Inventor · disambiguated record
Jack Chen
Also filed as: CHEN JACK · CHEN JACK TSUNG-YU
10 granted patents·13 pending applications·30 citations·filing 2004–2011
85Inventor score
Top patents by PatentIndex Score
23 records- 0188US8555492B2Method for manufacturing a conductive substrate structure with conductive channels formed by using a two-sided cut approachWANG BILY·Filed 2011·Granted Oct 15, 2013·9 cites·4 claims
- 0274US8384222B2Semiconductor device and manufacturing method thereofTSAI CHIA-LUN·Filed 2011·Granted Feb 26, 2013·3 cites·19 claims
- 0367US8263876B2Conductive substrate structure with conductive channels formed by using a two-sided cut approach and a method for manufacturing the sameWANG BILY·Filed 2009·Granted Sep 11, 2012·0 cites·16 claims
- 0461US8910169B2Methods and systems to perform a computer task in a reduced power consumption stateWANG JING W·Filed 2008·Granted Dec 9, 2014·4 cites·27 claims
- 0560US7923747B2Wafer level LED package structure and method for making the sameHARVATEK CORP·Filed 2008·Granted Apr 12, 2011·2 cites·8 claims
- 0659US7968448B2Semiconductor device and manufacturing method thereofTSAI CHIA-LUN·Filed 2009·Granted Jun 28, 2011·1 cites·2 claims
- 0755USD645421SLED baseHARVATEK CORP·Filed 2011·Granted Sep 20, 2011·9 cites·1 claims
- 0853US2010127292A1Wafer level led package structure for increasing light-emitting efficiency and method for making the sameWANG BILY·Filed 2009·Application pending·0 cites
- 0953US2009230538A1Semiconductor chip package structure for achieving face-up electrical connection without using a wire-bonding process and method for making the sameHARVATEK CORP·Filed 2008·Application pending·0 cites
- 1052US2012009699A1Wafer level led package structure for increase light-emitting efficiency and method for making the sameWANG BILY·Filed 2011·Application pending·0 cites
- 1150US8053885B2Wafer level vertical diode package structure and method for making the sameHARVATEK CORP·Filed 2009·Granted Nov 8, 2011·0 cites·11 claims
- 1250US7700246B2Conductive lithographic polymer and method of making devices using sameINTEL CORP·Filed 2007·Granted Apr 20, 2010·0 cites·2 claims
- 1350US2010264435A1White light-emitting diode package structure for simplifying package process and method for making the sameWANG BILY·Filed 2009·Application pending·0 cites
- 1446US7279268B2Conductive lithographic polymer and method of making devices using sameINTEL CORP·Filed 2004·Granted Oct 9, 2007·2 cites·16 claims
- 1546US2012122254A1White light-emitting diode package structure for simplifying package process and method for making the sameWANG BILY·Filed 2011·Application pending·0 cites
- 1645US2011003434A1Semiconductor chip package structure for achieving face-up electrical connection without using a wire-bonding process and method for making the sameHARVATEK CORP·Filed 2010·Application pending·0 cites
- 1745US2009283881A1Semiconductor chip package structure for achieving face-down electrical connection without using a wire-bonding process and method for making the sameHARVATEK CORP·Filed 2008·Application pending·0 cites
- 1845US2009278159A1Semiconductor chip package structure without substrates for achieving face-up electrical connection without using a wire-bonding process and method for making the sameHARVATEK CORP·Filed 2008·Application pending·0 cites
- 1945US2011304020A1Wafer level diode package structureWANG BILY·Filed 2011·Application pending·0 cites
- 2039US2011147774A1Wafer level led package structure for increasing light-emitting efficiency and heat-dissipating effect and method for manufacturing the sameHARVATEK CORP·Filed 2010·Application pending·0 cites
- 2138US2012119231A1Led package structure with a deposited-type phosphor layer and method for making the sameWANG BILY·Filed 2011·Application pending·0 cites
- 2238US2012106171A1Led package structureWANG BILY·Filed 2011·Application pending·0 cites
- 2337US2012037937A1Led package structure and method of making the sameWANG BILY·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →