Inventor · disambiguated record
J. H. Yee
Also filed as: YEE J H
2 granted patents·562 citations·filing 1998–1999
74Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0195US6281568B1Plastic integrated circuit device package and leadframe having partially undercut leads and die padAMKOR TECHNOLOGY INC·Filed 1998·Granted Aug 28, 2001·485 cites·35 claims
- 0282US6455356B1Methods for moding a leadframe in plastic integrated circuit devicesAMKOR TECHNOLOGY·Filed 1999·Granted Sep 24, 2002·77 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →