Inventor · disambiguated record
James K. Heckman
Also filed as: HECKMAN JAMES K · HECKMAN JAMES KENT
3 granted patents·120 citations·filing 1992–2001
71Inventor score
Top patents by PatentIndex Score
3 records- 0187US5467253ASemiconductor chip package and method of formingMOTOROLA INC·Filed 1994·Granted Nov 14, 1995·109 cites·21 claims
- 0258US6861720B1Placement template and method for placing optical diesAMKOR TECHNOLOGY INC·Filed 2001·Granted Mar 1, 2005·10 cites·30 claims
- 0324US5307981AMethod and apparatus for optimizing bond tool pressure distributionMOTOROLA INC·Filed 1992·Granted May 3, 1994·1 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →