Inventor · disambiguated record
Jaspreet S. Gandhi
Also filed as: GANDHI JASPREET · GANDHI JASPREET S · GANDHI JASPREET SINGH
95 granted patents·17 pending applications·323 citations·filing 2006–2024
99Inventor score
Files withMICRON TECHNOLOGY INC71XILINX INC26META PLATFORMS TECH LLC5GANDHI JASPREET S3SUN YANGYANG2
Top patents by PatentIndex Score
112 records- 0198US11373989B1Package integration for laterally mounted IC dies with dissimilar solder interconnectsXILINX INC·Filed 2020·Granted Jun 28, 2022·6 cites·20 claims
- 0298US10770430B1Package integration for memory devicesXILINX INC·Filed 2019·Granted Sep 8, 2020·53 cites·20 claims
- 0398US9768149B2Semiconductor device assembly with heat transfer structure formed from semiconductor materialMICRON TECHNOLOGY INC·Filed 2015·Granted Sep 19, 2017·24 cites·29 claims
- 0497US11145566B2Stacked silicon package assembly having thermal managementXILINX INC·Filed 2020·Granted Oct 12, 2021·5 cites·20 claims
- 0596US11195780B1Stacked silicon package assembly having thermal management using phase change materialXILINX INC·Filed 2020·Granted Dec 7, 2021·4 cites·20 claims
- 0696US10529645B2Methods and apparatus for thermal interface material (TIM) bond line thickness (BLT) reduction and TIM adhesion enhancement for efficient thermal managementXILINX INC·Filed 2017·Granted Jan 7, 2020·26 cites·20 claims
- 0792US9691746B2Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal pathsMICRON TECHNOLOGY INC·Filed 2014·Granted Jun 27, 2017·9 cites·16 claims
- 0892US9153520B2Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methodsGROOTHUIS STEVEN K·Filed 2012·Granted Oct 6, 2015·17 cites·21 claims
- 0991US9515002B2Bonding pads with thermal pathwaysMICRON TECHNOLOGY INC·Filed 2015·Granted Dec 6, 2016·6 cites·20 claims
- 1091US8970034B2Semiconductor assemblies and structuresGANDHI JASPREET S·Filed 2012·Granted Mar 3, 2015·11 cites·16 claims
- 1191US8962449B1Methods for processing semiconductor devicesMICRON TECHNOLOGY INC·Filed 2013·Granted Feb 24, 2015·9 cites·22 claims
- 1290US10916487B2Method for manufacturing a semiconductor device assembly with through-mold cooling channel formed in encapsulantMICRON TECHNOLOGY INC·Filed 2019·Granted Feb 9, 2021·5 cites·23 claims
- 1390US9412675B2Interconnect structure with improved conductive properties and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2014·Granted Aug 9, 2016·8 cites·17 claims
- 1490US8519516B1Semiconductor constructionsGANDHI JASPREET S·Filed 2012·Granted Aug 27, 2013·10 cites·8 claims
- 1589US11282775B1Chip package assembly with stress decoupled interconnect layerXILINX INC·Filed 2020·Granted Mar 22, 2022·2 cites·19 claims
- 1689US10424531B2Method for manufacturing a semiconductor device assembly with through-mold cooling channel formed in encapsulantMICRON TECHNOLOGY INC·Filed 2018·Granted Sep 24, 2019·5 cites·11 claims
- 1789US9905539B2Interconnect structures with intermetallic palladium joints and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Feb 27, 2018·4 cites·20 claims
- 1889US9733304B2Semiconductor device test apparatusesMICRON TECHNOLOGY INC·Filed 2014·Granted Aug 15, 2017·5 cites·19 claims
- 1989US9520370B2Methods of forming semiconductor device assemblies and interconnect structures, and related semiconductor device assemblies and interconnect structuresMICRON TECHNOLOGY INC·Filed 2014·Granted Dec 13, 2016·8 cites·19 claims
- 2089US9337119B2Stacked semiconductor die assemblies with high efficiency thermal paths and associated systemsMICRON TECHNOLOGY INC·Filed 2014·Granted May 10, 2016·10 cites·28 claims
- 2188US9960150B2Semiconductor device assembly with through-mold cooling channel formed in encapsulantMICRON TECHNOLOGY INC·Filed 2016·Granted May 1, 2018·5 cites·18 claims
- 2288US9299663B2Semiconductor devices and methods for backside photo alignmentMICRON TECHNOLOGY INC·Filed 2014·Granted Mar 29, 2016·10 cites·17 claims
- 2386US10163830B2Bonding pads with thermal pathwaysMICRON TECHNOLOGY INC·Filed 2016·Granted Dec 25, 2018·3 cites·20 claims
- 2486US9768147B2Thermal pads between stacked semiconductor dies and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2014·Granted Sep 19, 2017·5 cites·11 claims
- 2586US2024347511A1Thermal pads between stacked semiconductor dies and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 2684US9362143B2Methods for forming semiconductor device packages with photoimageable dielectric adhesive material, and related semiconductor device packagesSUN YANGYANG·Filed 2012·Granted Jun 7, 2016·12 cites·26 claims
- 2783US10170389B2Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2015·Granted Jan 1, 2019·3 cites·16 claims
- 2882US9881858B2Solder bond site including an opening with discontinuous profileMICRON TECHNOLOGY INC·Filed 2015·Granted Jan 30, 2018·3 cites·13 claims
- 2982US9318438B2Semiconductor structures comprising at least one through-substrate via filled with conductive materialsMICRON TECHNOLOGY INC·Filed 2015·Granted Apr 19, 2016·4 cites·20 claims
- 3081US10403591B2Chip package assembly with enhanced interconnects and method for fabricating the sameXILINX INC·Filed 2017·Granted Sep 3, 2019·3 cites·20 claims
- 3181US2023395463A1Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal pathsMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 3280US11302674B2Modular stacked silicon package assemblyXILINX INC·Filed 2020·Granted Apr 12, 2022·1 cites·20 claims
- 3380US10481200B2Semiconductor device test apparatuses comprising at least one test site having an array of pocketsMICRON TECHNOLOGY INC·Filed 2018·Granted Nov 19, 2019·1 cites·18 claims
- 3480US10410879B2Uniform back side exposure of through-silicon viasMICRON TECHNOLOGY INC·Filed 2017·Granted Sep 10, 2019·2 cites·11 claims
- 3579US11315858B1Chip package assembly with enhanced solder resist crack resistanceXILINX INC·Filed 2020·Granted Apr 26, 2022·1 cites·20 claims
- 3679US10236229B2Stacked silicon package assembly having conformal lidXILINX INC·Filed 2016·Granted Mar 19, 2019·3 cites·11 claims
- 3778US11488936B2Stacked silicon package assembly having vertical thermal managementXILINX INC·Filed 2019·Granted Nov 1, 2022·2 cites·20 claims
- 3878US10126357B2Methods of testing semiconductor devices comprising a die stack having protruding conductive elementsMICRON TECHNOLOGY INC·Filed 2017·Granted Nov 13, 2018·1 cites·20 claims
- 3978US9837383B2Interconnect structure with improved conductive properties and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2016·Granted Dec 5, 2017·2 cites·14 claims
- 4077US10580746B2Bonding pads with thermal pathwaysMICRON TECHNOLOGY INC·Filed 2018·Granted Mar 3, 2020·1 cites·19 claims
- 4177US9564418B2Interconnect structures with intermetallic palladium joints and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2014·Granted Feb 7, 2017·2 cites·15 claims
- 4276US10573612B2Bonding pads with thermal pathwaysMICRON TECHNOLOGY INC·Filed 2018·Granted Feb 25, 2020·1 cites·17 claims
- 4376US10256216B2Interconnect structures with intermetallic palladium joints and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Apr 9, 2019·1 cites·12 claims
- 4476US9741612B2Semiconductor devices and methods for backside photo alignmentMICRON TECHNOLOGY INC·Filed 2016·Granted Aug 22, 2017·2 cites·13 claims
- 4575US10741468B2Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Aug 11, 2020·1 cites·11 claims
- 4675US10319606B1Chip package assembly with enhanced interconnects and method for fabricating the sameXILINX INC·Filed 2017·Granted Jun 11, 2019·2 cites·20 claims
- 4775US9941190B2Semiconductor device having through-silicon-via and methods of forming the sameMICRON TECHNOLOGY INC·Filed 2015·Granted Apr 10, 2018·2 cites·11 claims
- 4874US11776877B2Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal pathsMICRON TECHNOLOGY INC·Filed 2021·Granted Oct 3, 2023·0 cites·20 claims
- 4973US10410882B2Solder bond site including an opening with discontinuous profileMICRON TECHNOLOGY INC·Filed 2017·Granted Sep 10, 2019·1 cites·20 claims
- 5073US10163755B2Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal pathsMICRON TECHNOLOGY INC·Filed 2017·Granted Dec 25, 2018·1 cites·5 claims
Showing the top 50 of 112 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →