Inventor · disambiguated record
Jae Yong Song
Also filed as: SONG JAE YONG
5 granted patents·4 pending applications·5 citations·filing 1999–2021
68Inventor score
Files withKOREA RES INST STANDARDS & SCI3KOREA BASIC SCIENCE INST2ST ASSEMBLY TEST SERVICES LTD2STATS CHIPPAC LTD1
Top patents by PatentIndex Score
9 records- 0165US7443039B2System for different bond pads in an integrated circuit packageST ASSEMBLY TEST SERVICES LTD·Filed 2005·Granted Oct 28, 2008·3 cites·10 claims
- 0263US10381125B2Anisotropic, transparent, electroconductive, and flexible thin film structure including vertically aligned nanolines and method for preparing sameKOREA RES INST STANDARDS & SCI·Filed 2018·Granted Aug 13, 2019·0 cites·22 claims
- 0350US9972414B2Anisotropic, transparent, electroconductive, and flexible thin film structure including vertically aligned nanolines and method for preparing sameKOREA RES INST STANDARDS & SCI·Filed 2013·Granted May 15, 2018·0 cites·10 claims
- 0447US2021310975A1In-situ optical and electrochemical analysis method and battery cell section measurement module thereforKOREA BASIC SCIENCE INST·Filed 2021·Application pending·0 cites
- 0544US7005370B2Method of manufacturing different bond pads on the same substrate of an integrated circuit packageST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Feb 28, 2006·2 cites·10 claims
- 0644US2022250911A1Method for forming black phosphorusKOREA RES INST STANDARDS & SCI·Filed 2020·Application pending·0 cites
- 0736US11821956B2In-situ optical and electrochemical analysis method and battery cell measurement module thereforKOREA BASIC SCIENCE INST·Filed 2021·Granted Nov 21, 2023·0 cites·7 claims
- 0834US2006160267A1Under bump metallurgy in integrated circuitsSTATS CHIPPAC LTD·Filed 2005·Application pending·0 cites
- 0921US2002017341A1Iron-based soft magnetic thin film alloyFiled 1999·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →