Inventor · disambiguated record

Jaecheon Lee

Also filed as: LEE JAECHEON

2 granted patents·5 citations·filing 2019–2019

43Inventor score

Technology areasH10W

Files withNEPES CO LTD2

Top patents by PatentIndex Score

2 records

0181US10957654B2Semiconductor package and method of manufacturing the sameNEPES CO LTD·Filed 2019·Granted Mar 23, 2021·5 cites·11 claims
0239US11062990B2Semiconductor package of using insulating frameNEPES CO LTD·Filed 2019·Granted Jul 13, 2021·0 cites·20 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →