Inventor · disambiguated record
Jae Young Na
Also filed as: NA JAE YOUNG
19 granted patents·2 pending applications·19 citations·filing 2007–2023
88Inventor score
Top patents by PatentIndex Score
21 records- 0189US12230449B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2022·Granted Feb 18, 2025·1 cites·30 claims
- 0288US10796853B2Electronic componentSAMSUNG ELECTRO MECH·Filed 2018·Granted Oct 6, 2020·3 cites·18 claims
- 0383US7847386B1Reduced size stacked semiconductor package and method of making the sameAMKOR TECHNOLOGY INC·Filed 2007·Granted Dec 7, 2010·14 cites·20 claims
- 0471US12322557B2Electronic component and board having the same mounted thereonSAMSUNG ELECTRO MECH·Filed 2022·Granted Jun 3, 2025·0 cites·20 claims
- 0569US10553355B2Electronic component, board having the same, and method of manufacturing metal frameSAMSUNG ELECTRO MECH·Filed 2017·Granted Feb 4, 2020·1 cites·16 claims
- 0666US11355288B2Electronic component and board having the same mounted thereonSAMSUNG ELECTRO MECH·Filed 2020·Granted Jun 7, 2022·0 cites·20 claims
- 0759US12148572B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2022·Granted Nov 19, 2024·0 cites·38 claims
- 0858US12176149B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2022·Granted Dec 24, 2024·0 cites·39 claims
- 0958US11302481B2Electronic component and substrate having the same mounted thereonSAMSUNG ELECTRO MECH·Filed 2020·Granted Apr 12, 2022·0 cites·24 claims
- 1057US12198860B2Multilayer electronic component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2022·Granted Jan 14, 2025·0 cites·32 claims
- 1157US11631536B2Electronic componentSAMSUNG ELECTRO MECH·Filed 2021·Granted Apr 18, 2023·0 cites·17 claims
- 1256US12094655B2Electronic component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2021·Granted Sep 17, 2024·0 cites·19 claims
- 1356US11569039B2Conductive powder particle for internal electrode and electronic component, and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2021·Granted Jan 31, 2023·0 cites·20 claims
- 1456US10734161B2Multilayer electronic component and board having the sameSAMSUNG ELECTRO MECH·Filed 2018·Granted Aug 4, 2020·0 cites·15 claims
- 1554US11276529B2Electronic component and board having the same mounted thereonSAMSUNG ELECTRO MECH·Filed 2020·Granted Mar 15, 2022·0 cites·20 claims
- 1654US10319530B2Electronic component and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2017·Granted Jun 11, 2019·0 cites·8 claims
- 1754US2024222025A1Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2023·Application pending·0 cites
- 1852US10879007B2Electronic componentSAMSUNG ELECTRO MECH·Filed 2018·Granted Dec 29, 2020·0 cites·20 claims
- 1951US2023215640A1Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2022·Application pending·0 cites
- 2050US10971304B2Electronic component having metal framesSAMSUNG ELECTRO MECH·Filed 2018·Granted Apr 6, 2021·0 cites·9 claims
- 2140US11081276B2Electronic componentSAMSUNG ELECTRO MECH·Filed 2018·Granted Aug 3, 2021·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →