Inventor · disambiguated record

Jae Sung Kwak

Also filed as: KWAK JAE SUNG

6 granted patents·312 citations·filing 1999–2006

85Inventor score

Technology areasH10W

Files withAMKOR TECHNOLOGY INC6

Top patents by PatentIndex Score

6 records

0197US6448633B1Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulantAMKOR TECHNOLOGY INC·Filed 1999·Granted Sep 10, 2002·258 cites·4 claims
0282US6825062B2Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulantAMKOR TECHNOLOGY INC·Filed 2002·Granted Nov 30, 2004·26 cites·16 claims
0378US7564122B2Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulantAMKOR TECHNOLOGY INC·Filed 2006·Granted Jul 21, 2009·6 cites·19 claims
0472US7057280B2Leadframe having lead locks to secure leads to encapsulantAMKOR TECHNOLOGY INC·Filed 2003·Granted Jun 6, 2006·14 cites·18 claims
0561US7322507B2Transducer assembly, capillary and wire bonding method using the sameAMKOR TECHNOLOGY INC·Filed 2005·Granted Jan 29, 2008·3 cites·18 claims
0631US6225379B1Epoxy resin composition for bonding semiconductor chipsAMKOR TECHNOLOGY INC·Filed 1999·Granted May 1, 2001·5 cites·6 claims

Join the waitlist — get patent alerts

Get an alert when Jae Sung Kwak files or is granted a new patent.

We store only your email — no account needed. See our privacy policy.

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →