Inventor · disambiguated record
Jae-Kwang Choi
Also filed as: CHOI JAE-KWANG
14 granted patents·4 pending applications·136 citations·filing 2003–2019
90Inventor score
Top patents by PatentIndex Score
18 records- 0196US8916460B1Semiconductor device and method for fabricating the sameKWON BYOUNG-HO·Filed 2014·Granted Dec 23, 2014·74 cites·8 claims
- 0294US7531456B2Method of forming self-aligned double patternSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted May 12, 2009·29 cites·23 claims
- 0392US9627542B2Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Apr 18, 2017·6 cites·20 claims
- 0486US9190407B2Semiconductor device and method for fabricating the sameKWON BYOUNG-HO·Filed 2014·Granted Nov 17, 2015·5 cites·19 claims
- 0585US7576395B2Dual gate stack CMOS structure with different dielectricsSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Aug 18, 2009·11 cites·11 claims
- 0676US8597081B2Chemical mechanical polishing apparatus having pad conditioning disk and pre-conditioner unitCHOI JAE-KWANG·Filed 2011·Granted Dec 3, 2013·4 cites·20 claims
- 0772US8475238B2Polishing pads including sidewalls and related polishing apparatusesCHOI JAE-KWANG·Filed 2010·Granted Jul 2, 2013·3 cites·18 claims
- 0865US7524757B2Method for manufacturing multi-level transistor comprising forming selective epitaxial growth layerSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Apr 28, 2009·2 cites·9 claims
- 0957US10804160B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 13, 2020·0 cites·13 claims
- 1053US10373878B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Aug 6, 2019·0 cites·20 claims
- 1153US2016064380A1Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
- 1249US7144301B2Method and system for planarizing integrated circuit materialSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Dec 5, 2006·2 cites·8 claims
- 1345US9421668B2CMP apparatusLEE SEH KWANG·Filed 2012·Granted Aug 23, 2016·0 cites·14 claims
- 1444US2015056795A1Method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 1542US9314901B2CMP pad conditioner, and method for producing the CMP pad conditionerLEE SEH KWANG·Filed 2012·Granted Apr 19, 2016·0 cites·15 claims
- 1642US2006143993A1Slurry compositions for use in chemical mechanical polishing and method of manufacturing semiconductor device using the sameKIM SUNG-JUN·Filed 2006·Application pending·0 cites
- 1738US10435587B2Polishing compositions and methods of manufacturing semiconductor devices using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Oct 8, 2019·0 cites·14 claims
- 1838US2004009674A1Method for forming a filling film and method for forming shallow trench isolation of a semiconductor device using the sameFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →