Inventor · disambiguated record
Ivan Huang
Also filed as: HUANG IVAN · HUANG IVAN JUNJU
3 granted patents·8 pending applications·0 citations·filing 2012–2025
44Inventor score
Files withGLOBALFOUNDRIES INC4KALMAN ROBERT3HUANG IVAN1SAMSUNG ELECTRONICS CO LTD1SHOEI CHEMICAL IND CO1
Top patents by PatentIndex Score
11 records- 0169US2025366264A1Circular microleds for linksHUANG IVAN·Filed 2025·Application pending·0 cites
- 0254US12159964B2Light-emitting diode device containing microlenses and method of making the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 3, 2024·0 cites·17 claims
- 0352US2025255078A1Light emitting devices including a quantum dot color conversion material and method of making thereofSHOEI CHEMICAL IND CO·Filed 2023·Application pending·0 cites
- 0448US2025301845A1Vertical optical io for multi-chip packagesKALMAN ROBERT·Filed 2025·Application pending·0 cites
- 0547US2025301850A1Optical interconnects using 3d stacked optoelectronic interfacesKALMAN ROBERT·Filed 2025·Application pending·0 cites
- 0646US10325808B2Crack prevent and stop for thin glass substratesGLOBALFOUNDRIES INC·Filed 2017·Granted Jun 18, 2019·0 cites·20 claims
- 0745US2025234670A1Optical interconnects using 3d stacked optoelectronic interfacesKALMAN ROBERT·Filed 2025·Application pending·0 cites
- 0843US9892971B1Crack prevent and stop for thin glass substratesGLOBALFOUNDRIES INC·Filed 2016·Granted Feb 13, 2018·0 cites·11 claims
- 0931US2018254239A1FORMING METAL CAP LAYER OVER THROUGH-GLASS-VIAS (TGVs)GLOBALFOUNDRIES INC·Filed 2017·Application pending·0 cites
- 1030US2013256681A1Group iii nitride-based high electron mobility transistorWANG WINSTON·Filed 2012·Application pending·0 cites
- 1123US2016260675A1Slotted substrate for die attach interconnectsGLOBALFOUNDRIES INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →