Inventor · disambiguated record
James W. Cady
Also filed as: CADY JAMES · CADY JAMES G · CADY JAMES W
40 granted patents·20 pending applications·1,835 citations·filing 1990–2009
99Inventor score
Files withSTAKTEK GROUP LP32ENTORIAN TECHNOLOGIES LP9STAKTEK CORP8ARROWSMITH SHELBURNE INC2CADY JAMES W2
Top patents by PatentIndex Score
60 records- 0198US6576992B1Chip scale stacking system and methodSTAKTEK GROUP LP·Filed 2001·Granted Jun 10, 2003·162 cites·42 claims
- 0297US7595550B2Flex-based circuit moduleENTORIAN TECHNOLOGIES LP·Filed 2005·Granted Sep 29, 2009·36 cites·4 claims
- 0397US7053478B2Pitch change and chip scale stacking systemSTAKTEK GROUP LP·Filed 2004·Granted May 30, 2006·139 cites·34 claims
- 0497US6956284B2Integrated circuit stacking system and methodSTAKTEK GROUP LP·Filed 2004·Granted Oct 18, 2005·88 cites·14 claims
- 0597US6914324B2Memory expansion and chip scale stacking system and methodSTAKTEK GROUP LP·Filed 2003·Granted Jul 5, 2005·98 cites·15 claims
- 0697US6572387B2Flexible circuit connector for stacked chip moduleSTAKTEK GROUP LP·Filed 2002·Granted Jun 3, 2003·100 cites·20 claims
- 0796US7066741B2Flexible circuit connector for stacked chip moduleSTAKTEK GROUP LP·Filed 2003·Granted Jun 27, 2006·78 cites·6 claims
- 0896US7026708B2Low profile chip scale stacking system and methodSTAKTEK GROUP LP·Filed 2003·Granted Apr 11, 2006·79 cites·25 claims
- 0996US5550711AUltra high density integrated circuit packagesSTAKTEK CORP·Filed 1995·Granted Aug 27, 1996·164 cites·7 claims
- 1095US7094632B2Low profile chip scale stacking system and methodSTAKTEK GROUP LP·Filed 2004·Granted Aug 22, 2006·51 cites·6 claims
- 1194US7180167B2Low profile stacking system and methodSTAKTEK GROUP LP·Filed 2004·Granted Feb 20, 2007·61 cites·10 claims
- 1292US5084594AMultiwire cableARROWSMITH SHELBURNE INC·Filed 1990·Granted Jan 28, 1992·132 cites·22 claims
- 1391US5446620AUltra high density integrated circuit packagesSTAKTEK CORP·Filed 1993·Granted Aug 29, 1995·95 cites·28 claims
- 1490US6940729B2Integrated circuit stacking system and methodSTAKTEK GROUP LP·Filed 2002·Granted Sep 6, 2005·37 cites·3 claims
- 1588US7423885B2Die module systemENTORIAN TECHNOLOGIES LP·Filed 2005·Granted Sep 9, 2008·15 cites·4 claims
- 1686USRE36229ESimulcast standard multichip memory addressing systemSTAKTEK CORP·Filed 1995·Granted Jun 15, 1999·57 cites·9 claims
- 1786US5367766AUltra high density integrated circuit packages methodSTAKTEK CORP·Filed 1993·Granted Nov 29, 1994·87 cites·15 claims
- 1883US7524703B2Integrated circuit stacking system and methodENTORIAN TECHNOLOGIES LP·Filed 2005·Granted Apr 28, 2009·7 cites·13 claims
- 1981US7495334B2Stacking system and methodENTORIAN TECHNOLOGIES LP·Filed 2005·Granted Feb 24, 2009·6 cites·30 claims
- 2081US5371866ASimulcast standard multichip memory addressing systemSTAKTEK CORP·Filed 1992·Granted Dec 6, 1994·43 cites·5 claims
- 2180US7602613B2Thin module system and methodENTORIAN TECHNOLOGIES LP·Filed 2007·Granted Oct 13, 2009·9 cites·1 claims
- 2280US5369056AWarp-resistent ultra-thin integrated circuit package fabrication methodSTAKTEK CORP·Filed 1993·Granted Nov 29, 1994·43 cites·18 claims
- 2379US5475920AMethod of assembling ultra high density integrated circuit packagesFiled 1994·Granted Dec 19, 1995·60 cites·11 claims
- 2478US7606050B2Compact module system and methodENTORIAN TECHNOLOGIES LP·Filed 2005·Granted Oct 20, 2009·7 cites·13 claims
- 2578US5369058AWarp-resistent ultra-thin integrated circuit package fabrication methodSTAKTEK CORP·Filed 1994·Granted Nov 29, 1994·40 cites·18 claims
- 2677US6955945B2Memory expansion and chip scale stacking system and methodSTAKTEK GROUP LP·Filed 2004·Granted Oct 18, 2005·13 cites·31 claims
- 2776US7606049B2Module thermal management system and methodENTORIAN TECHNOLOGIES LP·Filed 2005·Granted Oct 20, 2009·7 cites·20 claims
- 2874US7768796B2Die module systemENTORIAN TECHNOLOGIES L P·Filed 2008·Granted Aug 3, 2010·6 cites·8 claims
- 2970US6194247B1Warp-resistent ultra-thin integrated circuit package fabrication methodSTAKTEK GROUP LP·Filed 1998·Granted Feb 27, 2001·27 cites·1 claims
- 3062US7202555B2Pitch change and chip scale stacking system and methodSTAKTEK GROUP LP·Filed 2005·Granted Apr 10, 2007·2 cites·7 claims
- 3161US7586758B2Integrated circuit stacking systemENTORIAN TECHNOLOGIES LP·Filed 2004·Granted Sep 8, 2009·6 cites·13 claims
- 3260US7626273B2Low profile stacking system and methodENTORIAN TECHNOLOGIES L P·Filed 2009·Granted Dec 1, 2009·1 cites·7 claims
- 3360US5581121AWarp-resistant ultra-thin integrated circuit packageSTAKTEK CORP·Filed 1994·Granted Dec 3, 1996·19 cites·12 claims
- 3458US5295863AElectrical connector for coaxial cableARROWSMITH SHELBURNE INC·Filed 1992·Granted Mar 22, 1994·22 cites·3 claims
- 3557US7335975B2Integrated circuit stacking system and methodSTAKTEK GROUP LP·Filed 2004·Granted Feb 26, 2008·4 cites·30 claims
- 3656US7256484B2Memory expansion and chip scale stacking system and methodSTAKTEK GROUP LP·Filed 2004·Granted Aug 14, 2007·3 cites·12 claims
- 3756US6618257B1Wide data path stacking system and methodSTAKTEK GROUP LP·Filed 2001·Granted Sep 9, 2003·6 cites·34 claims
- 3854US7606048B2Integrated circuit stacking systemENTHORIAN TECHNOLOGIES LP·Filed 2004·Granted Oct 20, 2009·5 cites·20 claims
- 3953US6404662B1Rambus stakpakSTAKTEK GROUP LP·Filed 1998·Granted Jun 11, 2002·19 cites·6 claims
- 4053US2009273069A1Low profile chip scale stacking system and methodCADY JAMES W·Filed 2009·Application pending·0 cites
- 4152US2007114649A1Low Profile Stacking System and MethodSTAKTEK GROUP L P A TEXAS LTD·Filed 2007·Application pending·0 cites
- 4252US2007117262A1Low Profile Stacking System and MethodSTAKTEK GROUP L P A TEXAS LTD·Filed 2007·Application pending·0 cites
- 4350US2007126125A1Memory Module System and MethodSTAKTEK GROUP LP·Filed 2007·Application pending·0 cites
- 4450US2007126124A1Memory Module System and MethodSTAKTEK GROUP LP·Filed 2007·Application pending·0 cites
- 4547US2008211077A1Low profile chip scale stacking system and methodCADY JAMES W·Filed 2006·Application pending·0 cites
- 4647US2006261449A1Memory module system and methodSTAKTEK GROUP LP·Filed 2005·Application pending·0 cites
- 4745US2004235222A1Integrated circuit stacking system and methodSTAKTEK GROUP LP·Filed 2004·Application pending·0 cites
- 4845US2008067662A1Modularized Die Stacking System and MethodSTAKTEK GROUP LP·Filed 2007·Application pending·0 cites
- 4945US2005067683A1Memory expansion and chip scale stacking system and methodSTAKTEK GROUP LP·Filed 2004·Application pending·0 cites
- 5044US7542304B2Memory expansion and integrated circuit stacking system and methodENTORIAN TECHNOLOGIES LP·Filed 2004·Granted Jun 2, 2009·1 cites·17 claims
Showing the top 50 of 60 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →