Inventor · disambiguated record
Itsuhiro Hatanaka
Also filed as: HATANAKA ITSUHIRO
9 granted patents·23 pending applications·14 citations·filing 2005–2022
81Inventor score
Top patents by PatentIndex Score
32 records- 0182US11319462B2Pressure sensitive adhesive sheet, method for manufacturing thereof, and pressure sensitive adhesive filmNITTO DENKO CORP·Filed 2019·Granted May 3, 2022·1 cites·8 claims
- 0281US9150716B2Resin foam and foam sealing materialSAITOU MAKOTO·Filed 2011·Granted Oct 6, 2015·4 cites·9 claims
- 0378US9156959B2Polyester elastomer foam and foam materialKATO KAZUMICHI·Filed 2012·Granted Oct 13, 2015·4 cites·10 claims
- 0472US8501310B2Foam waterproofing material with a micro cell structureFUJII HIROKI·Filed 2009·Granted Aug 6, 2013·1 cites·15 claims
- 0569US11319470B2Pressure sensitive adhesive, curable pressure sensitive adhesive composition, pressure sensitive adhesive sheet and method for manufacturing thereofNITTO DENKO CORP·Filed 2019·Granted May 3, 2022·0 cites·11 claims
- 0668US9522985B2Polyester elastomer foamKODAMA KIYOAKI·Filed 2012·Granted Dec 20, 2016·2 cites·12 claims
- 0765US8846774B2Resin composition for polyolefin resin foam, polyolefin resin foam and foamed sealing materialJINTOKU NAOMI·Filed 2012·Granted Sep 30, 2014·2 cites·10 claims
- 0864US12098311B2Hot-melt pressure-sensitive adhesive composition and hot-melt pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2021·Granted Sep 24, 2024·0 cites·8 claims
- 0963US12371598B2Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2022·Granted Jul 29, 2025·0 cites·19 claims
- 1062US2014011902A1Foam waterproofing material with a micro cell structureNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 1159US2024093060A1Hot-melt pressure-sensitive adhesive composition and pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2022·Application pending·0 cites
- 1254US2015118481A1Resin foam and foam materialNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 1354US2010233457A1Foam dustproofing material with a micro cell structureNITTO DENIKO CORP·Filed 2008·Application pending·0 cites
- 1449US2015218422A1Resin foam and foam materialNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 1549US2013309483A1Foam laminated body for electrical or electronic equipmentWATANABE NAOMI·Filed 2012·Application pending·0 cites
- 1648US2014242371A1Resin foam sheet and resin foam composite materialHATANAKA ITSUHIRO·Filed 2012·Application pending·0 cites
- 1747US2015174865A1Repeelable foam laminate for electronic device, and electric or electronic devicesin foam and foam materialNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 1847US2013017391A1Resin foam and foam sealing materialNITTO DENKO CORP·Filed 2012·Application pending·0 cites
- 1946US2005277354A1Laminate sheet, method of producing back substrate for plasma display panel, back substrate for plasma display panel, and plasma display panelBUZOUJIMA YASUSHI·Filed 2005·Application pending·0 cites
- 2046US2005159070A1Laminate sheet, method of producing back substrate for plasma display panel, back substrate for plasma display panel, and plasma display panelFiled 2005·Application pending·0 cites
- 2146US2013224434A1Resin foam sheet and resin foam memberNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 2246US2013302590A1Foam laminate for electric or electronic deviceHATANAKA ITSUHIRO·Filed 2012·Application pending·0 cites
- 2346US2010317784A1Inorganic powder-containing resin composition, and a substrate having a dielectric layer formed thereonKUME KATSUYA·Filed 2007·Application pending·0 cites
- 2446US2005212427A1Pressure-sensitive adhesive sheet for removal of fluorescent substancesBUZOUJIMA YASUSHI·Filed 2005·Application pending·0 cites
- 2545US2011262744A1Resin foam and foamed memberNITTO DENKO CORP·Filed 2011·Application pending·0 cites
- 2645US2012003457A1Flame-retardant resin form and flame-retardant materialHATANAKA ITSUHIRO·Filed 2010·Application pending·0 cites
- 2744US2011003124A1Resin foamNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 2843US2012145305A1Carrier tape for foam materialMATSUMOTO MITSUO·Filed 2010·Application pending·0 cites
- 2943US2010239836A1Impact-absorbing materialNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 3043US2011318569A1Electrically conductive resin foamKOBAYASHI TETSUROU·Filed 2010·Application pending·0 cites
- 3142US2010119812A1Light-reflecting member containing polyolefin resin foam, and method for producing the sameNITTO DENKO CORP·Filed 2008·Application pending·0 cites
- 3241US2017121481A1Resin foam, foam member, and device with touch screenNITTO DENKO CORP·Filed 2015·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Itsuhiro Hatanaka files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →