Inventor · disambiguated record
Jae Beum Shim
Also filed as: SHIM JAE BEUM
4 granted patents·1 pending application·16 citations·filing 2014–2016
68Inventor score
Files withAMKOR TECHNOLOGY INC5
Top patents by PatentIndex Score
5 records- 0191US9716071B2Semiconductor device redistribution layer with narrow trace width relative to passivation layer openingAMKOR TECHNOLOGY INC·Filed 2015·Granted Jul 25, 2017·12 cites·24 claims
- 0275US9653336B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted May 16, 2017·2 cites·20 claims
- 0365US9704747B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2014·Granted Jul 11, 2017·2 cites·17 claims
- 0440US9871011B2Semiconductor package using a contact in a pleated sidewall encapsulant openingAMKOR TECHNOLOGY INC·Filed 2016·Granted Jan 16, 2018·0 cites·21 claims
- 0533US2017194239A1A semiconductor package having an etched groove for an embedded device formed on bottom surface of a support substrate and a method for fabricating the sameAMKOR TECHNOLOGY INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →