Inventor · disambiguated record
James W. Hively
Also filed as: HIVELY JAMES W
11 granted patents·795 citations·filing 1989–1997
94Inventor score
Top patents by PatentIndex Score
11 records- 0193US5182632AHigh density multichip package with interconnect structure and heatsinkTACTICAL FABS INC·Filed 1991·Granted Jan 26, 1993·180 cites·51 claims
- 0292US5970321AMethod of fabricating a microelectronic package having polymer ESD protectionLSI LOGIC CORP·Filed 1997·Granted Oct 19, 1999·114 cites·14 claims
- 0388US5955762AMicroelectronic package with polymer ESD protectionLSI LOGIC CORP·Filed 1996·Granted Sep 21, 1999·79 cites·10 claims
- 0488US5869869AMicroelectronic device with thin film electrostatic discharge protection structureLSI LOGIC CORP·Filed 1996·Granted Feb 9, 1999·88 cites·17 claims
- 0588US5691949AVery high density wafer scale device architectureTACTICAL FABS INC·Filed 1996·Granted Nov 25, 1997·63 cites·16 claims
- 0687US5223741APackage for an integrated circuit structureTACTICAL FABS INC·Filed 1989·Granted Jun 29, 1993·76 cites·47 claims
- 0786US5808474ATest socket for testing integrated circuit packagesLSI LOGIC CORP·Filed 1996·Granted Sep 15, 1998·65 cites·16 claims
- 0874US5315130AVery high density wafer scale device architectureTACTICAL FABS INC·Filed 1990·Granted May 24, 1994·29 cites·51 claims
- 0974US5252507AVery high density wafer scale device architectureTACTICAL FABS INC·Filed 1990·Granted Oct 12, 1993·37 cites·11 claims
- 1070US5514884AVery high density wafer scale device architectureTACTICAL FABS INC·Filed 1994·Granted May 7, 1996·23 cites·5 claims
- 1157US5799080ASemiconductor chip having identification/encryption codeLSI LOGIC CORP·Filed 1995·Granted Aug 25, 1998·41 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →