Soldered metallic reservoirs for enhanced transient and steady-state thermal performance

Abstract

Embodiments disclosed herein include electronic packages with thermal solutions. In an embodiment, an electronic package comprises a package substrate, a first die electrically coupled to the package substrate, and an integrated heat spreader (IHS) that is thermally coupled to a surface of the first die. In an embodiment, the IHS comprises a main body having an outer perimeter, and one or more legs attached to the outer perimeter of the main body, wherein the one or more legs are supported by the package substrate. In an embodiment, the electronic package further comprises a thermal block between the package substrate and the main body of the IHS, wherein the thermal block is within the outer perimeter of the main body.

What is claimed is: 
     
         1 . An electronic package, comprising:
 a package substrate;   a first die electrically coupled to the package substrate;   an integrated heat spreader (IHS) that is thermally coupled to a surface of the first die, wherein the IHS comprises:
 a main body having an outer perimeter; and 
 one or more legs attached to the outer perimeter of the main body, wherein the one or more legs are supported by the package substrate; and 
   a thermal block between the package substrate and the main body of the IHS, wherein the thermal block is within the outer perimeter of the main body.   
     
     
         2 . The electronic package of  claim 1 , wherein the thermal block is a part of the IHS. 
     
     
         3 . The electronic package of  claim 2 , wherein a bottom of the thermal block is attached to the package substrate by a solder. 
     
     
         4 . The electronic package of  claim 1 , wherein the thermal block is a pillar that extends up from the package substrate. 
     
     
         5 . The electronic package of  claim 4 , wherein a top surface of the thermal block is separated from the IHS by a thermal interface material (TIM). 
     
     
         6 . The electronic package of  claim 4 , wherein a bottom surface of the thermal block is attached to a metal plane that extends across a surface of the package substrate. 
     
     
         7 . The electronic package of  claim 1 , wherein the thermal block is adjacent to an edge of the first die. 
     
     
         8 . The electronic package of  claim 1 , wherein the thermal block wraps around a corner of the first die. 
     
     
         9 . The electronic package of  claim 1 , further comprising a plurality of thermal blocks. 
     
     
         10 . The electronic package of  claim 9 , wherein a first thermal block is adjacent to a first edge of the first die and a second thermal block is adjacent to a second edge of the first die. 
     
     
         11 . The electronic package of  claim 1 , further comprising:
 a second die, wherein the second die is adjacent to a first edge of the first die, and wherein the thermal block is adjacent to a second edge of the first die that is opposite from the first edge.   
     
     
         12 . The electronic package of  claim 11 , further comprising:
 a bridge embedded in the package substrate, wherein the bridge electrically couples the first die to the second die.   
     
     
         13 . An integrated heat spreader (IHS), comprising:
 a main body, wherein the main body comprises an outer perimeter;   a leg that extends away from the outer perimeter of the main body; and   a thermal block that extends away from the main body in the same direction as the leg.   
     
     
         14 . The IHS of  claim 13 , wherein the thermal block is an extruded feature. 
     
     
         15 . The IHS of  claim 13 , wherein a height of the thermal block is substantially equal to a height of the leg. 
     
     
         16 . The IHS of  claim 13 , wherein the leg entirely surrounds the main body. 
     
     
         17 . The IHS of  claim 13 , wherein a plurality of legs extend out from the main body. 
     
     
         18 . The IHS of  claim 13 , further comprising:
 a plurality of thermal blocks.   
     
     
         19 . The IHS of  claim 13 , wherein the thermal block is rectangular. 
     
     
         20 . The IHS of  claim 13 , wherein the thermal block is L-shaped. 
     
     
         21 . An electronic system, comprising:
 a board;   a package substrate electrically coupled to the board;   a die electrically coupled to the package substrate;   an integrated heat spreader (IHS) that is separated from the die by a first thermal interface material (TIM); and   a thermal block between the IHS and the package substrate.   
     
     
         22 . The electronic system of  claim 21 , further comprising:
 a heat sink thermally coupled to the IHS by a second TIM.   
     
     
         23 . The electronic system of  claim 21 , wherein the thermal block is attached to the IHS by a second TIM. 
     
     
         24 . The electronic system of  claim 21 , wherein the thermal block is an extruded member from the IHS. 
     
     
         25 . The electronic system of  claim 21 , wherein the thermal block is attached to a conductive plane on a surface of the package substrate.