Inventor · disambiguated record
Jae-Woong Nah
Also filed as: NAH JAE-WOONG
138 granted patents·22 pending applications·699 citations·filing 2000–2024
99Inventor score
Top patents by PatentIndex Score
160 records- 0199US8987132B2Double solder bumps on substrates for low temperature flip chip bondingIBM·Filed 2014·Granted Mar 24, 2015·76 cites·2 claims
- 0297US9606308B2Three dimensional self-alignment of flip chip assembly using solder surface tension during solder reflowIBM·Filed 2015·Granted Mar 28, 2017·25 cites·20 claims
- 0397US8828860B2Double solder bumps on substrates for low temperature flip chip bondingGRUBER PETER A·Filed 2012·Granted Sep 9, 2014·30 cites·23 claims
- 0496US10692831B1Stud bumps for post-measurement qubit frequency modificationIBM·Filed 2019·Granted Jun 23, 2020·12 cites·24 claims
- 0595US9773751B1Via and trench filling using injection molded solderingIBM·Filed 2016·Granted Sep 26, 2017·11 cites·17 claims
- 0695US8669137B2Copper post solder bumps on substrateNAH JAE-WOONG·Filed 2011·Granted Mar 11, 2014·33 cites·11 claims
- 0794US12439834B2Solder-shielded chip bondingIBM·Filed 2022·Granted Oct 7, 2025·1 cites·10 claims
- 0894US9761516B1Via and trench filling using injection molded solderingIBM·Filed 2016·Granted Sep 12, 2017·9 cites·14 claims
- 0994US8381966B2Flip chip assembly method employing post-contact differential heatingIBM·Filed 2011·Granted Feb 26, 2013·14 cites·17 claims
- 1093US8162203B1Spherical solder reflow methodGRUBER PETER A·Filed 2011·Granted Apr 24, 2012·14 cites·16 claims
- 1193US8162200B2Micro-fluidic injection molded solder (IMS)BUCHWALTER STEPHEN L·Filed 2011·Granted Apr 24, 2012·12 cites·8 claims
- 1293US7931187B2Injection molded solder method for forming solder bumps on substratesIBM·Filed 2008·Granted Apr 26, 2011·16 cites·16 claims
- 1392US10879202B1System and method for forming solder bumpsIBM·Filed 2019·Granted Dec 29, 2020·6 cites·15 claims
- 1492US8820612B2Injection molded solder process for forming solder bumps on substratesFEGER CLAUDIUS·Filed 2012·Granted Sep 2, 2014·13 cites·9 claims
- 1592US7838954B2Semiconductor structure with solder bumpsIBM·Filed 2008·Granted Nov 23, 2010·24 cites·16 claims
- 1692US7780063B2Techniques for arranging solder balls and forming bumpsIBM·Filed 2008·Granted Aug 24, 2010·12 cites·16 claims
- 1791US9466590B1Optimized solder pads for microelectronic componentsIBM·Filed 2015·Granted Oct 11, 2016·7 cites·9 claims
- 1891US7786001B2Electrical interconnect structure and methodIBM·Filed 2007·Granted Aug 31, 2010·16 cites·9 claims
- 1990US9704822B2Bonding substrates using solder surface tension during solder reflow for three dimensional self-alignment of substratesIBM·Filed 2015·Granted Jul 11, 2017·7 cites·20 claims
- 2090US8877556B2Copper post solder bumps on substratesIBM·Filed 2013·Granted Nov 4, 2014·7 cites·5 claims
- 2190US8870051B2Flip chip assembly apparatus employing a warpage-suppressor assemblyBROFMAN PETER J·Filed 2012·Granted Oct 28, 2014·15 cites·25 claims
- 2290US8008122B1Pressurized underfill cureIBM·Filed 2010·Granted Aug 30, 2011·13 cites·24 claims
- 2390US7980446B2Micro-fluidic injection molded solder (IMS)INTERNAT BUSINSS MACHINES CORP·Filed 2009·Granted Jul 19, 2011·10 cites·20 claims
- 2490US7868457B2Thermo-compression bonded electrical interconnect structure and methodIBM·Filed 2007·Granted Jan 11, 2011·17 cites·8 claims
- 2589US10490525B1High speed handling of ultra-small chips by selective laser bonding and debondingIBM·Filed 2018·Granted Nov 26, 2019·5 cites·16 claims
- 2689US10383572B2Via and trench filling using injection molded solderingIBM·Filed 2017·Granted Aug 20, 2019·4 cites·20 claims
- 2789US9721919B2Solder bumps formed on wafers using preformed solder balls with different compositions and sizesIBM·Filed 2015·Granted Aug 1, 2017·6 cites·7 claims
- 2889US9318641B2Nanowires formed by employing solder nanodotsIBM·Filed 2015·Granted Apr 19, 2016·2 cites·9 claims
- 2989US8963340B2No flow underfill or wafer level underfill and solder columnsFEGER CLAUDIUS·Filed 2011·Granted Feb 24, 2015·8 cites·16 claims
- 3089US8523046B1Forming an array of metal balls or shapes on a substrateIBM·Filed 2012·Granted Sep 3, 2013·8 cites·11 claims
- 3189US8492262B2Direct IMS (injection molded solder) without a mask for forming solder bumps on substratesGRUBER PETER A·Filed 2010·Granted Jul 23, 2013·11 cites·9 claims
- 3288US10692795B2Flip chip assembly of quantum computing devicesIBM·Filed 2018·Granted Jun 23, 2020·4 cites·11 claims
- 3388US9082754B2Metal cored solder decal structure and processGRUBER PETER A·Filed 2012·Granted Jul 14, 2015·5 cites·13 claims
- 3488US8685858B2Formation of metal nanospheres and microspheresHONG AUGUSTIN J·Filed 2011·Granted Apr 1, 2014·4 cites·7 claims
- 3588US8541291B2Thermo-compression bonded electrical interconnect structure and methodFURMAN BRUCE K·Filed 2011·Granted Sep 24, 2013·8 cites·20 claims
- 3687US9012266B2Copper post solder bumps on substratesIBM·Filed 2014·Granted Apr 21, 2015·5 cites·21 claims
- 3787US8561880B2Forming metal preforms and metal ballsGRUBER PETER ALFRED·Filed 2012·Granted Oct 22, 2013·4 cites·7 claims
- 3887US7928585B2Sprocket opening alignment process and apparatus for multilayer solder decalIBM·Filed 2007·Granted Apr 19, 2011·13 cites·17 claims
- 3987US6362090B1Method for forming flip chip bump and UBM for high speed copper interconnect chip using electroless plating methodKOREA ADVANCED INST SCI & TECH·Filed 2000·Granted Mar 26, 2002·50 cites·4 claims
- 4086US8912045B2Three dimensional flip chip system and methodDANG BING·Filed 2012·Granted Dec 16, 2014·7 cites·1 claims
- 4186US8651359B2Flip chip bonder head for forming a uniform filletGAYNES MICHAEL A·Filed 2010·Granted Feb 18, 2014·9 cites·12 claims
- 4286US8053283B2Die level integrated interconnect decal manufacturing method and apparatusIBM·Filed 2010·Granted Nov 8, 2011·7 cites·9 claims
- 4385US8875978B2Forming constant diameter spherical metal ballsIBM·Filed 2013·Granted Nov 4, 2014·3 cites·5 claims
- 4484US9231133B2Nanowires formed by employing solder nanodotsFOGEL KEITH E·Filed 2010·Granted Jan 5, 2016·2 cites·15 claims
- 4584US9095081B1Double solder bumps on substrates for low temperature flip chip bondingIBM·Filed 2015·Granted Jul 28, 2015·3 cites·4 claims
- 4684US8945995B2Copper post solder bumps on substratesIBM·Filed 2013·Granted Feb 3, 2015·4 cites·5 claims
- 4784US8921221B2IMS (injection molded solder) with two resist layers forming solder bumps on substratesMCLEOD MARK H·Filed 2011·Granted Dec 30, 2014·11 cites·19 claims
- 4883US9633925B1Visualization of alignment marks on a chip covered by a pre-applied underfillGLOBALFOUNDRIES INC·Filed 2016·Granted Apr 25, 2017·4 cites·20 claims
- 4983US9263378B1Ball grid array and land grid array assemblies fabricated using temporary resistIBM·Filed 2014·Granted Feb 16, 2016·4 cites·16 claims
- 5083US8759963B2Underfill material dispensing for stacked semiconductor chipsIBM·Filed 2013·Granted Jun 24, 2014·5 cites·7 claims
Showing the top 50 of 160 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →