Inventor · disambiguated record
James E. Hisert
Also filed as: HISERT JAMES · HISERT JAMES E
5 granted patents·1 pending application·16 citations·filing 2004–2020
75Inventor score
Top patents by PatentIndex Score
6 records- 0185US10943796B2Semiconductor device assembly having a thermal interface bond between a semiconductor die and a passive heat exchangerINDIUM CORP·Filed 2019·Granted Mar 9, 2021·4 cites·16 claims
- 0277US10943795B2Apparatus and methods for creating a thermal interface bond between a semiconductor die and a passive heat exchangerINDIUM CORP·Filed 2019·Granted Mar 9, 2021·2 cites·8 claims
- 0377US10607857B2Semiconductor device assembly including a thermal interface bond between a semiconductor die and a passive heat exchangerINDIUM CORP·Filed 2017·Granted Mar 31, 2020·2 cites·10 claims
- 0462US11766721B2Thermally decomposing build plate for facile release of 3D printed objectsINDIUM CORP·Filed 2020·Granted Sep 26, 2023·0 cites·10 claims
- 0550US7109873B2Fiber optic cable sensor for movable objectsGIOTTO FRANK·Filed 2004·Granted Sep 19, 2006·8 cites·23 claims
- 0638US2006071770A1Fiber optic cable sensor for movable objectsGIOTTO FRANK·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →