Inventor · disambiguated record
Jason P. Gill
Also filed as: GILL JASON · GILL JASON P · GILL JASON PAUL
17 granted patents·3 pending applications·251 citations·filing 2003–2015
93Inventor score
Top patents by PatentIndex Score
20 records- 0199US7397260B2Structure and method for monitoring stress-induced degradation of conductive interconnectsIBM·Filed 2005·Granted Jul 8, 2008·169 cites·12 claims
- 0286US7096450B2Enhancement of performance of a conductive wire in a multilayered substrateIBM·Filed 2003·Granted Aug 22, 2006·41 cites·18 claims
- 0379US7830019B2Via bottom contact and method of manufacturing sameIBM·Filed 2009·Granted Nov 9, 2010·7 cites·20 claims
- 0479US7388224B2Structure for determining thermal cycle reliabilityIBM·Filed 2006·Granted Jun 17, 2008·4 cites·14 claims
- 0575US7867897B2Low leakage metal-containing cap process using oxidationIBM·Filed 2009·Granted Jan 11, 2011·4 cites·9 claims
- 0670US7639032B2Structure for monitoring stress-induced degradation of conductive interconnectsIBM·Filed 2007·Granted Dec 29, 2009·2 cites·7 claims
- 0768US7500208B2Non-destructive evaluation of microstructure and interface roughness of electrically conducting lines in semiconductor integrated circuits in deep sub-micron regimeIBM·Filed 2007·Granted Mar 3, 2009·2 cites·7 claims
- 0866US7598614B2Low leakage metal-containing cap process using oxidationIBM·Filed 2006·Granted Oct 6, 2009·2 cites·11 claims
- 0966US7166904B2Structure and method for local resistor element in integrated circuit technologyIBM·Filed 2004·Granted Jan 23, 2007·12 cites·44 claims
- 1063US7585764B2VIA bottom contact and method of manufacturing sameIBM·Filed 2005·Granted Sep 8, 2009·2 cites·16 claims
- 1162US7098054B2Method and structure for determining thermal cycle reliabilityIBM·Filed 2004·Granted Aug 29, 2006·5 cites·16 claims
- 1257US7692439B2Structure for modeling stress-induced degradation of conductive interconnectsIBM·Filed 2008·Granted Apr 6, 2010·0 cites·6 claims
- 1356US9443776B2Method and structure for determining thermal cycle reliabilityGLOBALFOUNDRIES INC·Filed 2015·Granted Sep 13, 2016·0 cites·10 claims
- 1455US8480302B2Micro-electro-mechanical-system temperature sensorGILL JASON P·Filed 2010·Granted Jul 9, 2013·1 cites·15 claims
- 1551US9287186B2Method and structure for determining thermal cycle reliabilityFILIPPI RONALD GENE·Filed 2008·Granted Mar 15, 2016·0 cites·10 claims
- 1647US7511378B2Enhancement of performance of a conductive wire in a multilayered substrateIBM·Filed 2006·Granted Mar 31, 2009·0 cites·3 claims
- 1745US7231617B2Determination of grain sizes of electrically conductive lines in semiconductor integrated circuitsIBM·Filed 2004·Granted Jun 12, 2007·0 cites·6 claims
- 1845US2008173975A1Programmable resistor, switch or vertical memory cellIBM·Filed 2007·Application pending·0 cites
- 1945US2009164183A1Methodology for Thermal Modeling of On-Chip Interconnects Based on Electromagnetic Simulation ToolsIBM·Filed 2008·Application pending·0 cites
- 2042US2007176295A1Contact via scheme with staggered viasIBM·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →