Inventor · disambiguated record
Jacob Vehonsky
Also filed as: VEHONSKY JACOB · VEHONSKY JACOB RYAN
4 granted patents·18 pending applications·2 citations·filing 2019–2025
59Inventor score
Top patents by PatentIndex Score
22 records- 0177US12362250B2Protruding SN substrate features for epoxy flow controlINTEL CORP·Filed 2024·Granted Jul 15, 2025·0 cites·19 claims
- 0277US2025273599A1Soldered metallic reservoirs for enhanced transient and steady-state thermal performanceINTEL CORP·Filed 2025·Application pending·0 cites
- 0376US12009271B2Protruding SN substrate features for epoxy flow controlINTEL CORP·Filed 2019·Granted Jun 11, 2024·2 cites·26 claims
- 0475US12334453B2Soldered metallic reservoirs for enhanced transient and steady-state thermal performanceINTEL CORP·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
- 0570US2024243088A1Copperless regions to control plating growthINTEL CORP·Filed 2024·Application pending·0 cites
- 0658US2025125201A1Package substrates with components included in cavities of glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 0758US2025126814A1Package substrates with components included in cavities of glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 0858US2025125202A1Package substrates with components included in cavities of glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 0958US2025120102A1Package substrates with components included in cavities of glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 1054US2021035921A1Soldered metallic reservoirs for enhanced transient and steady-state thermal performanceINTEL CORP·Filed 2019·Application pending·0 cites
- 1153US2025112136A1Glass core protection using peripheral buffer layersINTEL CORP·Filed 2023·Application pending·0 cites
- 1252US2025112163A1Through-glass via liners for integrated circuit device packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 1351US2021082852A1Copperless regions to control plating growthINTEL CORP·Filed 2019·Application pending·0 cites
- 1451US2025183182A1Microelectronic assemblies with through-glass via stress alleviation in glass coresSHAN BOHAN·Filed 2023·Application pending·0 cites
- 1547US11776864B2Corner guard for improved electroplated first level interconnect bump height rangeINTEL CORP·Filed 2019·Granted Oct 3, 2023·0 cites·25 claims
- 1645US2023086180A1Deformable semiconductor device connectionINTEL CORP·Filed 2021·Application pending·0 cites
- 1744US2023086649A1Semiconductor Chip Package Having Internal I/O Structures With Modulated Thickness To Compensate For Die/Substrate WarpageINTEL CORP·Filed 2021·Application pending·0 cites
- 1844US2024079530A1Ic package with micro ledsINTEL CORP·Filed 2022·Application pending·0 cites
- 1943US2024215163A1Substrate glass core patterning for ctv improvement and layer count reductionINTEL CORP·Filed 2022·Application pending·0 cites
- 2043US2023096835A1Methods and apparatus to reduce defects in interconnects between semicondcutor dies and package substratesINTEL CORP·Filed 2021·Application pending·0 cites
- 2142US2024079259A1Dual sided glass carriers for making package substratesINTEL CORP·Filed 2022·Application pending·0 cites
- 2241US2021066162A1Semiconductor package with attachment and/or stop structuresINTEL CORP·Filed 2019·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Jacob Vehonsky files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →