Inventor · disambiguated record
James D. Bielick
Also filed as: BIELICK JAMES · BIELICK JAMES D · BIELICK JAMES DANIEL
24 granted patents·4 pending applications·366 citations·filing 1995–2023
95Inventor score
Top patents by PatentIndex Score
28 records- 0196US10575448B1Electromagnetic shielding of heat sinks with shape-memory alloy groundingIBM·Filed 2018·Granted Feb 25, 2020·20 cites·20 claims
- 0294US11699884B2Electromagnetic shielding of heatsinks with spring press-fit pinsIBM·Filed 2020·Granted Jul 11, 2023·4 cites·4 claims
- 0387US5905636AHeat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic deviceIBM·Filed 1998·Granted May 18, 1999·72 cites·9 claims
- 0485US5745344AHeat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic deviceIBM·Filed 1995·Granted Apr 28, 1998·67 cites·12 claims
- 0582US6261404B1Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic deviceIBM·Filed 1999·Granted Jul 17, 2001·52 cites·13 claims
- 0679US6084775AHeatsink and package structures with fusible release layerIBM·Filed 1998·Granted Jul 4, 2000·54 cites·35 claims
- 0776US10262907B1Dye and pry process for removing quad flat no-lead packages and bottom termination componentsIBM·Filed 2017·Granted Apr 16, 2019·2 cites·13 claims
- 0876US5873512AApplication of low temperature metallurgical paste to form a bond structure to attach an electronic component to a carrierIBM·Filed 1997·Granted Feb 23, 1999·42 cites·11 claims
- 0971US10939600B2Flux residue detectionIBM·Filed 2018·Granted Mar 2, 2021·1 cites·9 claims
- 1068US12256494B2Modified internal clearance(s) at connector pin aperture(s) of a circuit boardIBM·Filed 2022·Granted Mar 18, 2025·0 cites·25 claims
- 1167US10677856B2Facilitating reliable circuit board press-fit connector assembly fabricationIBM·Filed 2018·Granted Jun 9, 2020·2 cites·20 claims
- 1264US5806753AApplication of low temperature metallurgical paste to form a bond structure to attach an electronic component to a carrierIBM·Filed 1995·Granted Sep 15, 1998·26 cites·24 claims
- 1360US11906574B2Hybrid socket warp indicatorIBM·Filed 2021·Granted Feb 20, 2024·0 cites·7 claims
- 1459US9578794B2Apparatus and method for detaching a component from a mounting surfaceGLOBALFOUNDRIES INC·Filed 2013·Granted Feb 21, 2017·2 cites·13 claims
- 1559US2025166401A1Hardware integrity validationIBM·Filed 2023·Application pending·0 cites
- 1658US10593601B2Dye and pry process for removing quad flat no-lead packages and bottom termination componentsIBM·Filed 2019·Granted Mar 17, 2020·0 cites·11 claims
- 1758US2025093106A1Infrared sensor turret for reflow ovensIBM·Filed 2023·Application pending·0 cites
- 1857US5651493AMethod of performing solder joint analysis of semi-conductor componentsIBM·Filed 1995·Granted Jul 29, 1997·22 cites·15 claims
- 1956US11445650B2Localized rework using liquid media solderingIBM·Filed 2019·Granted Sep 13, 2022·0 cites·20 claims
- 2055US12100910B2Shape-memory alloy lock for connectorsIBM·Filed 2021·Granted Sep 24, 2024·0 cites·13 claims
- 2155US2024194558A1Heatsink pedestals for thermal interface material fillIBM·Filed 2022·Application pending·0 cites
- 2255US2024170903A1Controlled extraction of electronic connector from electronic connector boardIBM·Filed 2022·Application pending·0 cites
- 2351US10834839B1Barrier for hybrid socket movement reductionIBM·Filed 2019·Granted Nov 10, 2020·0 cites·20 claims
- 2450US11245238B2Tool for shaping contact tab interconnects at a circuit card edgeIBM·Filed 2018·Granted Feb 8, 2022·0 cites·10 claims
- 2549US11175100B2Heat sinks using memory shaping materialsIBM·Filed 2019·Granted Nov 16, 2021·0 cites·10 claims
- 2648US11211760B2Stutter step press-fit connector insertion processIBM·Filed 2019·Granted Dec 28, 2021·0 cites·7 claims
- 2748US10881007B2Recondition process for BGA using fluxIBM·Filed 2017·Granted Dec 29, 2020·0 cites·15 claims
- 2845US11268809B2Detecting and correcting deficiencies in surface conditions for bonding applicationsIBM·Filed 2018·Granted Mar 8, 2022·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →