Inventor · disambiguated record
Jae Seok Hwang
Also filed as: HWANG JAE SEOK
7 granted patents·1 pending application·23 citations·filing 2007–2010
79Inventor score
Top patents by PatentIndex Score
8 records- 0183US7765682B2Apparatus for attaching substratesADP ENGINEERING CO LTD·Filed 2007·Granted Aug 3, 2010·10 cites·20 claims
- 0281US7980287B2Adhesive chuck and substrate bonding apparatusADP ENGINEERING CO LTD·Filed 2008·Granted Jul 19, 2011·8 cites·22 claims
- 0371US7864289B2Apparatus and method for attaching substratesADP ENGINEERING CO LTD·Filed 2007·Granted Jan 4, 2011·3 cites·20 claims
- 0468US8245751B2Substrate bonding apparatusHWANG JAE SEOK·Filed 2008·Granted Aug 21, 2012·2 cites·9 claims
- 0550US8072573B2Apparatus and method for attaching substratesHWANG JAE SEOK·Filed 2010·Granted Dec 6, 2011·0 cites·10 claims
- 0646US8363377B2Electrostatic chuck and apparatus having the sameADP ENGINEERING CO LTD·Filed 2008·Granted Jan 29, 2013·0 cites·9 claims
- 0746US7640960B2Apparatus for attaching substratesADP ENGINEERING CO LTD·Filed 2007·Granted Jan 5, 2010·0 cites·20 claims
- 0836US2009056866A1Substrate bonding apparatus and methodHWANG JAE SEOK·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →