Inventor · disambiguated record
James Sabatini
Also filed as: SABATINI JAMES · SABATINI JAMES E · SABATINI JAMES ENRICO
20 granted patents·9 pending applications·55 citations·filing 2001–2024
92Inventor score
Files withGEN ELECTRIC15KAPUSTA CHRISTOPHER JAMES5SABATINI JAMES2WISNUDEL MARC BRIAN2BURDICK WILLIAM E JR1
Top patents by PatentIndex Score
29 records- 0190US8026608B2Stackable electronic packageGEN ELECTRIC·Filed 2009·Granted Sep 27, 2011·13 cites·9 claims
- 0287US7403011B2Self-shielded packaging for circuitry integrated with receiver coils in a imaging systemGEN ELECTRIC·Filed 2006·Granted Jul 22, 2008·15 cites·23 claims
- 0386US8163596B2Stackable electronic package and method of making sameKAPUSTA CHRISTOPHER JAMES·Filed 2009·Granted Apr 24, 2012·12 cites·17 claims
- 0485US8536700B2Stackable electronic package and method of fabricating sameSABATINI JAMES·Filed 2011·Granted Sep 17, 2013·6 cites·6 claims
- 0574USRE47651EStackable electronic package and method of fabricating sameGEN ELECTRIC·Filed 2017·Granted Oct 15, 2019·1 cites·27 claims
- 0672US9514782B2Method and system for activation of an optical articleHERSHEY JOHN ERIK·Filed 2008·Granted Dec 6, 2016·2 cites·27 claims
- 0771US2024237966A1Neuromodulation energy application techniquesGE PREC HEALTHCARE LLC·Filed 2024·Application pending·0 cites
- 0869US9299661B2Integrated circuit package and method of making sameKAPUSTA CHRISTOPHER JAMES·Filed 2009·Granted Mar 29, 2016·4 cites·32 claims
- 0967US8387876B2Activation system and method for activating an optical articleWISNUDEL MARC BRIAN·Filed 2008·Granted Mar 5, 2013·1 cites·29 claims
- 1062US11826197B2Patient-specific neuromodulation alignment structuresGEN ELECTRIC·Filed 2021·Granted Nov 28, 2023·0 cites·20 claims
- 1161US11309304B2Stackable electronic package and method of fabricating sameGEN ELECTRIC·Filed 2018·Granted Apr 19, 2022·0 cites·5 claims
- 1258US11944490B2Neuromodulation energy application techniquesGEN ELECTRIC·Filed 2019·Granted Apr 2, 2024·0 cites·16 claims
- 1357US9999352B2System and method for determining a hydration level of a tissue regionGEN ELECTRIC·Filed 2013·Granted Jun 19, 2018·1 cites·20 claims
- 1457US8940582B2Stackable electronic package and method of fabricating sameGEN ELECTRIC·Filed 2013·Granted Jan 27, 2015·0 cites·8 claims
- 1556US8473974B2Activation system and method for activating an optical articleWISNUDEL MARC BRIAN·Filed 2008·Granted Jun 25, 2013·0 cites·31 claims
- 1654US10014286B2Stackable electronics package and method of fabricating sameSABATINI JAMES·Filed 2009·Granted Jul 3, 2018·0 cites·10 claims
- 1753US2010072090A1Packaging for an optical articleGEN ELECTRIC·Filed 2008·Application pending·0 cites
- 1852US2011156261A1Integrated circuit package and method of making sameKAPUSTA CHRISTOPHER JAMES·Filed 2009·Application pending·0 cites
- 1952US2007254468A1Lithography transfer for high density interconnect circuitsGEN ELECTRIC·Filed 2007·Application pending·0 cites
- 2051US9024447B2Stackable electronic package and method of making sameKAPUSTA CHRISTOPHER JAMES·Filed 2012·Granted May 5, 2015·0 cites·20 claims
- 2150US2015133753A1Arrays of emitters for pulse oximetry devices and methods of making the sameGEN ELECTRIC·Filed 2013·Application pending·0 cites
- 2249US9814419B2Pulse oximetry devices and systems and methods of making the sameGEN ELECTRIC·Filed 2016·Granted Nov 14, 2017·0 cites·19 claims
- 2348US8284057B2Security tag for optical media and processes for fabrication and attachmentKRISHNAN KASIRAMAN·Filed 2008·Granted Oct 9, 2012·0 cites·20 claims
- 2447US2012171816A1Integrated circuit package and method of making sameKAPUSTA CHRISTOPHER JAMES·Filed 2011·Application pending·0 cites
- 2545US7564125B2Electronic array and methods for fabricating sameGEN ELECTRIC·Filed 2002·Granted Jul 21, 2009·0 cites·6 claims
- 2643US2006068576A1Lithography transfer for high density interconnect circuitsBURDICK WILLIAM E JR·Filed 2004·Application pending·0 cites
- 2741US2018271372A1Magnetic resonance compatible ultrasound probeGEN ELECTRIC·Filed 2018·Application pending·0 cites
- 2839US2004264148A1Method and system for fan fold packagingFiled 2003·Application pending·0 cites
- 2936US6429381B1High density interconnect multichip module stack and fabrication methodGEN ELECTRIC·Filed 2001·Granted Aug 6, 2002·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →