Inventor · disambiguated record
Janet M. Flanner
Also filed as: FLANNER JANET · FLANNER JANET M
16 granted patents·902 citations·filing 1987–2002
95Inventor score
Top patents by PatentIndex Score
16 records- 0194US6241845B1Apparatus for reducing process drift in inductive coupled plasma etching such as oxide layerLAM RES CORP·Filed 1999·Granted Jun 5, 2001·249 cites·15 claims
- 0292US6426304B1Post etch photoresist strip with hydrogen for organosilicate glass low-κ etch applicationsLAM RES CORP·Filed 2000·Granted Jul 30, 2002·69 cites·17 claims
- 0392US6410437B1Method for etching dual damascene structures in organosilicate glassLAM RES CORP·Filed 2000·Granted Jun 25, 2002·66 cites·10 claims
- 0490US6383931B1Convertible hot edge ring to improve low-K dielectric etchLAM RES CORP·Filed 2000·Granted May 7, 2002·59 cites·17 claims
- 0589US4987099AMethod for selectively filling contacts or vias or various depths with CVD tungstenPHILIPS CORP·Filed 1989·Granted Jan 22, 1991·91 cites·11 claims
- 0685US6696366B1Technique for etching a low capacitance dielectric layerLAM RES CORP·Filed 1999·Granted Feb 24, 2004·86 cites·28 claims
- 0784US6653734B2Convertible hot edge ring to improve low-K dielectric etchLAM RES CORP·Filed 2002·Granted Nov 25, 2003·31 cites·19 claims
- 0880US6114250ATechniques for etching a low capacitance dielectric layer on a substrateLAM RES CORP·Filed 1998·Granted Sep 5, 2000·61 cites·20 claims
- 0980US6048798AApparatus for reducing process drift in inductive coupled plasma etching such as oxide layerLAM RES CORP·Filed 1996·Granted Apr 11, 2000·64 cites·20 claims
- 1075US4822749ASelf-aligned metallization for semiconductor device and process using selectively deposited tungstenNORTH AMERICAN PHILIPS CORP SI·Filed 1987·Granted Apr 18, 1989·49 cites·12 claims
- 1164US5783496AMethods and apparatus for etching self-aligned contactsLAM RES CORP·Filed 1996·Granted Jul 21, 1998·33 cites·21 claims
- 1255US6165910ASelf-aligned contacts for semiconductor deviceLAM RES CORP·Filed 1997·Granted Dec 26, 2000·20 cites·26 claims
- 1350US6946303B2Electronically diagnosing a component in a process line using a substrate signatureLAM RES CORP·Filed 2002·Granted Sep 20, 2005·3 cites·6 claims
- 1448US6133153ASelf-aligned contacts for semiconductor deviceLAM RES CORP·Filed 1998·Granted Oct 17, 2000·15 cites·24 claims
- 1547US6890774B2System and method for creating a substrate signatureLAM RES CORP·Filed 2002·Granted May 10, 2005·2 cites·8 claims
- 1632US5021358ASemiconductor fabrication process using sacrificial oxidation to reduce tunnel formation during tungsten depositionNORTH AMERICAN PHILIPS CORP SI·Filed 1988·Granted Jun 4, 1991·4 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →