Inventor · disambiguated record
Jason L. Strader
Also filed as: STRADER JASON · STRADER JASON L
42 granted patents·13 pending applications·346 citations·filing 2002–2025
98Inventor score
Files withLAIRD TECHNOLOGIES INC46THERMAGON INC4DUPONT ELECTRONIC MAT HOLDING INC2STRADER JASON L2STRADER JASON1
Top patents by PatentIndex Score
55 records- 0195US10600714B2Methods for establishing thermal joints between heat spreaders or lids and heat sourcesLAIRD TECHNOLOGIES INC·Filed 2019·Granted Mar 24, 2020·4 cites·20 claims
- 0294US12289876B2Thermally-conductive electromagnetic interference (EMI) absorbers including aluminum powderLAIRD TECHNOLOGIES INC·Filed 2023·Granted Apr 29, 2025·0 cites·29 claims
- 0393US11864366B2Thermally-conductive electromagnetic interference (EMI) absorbers including aluminum powderLAIRD TECHNOLOGIES INC·Filed 2021·Granted Jan 2, 2024·2 cites·24 claims
- 0493US9330998B2Thermal interface material assemblies and related methodsLAIRD TECHNOLOGIES INC·Filed 2014·Granted May 3, 2016·15 cites·16 claims
- 0591US9781819B2Multifunctional components for electronic devices and related methods of providing thermal management and board level shieldingLAIRD TECHNOLOGIES INC·Filed 2016·Granted Oct 3, 2017·7 cites·15 claims
- 0690US10965333B2Thermal management assemblies suitable for use with transceivers and other devicesLAIRD TECHNOLOGIES INC·Filed 2019·Granted Mar 30, 2021·12 cites·20 claims
- 0790US10964617B2Methods for establishing thermal joints between heat spreaders or lids and heat sourcesLAIRD TECHNOLOGIES INC·Filed 2020·Granted Mar 30, 2021·2 cites·20 claims
- 0890US9771508B2Thermal interface materials including thermally reversible gelsLAIRD TECHNOLOGIES INC·Filed 2016·Granted Sep 26, 2017·8 cites·21 claims
- 0989US8647752B2Thermal interface material assemblies, and related methodsSTRADER JASON L·Filed 2010·Granted Feb 11, 2014·13 cites·29 claims
- 1089US8445102B2Thermal interface material with thin transfer film or metallizationSTRADER JASON L·Filed 2008·Granted May 21, 2013·27 cites·33 claims
- 1188US10741519B2Systems of applying materials to componentsLAIRD TECHNOLOGIES INC·Filed 2018·Granted Aug 11, 2020·6 cites·18 claims
- 1288US8545987B2Thermal interface material with thin transfer film or metallizationSTRADER JASON·Filed 2007·Granted Oct 1, 2013·24 cites·32 claims
- 1387US10389397B2Small form-factor pluggable (SFP) transceiversLAIRD TECHNOLOGIES INC·Filed 2017·Granted Aug 20, 2019·8 cites·23 claims
- 1487US7369411B2Thermal interface assembly and method for forming a thermal interface between a microelectronic component package and heat sinkTHERMAGON INC·Filed 2004·Granted May 6, 2008·51 cites·8 claims
- 1586US11610831B2Methods for establishing thermal joints between heat spreaders or lids and heat sourcesLAIRD TECHNOLOGIES INC·Filed 2021·Granted Mar 21, 2023·1 cites·26 claims
- 1686US10087351B2Materials including thermally reversible gelsLAIRD TECHNOLOGIES INC·Filed 2017·Granted Oct 2, 2018·4 cites·24 claims
- 1786US9795059B2Thermal interface materials with thin film or metallizationLAIRD TECHNOLOGIES INC·Filed 2013·Granted Oct 17, 2017·9 cites·20 claims
- 1886US7078109B2Heat spreading thermal interface structureTHERMAGON INC·Filed 2004·Granted Jul 18, 2006·48 cites·8 claims
- 1985US6617517B2Multi-layer structure having a thermal interface with low contact resistance between a microelectronic component package and a heat sinkTHERMAGON INC·Filed 2002·Granted Sep 9, 2003·32 cites·5 claims
- 2082US11776868B2Methods for establishing thermal joints between heat spreaders or lids and heat sourcesLAIRD TECHNOLOGIES INC·Filed 2023·Granted Oct 3, 2023·0 cites·27 claims
- 2182US11678470B2Thermally-conductive electromagnetic interference (EMI) absorbers with silicon carbideLAIRD TECHNOLOGIES INC·Filed 2022·Granted Jun 13, 2023·1 cites·31 claims
- 2281US10555439B2Thermal interface materials with reinforcement for abrasion resistance and/or suitable for use between sliding componentsLAIRD TECHNOLOGIES INC·Filed 2018·Granted Feb 4, 2020·3 cites·19 claims
- 2381US10477738B2Board level shields and systems and methods of applying board level shieldingLAIRD TECHNOLOGIES INC·Filed 2018·Granted Nov 12, 2019·1 cites·20 claims
- 2480US11411263B2Thermal management and/or EMI mitigation materials including coated fillersLAIRD TECHNOLOGIES INC·Filed 2020·Granted Aug 9, 2022·1 cites·20 claims
- 2580US10373891B2Methods for establishing thermal joints between heat spreaders or lids and heat sourcesLAIRD TECHNOLOGIES INC·Filed 2014·Granted Aug 6, 2019·3 cites·13 claims
- 2680US2025267832A1Thermally-conductive electromagnetic interference (emi) absorbers including aluminum powderLAIRD TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
- 2779US12369291B2Thermally-conductive electromagnetic interference (EMI) absorbers with silicon carbideLAIRD TECHNOLOGIES INC·Filed 2023·Granted Jul 22, 2025·0 cites·37 claims
- 2877USD999405SMaterial having edgingLAIRD TECHNOLOGIES INC·Filed 2020·Granted Sep 19, 2023·6 cites·1 claims
- 2977USD881822SMaterial having an edge shapeLAIRD TECHNOLOGIES INC·Filed 2017·Granted Apr 21, 2020·15 cites·1 claims
- 3077US10334716B2Multifunctional components for electronic devices and related methods of providing thermal management and board level shieldingLAIRD TECHNOLOGIES INC·Filed 2018·Granted Jun 25, 2019·2 cites·20 claims
- 3176US6849941B1Heat sink and heat spreader assemblyTHERMAGON INC·Filed 2004·Granted Feb 1, 2005·23 cites·7 claims
- 3273US11984570B2Thermal management and/or EMI mitigation materials including coated fillersLAIRD TECHNOLOGIES INC·Filed 2022·Granted May 14, 2024·0 cites·29 claims
- 3373US9515004B2Thermal interface materialsLAIRD TECHNOLOGIES INC·Filed 2013·Granted Dec 6, 2016·3 cites·20 claims
- 3471USD998827SMaterial having edge shapeLAIRD TECHNOLOGIES INC·Filed 2020·Granted Sep 12, 2023·4 cites·1 claims
- 3570US10453773B2Devices for absorbing energy from electronic componentsLAIRD TECHNOLOGIES INC·Filed 2018·Granted Oct 22, 2019·1 cites·20 claims
- 3669US11483948B2Thermal interface materials including memory foam coresLAIRD TECHNOLOGIES INC·Filed 2020·Granted Oct 25, 2022·1 cites·20 claims
- 3768US11014203B2System for applying interface materialsLAIRD TECHNOLOGIES INC·Filed 2016·Granted May 25, 2021·1 cites·29 claims
- 3867US2025387872A1Polishing pad with thermal management featuresDUPONT ELECTRONIC MAT HOLDING INC·Filed 2024·Application pending·0 cites
- 3966US2025387871A1Polishing pad having filled non-porous sub-padDUPONT ELECTRONIC MAT HOLDING INC·Filed 2024·Application pending·0 cites
- 4060US10978369B2Devices for absorbing energy from electronic componentsLAIRD TECHNOLOGIES INC·Filed 2019·Granted Apr 13, 2021·0 cites·20 claims
- 4159USD879046SMaterial having edgingLAIRD TECHNOLOGIES INC·Filed 2017·Granted Mar 24, 2020·8 cites·1 claims
- 4259US2025098121A1Non-Condensing Thermal Materials With Low Sulfur ContentLAIRD TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 4358US12040306B2Systems of applying materials to componentsLAIRD TECHNOLOGIES INC·Filed 2020·Granted Jul 16, 2024·0 cites·20 claims
- 4453US10741471B2Highly compliant non-silicone putties and thermal interface materials including the sameLAIRD TECHNOLOGIES INC·Filed 2019·Granted Aug 11, 2020·0 cites·21 claims
- 4551US2025259966A1Controlling Bond Line Thickness (BLT) For Metal AmalgamsLAIRD TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
- 4651US2019023962A1Materials Including Thermally Reversible GelsLAIRD TECHNOLOGIES INC·Filed 2018·Application pending·0 cites
- 4751US2025257432A1Rheology controlled metal amalgams by including non-refractory filler particlesLAIRD TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
- 4845USD1101702SEdging for materialsLAIRD TECHNOLOGIES INC·Filed 2023·Granted Nov 11, 2025·0 cites·1 claims
- 4944US2014368992A1Methods For Establishing Thermal Joints Between Heat Spreaders and Heat Generating Components Using Thermoplastic and/or Self-Healing Thermal Interface MaterialsLAIRD TECHNOLOGIES INC·Filed 2013·Application pending·0 cites
- 5043US2025266319A1Reducing the spreading of material(s) migrating from thermal management and/or electromagnetic interference (emi) mitigation materialsLAIRD TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
Showing the top 50 of 55 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →