Inventor · disambiguated record
Jason Goodelle
Also filed as: GOODELLE JASON · GOODELLE JASON P · GOODELLE JASON PAUL
18 granted patents·1 pending application·149 citations·filing 2001–2024
93Inventor score
Top patents by PatentIndex Score
19 records- 0197US10147757B2Image sensor structures for fingerprint sensingSYNAPTICS INC·Filed 2016·Granted Dec 4, 2018·22 cites·17 claims
- 0297US8466606B2Integration of piezoelectric materials with substratesCHEN DAVID M·Filed 2010·Granted Jun 18, 2013·30 cites·32 claims
- 0394US8698376B2Microelectromechanical systems (MEMS) resonators and related apparatus and methodsCHEN DAVID M·Filed 2012·Granted Apr 15, 2014·15 cites·6 claims
- 0493US8476809B2Microelectromechanical systems (MEMS) resonators and related apparatus and methodsCHEN DAVID M·Filed 2012·Granted Jul 2, 2013·12 cites·17 claims
- 0593US7763488B2Method of fabricating MEMS deviceAKUSTICA INC·Filed 2006·Granted Jul 27, 2010·26 cites·31 claims
- 0692US8587183B2Microelectromechanical systems (MEMS) resonators and related apparatus and methodsCHEN DAVID M·Filed 2012·Granted Nov 19, 2013·11 cites·16 claims
- 0791US10921855B1Interposer for a display driver integrated circuit chipSYNAPTICS INC·Filed 2019·Granted Feb 16, 2021·9 cites·20 claims
- 0884US10185866B2Optical fingerprint sensor packageSYNAPTICS INC·Filed 2016·Granted Jan 22, 2019·5 cites·22 claims
- 0975US10055637B2Optical sensor with substrate light filterSYNAPTICS INC·Filed 2016·Granted Aug 21, 2018·3 cites·19 claims
- 1073US10796128B2Optical sensor with ambient light filterFINGERPRINT CARDS AB·Filed 2018·Granted Oct 6, 2020·2 cites·19 claims
- 1173US9030080B2Microelectromechanical systems (MEMS) resonators and related apparatus and methodsCHEN DAVID M·Filed 2012·Granted May 12, 2015·2 cites·15 claims
- 1261US2024332327A1Image sensor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 1360US6894400B1Robust electronic device packagesAGERE SYSTEMS INC·Filed 2004·Granted May 17, 2005·9 cites·20 claims
- 1459US9048811B2Integration of piezoelectric materials with substratesSAND 9 INC·Filed 2013·Granted Jun 2, 2015·1 cites·20 claims
- 1555US8203190B2MEMS device including a chip carrierGOODELLE JASON P·Filed 2010·Granted Jun 19, 2012·1 cites·32 claims
- 1653US10503955B2Device with improved circuit positioningSYNAPTICS INC·Filed 2018·Granted Dec 10, 2019·0 cites·20 claims
- 1752US8541851B2MEMS packageLY TOAN K·Filed 2008·Granted Sep 24, 2013·1 cites·20 claims
- 1835US6890445B2Process for packaging electronic devices using thin bonding regionsAGERE SYSTEMS INC·Filed 2001·Granted May 10, 2005·0 cites·5 claims
- 1929US7314781B2Device packages having stable wirebondsLSI CORP·Filed 2003·Granted Jan 1, 2008·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →