Foam laminated body for electrical or electronic equipment

Abstract

The invention has an object to provide a foam laminate with excellent repeelability for electric or electronic devices. Also, the invention has an object to provide a foam laminate with excellent repeelability and excellent heat resistance for electric or electronic devices. A foam laminate for electric or electronic devices of the invention has, on at least one side of a foam layer, a pressure-sensitive adhesive layer having a crystal melting energy of 50 J/g or less, obtained according to the following: the crystal melting energy is a melting heat (J/g) obtained during a second heating in differential scanning calorimetry conducted under conditions of heating at a heating rate of 10° C./min to melt (a first heating), followed by cooling down to −50° C. at a cooling rate of 10° C./min (a first cooling), and then heating from −50° C. at a heating rate of 10° C./min (the second heating) (according to JIS K 7122).

1 . A foam laminate for electric or electronic devices having, on at least one side of a foam layer, a pressure-sensitive adhesive layer having a crystal melting energy of 50 J/g or less, obtained according to the following:
 the crystal melting energy is a melting heat (J/g) obtained during a second heating in differential scanning calorimetry conducted under conditions of heating at a heating rate of 10° C./min to melt (a first heating), followed by cooling down to −50° C. at a cooling rate of 10° C./min (a first cooling), and then heating from −50° C. at a heating rate of 10° C./min (the second heating) (according to JIS K 7122).   
     
     
         2 . The foam laminate for electric or electronic devices according to  claim 1 , wherein the pressure-sensitive adhesive layer is a polyolefin-based pressure-sensitive adhesive layer containing a polyolefin. 
     
     
         3 . The foam laminate for electric or electronic devices according to  claim 2 , wherein the polyolefin-based pressure-sensitive adhesive layer contains a polyolefin A having a crystal melting energy of less than 50 J/g and a polyolefin B having a crystal melting energy of 50 J/g or more, and wherein a proportion of the polyolefin B is from 3 to 30% by weight with respect to a total polyolefin amount (100% by weight). 
     
     
         4 . The foam laminate for electric or electronic devices according to  claim 2 , wherein the polyolefin is a polyolefin obtained through polymerization using a metallocene compound as a catalyst. 
     
     
         5 . The foam laminate for electric or electronic devices according to  claim 3 , wherein at least one polyolefin of the polyolefin A and the polyolefin B is a polyolefin obtained through polymerization using a metallocene compound as a catalyst.