0780US10772244B2High-frequency moduleMURATA MANUFACTURING CO·Filed 2017·Granted Sep 8, 2020·3 cites·17 claims
- 0880US10600560B2Electronic component including outer electrodes and a shield electrodeMURATA MANUFACTURING CO·Filed 2016·Granted Mar 24, 2020·3 cites·20 claims
- 0979US11349449B2Laminated electronic component and method for manufacturing laminated electronic componentMURATA MANUFACTURING CO·Filed 2021·Granted May 31, 2022·2 cites·16 claims
- 1079US9681593B2ESD protection device and method for manufacturing the sameMURATA MANUFACTURING CO·Filed 2015·Granted Jun 13, 2017·1 cites·5 claims
- 1176US12389539B2Wiring board and moduleMURATA MANUFACTURING CO·Filed 2023·Granted Aug 12, 2025·0 cites·20 claims
- 1275US11051398B2Ceramic electronic componentMURATA MANUFACTURING CO·Filed 2019·Granted Jun 29, 2021·1 cites·16 claims
- 1375US9674970B2Module board and manufacturing method thereofMURATA MANUFACTURING CO·Filed 2012·Granted Jun 6, 2017·4 cites·19 claims
- 1470US10660227B2Electronic module and method of manufacturing electronic moduleMURATA MANUFACTURING CO·Filed 2019·Granted May 19, 2020·1 cites·16 claims
- 1566US8779466B2ESD protection device and method for manufacturing the sameMURATA MANUFACTURING CO·Filed 2013·Granted Jul 15, 2014·1 cites·21 claims
- 1666US8428669B2Portable terminal deviceYAMAMOTO ISSEI·Filed 2009·Granted Apr 23, 2013·4 cites·7 claims
- 1764US2025087568A1Multilayer substrateMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 1862US10770223B2High frequency componentMURATA MANUFACTURING CO·Filed 2018·Granted Sep 8, 2020·0 cites·19 claims
- 1961US10193333B2ESD protection deviceMURATA MANUFACTURING CO·Filed 2017·Granted Jan 29, 2019·0 cites·7 claims
- 2061US2025089160A1Multilayer substrateMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 2160US9781828B2Module substrate and method for manufacturing module substrateMURATA MANUFACTURING CO·Filed 2013·Granted Oct 3, 2017·1 cites·10 claims
- 2258US9192051B2Module substrate, module-substrate manufacturing method, and terminal connection substrateYAMAMOTO ISSEI·Filed 2012·Granted Nov 17, 2015·1 cites·5 claims
- 2357US8975099B2ESD protection device and method for manufacturing the sameMURATA MANUFACTURING CO·Filed 2014·Granted Mar 10, 2015·0 cites·10 claims
- 2456US7736830B2Method for forming circuit patternMURATA MANUFACTURING CO·Filed 2008·Granted Jun 15, 2010·1 cites·12 claims
- 2555US11152157B2Stacked electronic component and method for manufacturing stacked electronic componentMURATA MANUFACTURING CO·Filed 2019·Granted Oct 19, 2021·0 cites·15 claims
- 2653US11140778B2Multilayer ceramic substrate and method of manufacturing multilayer ceramic substrateMURATA MANUFACTURING CO·Filed 2020·Granted Oct 5, 2021·0 cites·9 claims
- 2752US12342465B2Wiring boardMURATA MANUFACTURING CO·Filed 2023·Granted Jun 24, 2025·0 cites·20 claims
- 2852US11605873B2Substrate with antenna, and antenna moduleMURATA MANUFACTURING CO·Filed 2020·Granted Mar 14, 2023·0 cites·18 claims
- 2949US11659659B2Ceramic electronic componentMURATA MANUFACTURING CO·Filed 2021·Granted May 23, 2023·0 cites·9 claims
- 3048US2023113966A1Electronic component and method for manufacturing electronic componentMURATA MANUFACTURING CO·Filed 2022·Application pending·0 cites
- 3147US11196177B2Antenna-mounted substrate and antenna moduleMURATA MANUFACTURING CO·Filed 2020·Granted Dec 7, 2021·0 cites·11 claims
- 3247US11121054B2ModuleMURATA MANUFACTURING CO·Filed 2019·Granted Sep 14, 2021·0 cites·11 claims
- 3346US11212906B2Laminated substrateMURATA MANUFACTURING CO·Filed 2020·Granted Dec 28, 2021·0 cites·20 claims
- 3445US10872853B2ModuleMURATA MANUFACTURING CO·Filed 2018·Granted Dec 22, 2020·0 cites·15 claims
- 3544US8437114B2ESD Protection DeviceYAMAMOTO ISSEI·Filed 2011·Granted May 7, 2013·0 cites·3 claims
- 3644US2019166690A1Ceramic electronic componentMURATA MANUFACTURING CO·Filed 2019·Application pending·0 cites
- 3743US11923284B2Wiring substrate and electronic moduleMURATA MANUFACTURING CO·Filed 2019·Granted Mar 5, 2024·0 cites·11 claims
- 3842US10546820B2Radio frequency module and method for manufacturing the sameMURATA MANUFACTURING CO·Filed 2017·Granted Jan 28, 2020·0 cites·19 claims
- 3941US10861683B2Vacuum deviceMURATA MANUFACTURING CO·Filed 2017·Granted Dec 8, 2020·0 cites·8 claims
- 4041US10349512B2High-frequency moduleMURATA MANUFACTURING CO·Filed 2017·Granted Jul 9, 2019·0 cites·12 claims
Join the waitlist — get patent alerts
Get an alert when Issei Yamamoto files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →