Inventor · disambiguated record
Jacob L. Hiester
Also filed as: HIESTER JACOB L · HIESTER JACOB LEE
11 granted patents·6 pending applications·26 citations·filing 2014–2023
86Inventor score
Files withLAM RES CORP17
Top patents by PatentIndex Score
17 records- 0194US10233556B2Dynamic modulation of cross flow manifold during electroplatingLAM RES CORP·Filed 2016·Granted Mar 19, 2019·7 cites·19 claims
- 0292US10651065B2Auto-calibration to a station of a process module that spins a waferLAM RES CORP·Filed 2018·Granted May 12, 2020·6 cites·23 claims
- 0389US10991550B2Modular recipe controlled calibration (MRCC) apparatus used to balance plasma in multiple station systemLAM RES CORP·Filed 2018·Granted Apr 27, 2021·7 cites·7 claims
- 0484US12489006B2Auto-calibration to a station of a process module that spins a waferLAM RES CORP·Filed 2023·Granted Dec 2, 2025·0 cites·20 claims
- 0584US11512393B2Dynamic sheath control with edge ring liftLAM RES CORP·Filed 2018·Granted Nov 29, 2022·3 cites·20 claims
- 0677US11742229B2Auto-calibration to a station of a process module that spins a waferLAM RES CORP·Filed 2021·Granted Aug 29, 2023·0 cites·20 claims
- 0776US9349629B2Touch auto-calibration of process modulesLAM RES CORP·Filed 2014·Granted May 24, 2016·3 cites·20 claims
- 0871US11239100B2Auto-calibration to a station of a process module that spins a waferLAM RES CORP·Filed 2020·Granted Feb 1, 2022·0 cites·20 claims
- 0970US12480208B2Dynamic sheath control with edge ring liftLAM RES CORP·Filed 2022·Granted Nov 25, 2025·0 cites·20 claims
- 1065US11594397B2Modular recipe controlled calibration (MRCC) apparatus used to balance plasma in multiple station systemLAM RES CORP·Filed 2021·Granted Feb 28, 2023·0 cites·13 claims
- 1155US2025062156A1Hexapod-based pedestal systems for use in semiconductor processing operationsLAM RES CORP·Filed 2022·Application pending·0 cites
- 1253US12410519B2Automated showerhead tilt adjustmentLAM RES CORP·Filed 2021·Granted Sep 9, 2025·0 cites·8 claims
- 1352US2024353217A1Showerhead to pedestal gapping with differential capacitive sensor substrateLAM RES CORP·Filed 2022·Application pending·0 cites
- 1451US2024234106A9Tripolar electrode arrangement for electrostatic chucksLAM RES CORP·Filed 2022·Application pending·0 cites
- 1550US2025179680A1Gap characterization in electrodeposition toolLAM RES CORP·Filed 2023·Application pending·0 cites
- 1644US2017342590A1Modulation of applied current during sealed rotational electroplatingLAM RES CORP·Filed 2017·Application pending·0 cites
- 1735US2017040205A1High-hardness-material-powder infused elastomer for high friction and compliance for silicon wafer transferLAM RES CORP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →