Inventor · disambiguated record
Jao Sheng Huang
Also filed as: HUANG JAO · HUANG JAO S · HUANG JAO SHENG
13 granted patents·3 pending applications·62 citations·filing 2003–2024
88Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD9TAIWAN SEMICONDUCTOR MFG4CHEN MING-FA1HUANG JAO SHENG1LU YUNG-JEAN1
Top patents by PatentIndex Score
16 records- 0194US8501587B2Stacked integrated chips and methods of fabrication thereofCHEN MING-FA·Filed 2009·Granted Aug 6, 2013·32 cites·20 claims
- 0286US12188686B2Air curtain device and workpiece processing toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 7, 2025·1 cites·20 claims
- 0386US8816491B2Stacked integrated chips and methods of fabrication thereofTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 26, 2014·7 cites·19 claims
- 0480US12112953B2Semiconductor devices and methods of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 8, 2024·0 cites·20 claims
- 0580US2024395559A1Semiconductor devices and methods of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0672US2025109870A1Air curtain device and workpiece processing toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0771US11776818B2Semiconductor devices and methods of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 3, 2023·0 cites·20 claims
- 0866US8820728B2Semiconductor wafer carrierHUANG JAO SHENG·Filed 2009·Granted Sep 2, 2014·3 cites·19 claims
- 0963US10985028B1Semiconductor devices and methods of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 20, 2021·0 cites·20 claims
- 1062US7064085B2Feed forward spacer width control in semiconductor manufacturingTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Jun 20, 2006·11 cites·20 claims
- 1158US10522382B2Method of manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 31, 2019·0 cites·20 claims
- 1258US9786540B2Method of manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 10, 2017·0 cites·20 claims
- 1353US6972241B2Method of forming an STI feature to avoid electrical charge leakageTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Dec 6, 2005·8 cites·22 claims
- 1450US11779967B2Particle removing assembly and method of servicing assemblyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 10, 2023·0 cites·20 claims
- 1543US8859424B2Semiconductor wafer carrier and method of manufacturingLU YUNG-JEAN·Filed 2010·Granted Oct 14, 2014·0 cites·20 claims
- 1630US2005124160A1Novel multi-gate formation procedure for gate oxide quality improvementTAIWAN SEMICONDUCTOR MFG·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →