Inventor · disambiguated record

Jan-Lian Liao

Also filed as: LIAO Jan-Lian

0 granted patents·2 pending applications·0 citations·filing 2016–2017

Technology areasH10D H10W

Files withXINTEC INC2

Top patents by PatentIndex Score

2 records

0134US2017207194A1Chip package and method for forming the sameXINTEC INC·Filed 2017·Application pending·0 cites
0229US2017025370A1Chip scale sensing chip package and a manufacturing method thereofXINTEC INC·Filed 2016·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →