Inventor · disambiguated record
Rahul Jain
Also filed as: JAIN RAHUL · JAIN RAHUL S
44 granted patents·10 pending applications·41 citations·filing 2015–2025
96Inventor score
Top patents by PatentIndex Score
54 records- 0196US11664290B2Package with underfill containment barrierINTEL CORP·Filed 2021·Granted May 30, 2023·3 cites·20 claims
- 0291US11443885B2Thin film barrier seed metallization in magnetic-plugged through hole inductorINTEL CORP·Filed 2018·Granted Sep 13, 2022·4 cites·12 claims
- 0389US11158558B2Package with underfill containment barrierINTEL CORP·Filed 2016·Granted Oct 26, 2021·5 cites·16 claims
- 0488US10373951B1Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling sameINTEL CORP·Filed 2018·Granted Aug 6, 2019·4 cites·23 claims
- 0585US11410921B2Methods to incorporate thin film capacitor sheets (TFC-S) in the build-up filmsINTEL CORP·Filed 2018·Granted Aug 9, 2022·4 cites·24 claims
- 0685US10297563B2Copper seed layer and nickel-tin microbump structuresINTEL CORP·Filed 2016·Granted May 21, 2019·4 cites·11 claims
- 0784US12327773B2Package with underfill containment barrierINTEL CORP·Filed 2024·Granted Jun 10, 2025·0 cites·20 claims
- 0884US12224264B2Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrateINTEL CORP·Filed 2023·Granted Feb 11, 2025·0 cites·20 claims
- 0984US10700021B2Coreless organic packages with embedded die and magnetic inductor structuresINTEL CORP·Filed 2018·Granted Jun 30, 2020·3 cites·11 claims
- 1082US10643994B2Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling sameINTEL CORP·Filed 2019·Granted May 5, 2020·2 cites·21 claims
- 1180US11935805B2Package with underfill containment barrierINTEL CORP·Filed 2023·Granted Mar 19, 2024·0 cites·20 claims
- 1278US2025149501A1Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrateINTEL CORP·Filed 2025·Application pending·0 cites
- 1377US12362250B2Protruding SN substrate features for epoxy flow controlINTEL CORP·Filed 2024·Granted Jul 15, 2025·0 cites·19 claims
- 1477US11581271B2Methods to pattern TFC and incorporation in the ODI architecture and in any build up layer of organic substrateINTEL CORP·Filed 2019·Granted Feb 14, 2023·2 cites·27 claims
- 1577US11557489B2Cavity structures in integrated circuit package supportsINTEL CORP·Filed 2018·Granted Jan 17, 2023·2 cites·20 claims
- 1677US11251113B2Methods of embedding magnetic structures in substratesINTEL CORP·Filed 2017·Granted Feb 15, 2022·2 cites·16 claims
- 1777US2025273599A1Soldered metallic reservoirs for enhanced transient and steady-state thermal performanceINTEL CORP·Filed 2025·Application pending·0 cites
- 1876US12009271B2Protruding SN substrate features for epoxy flow controlINTEL CORP·Filed 2019·Granted Jun 11, 2024·2 cites·26 claims
- 1975US12334453B2Soldered metallic reservoirs for enhanced transient and steady-state thermal performanceINTEL CORP·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
- 2075US11842981B2Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrateINTEL CORP·Filed 2021·Granted Dec 12, 2023·0 cites·20 claims
- 2173US10468374B2Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrateINTEL CORP·Filed 2017·Granted Nov 5, 2019·1 cites·22 claims
- 2272US12154715B2Methods to selectively embed magnetic materials in substrate and corresponding structuresINTEL CORP·Filed 2022·Granted Nov 26, 2024·0 cites·25 claims
- 2372US11881463B2Coreless organic packages with embedded die and magnetic inductor structuresINTEL CORP·Filed 2021·Granted Jan 23, 2024·0 cites·13 claims
- 2472US11737208B2Microelectronic assemblies having conductive structures with different thicknessesINTEL CORP·Filed 2019·Granted Aug 22, 2023·1 cites·13 claims
- 2572US11735537B2Methods to embed magnetic material as first layer on coreless substrates and corresponding structuresINTEL CORP·Filed 2022·Granted Aug 22, 2023·0 cites·23 claims
- 2671US11443892B2Substrate assembly with encapsulated magnetic featureINTEL CORP·Filed 2018·Granted Sep 13, 2022·1 cites·17 claims
- 2770US11862552B2Methods of embedding magnetic structures in substratesINTEL CORP·Filed 2022·Granted Jan 2, 2024·0 cites·7 claims
- 2870US11335632B2Magnetic inductor structures for package devicesINTEL CORP·Filed 2017·Granted May 17, 2022·1 cites·15 claims
- 2969US10971492B2Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling sameINTEL CORP·Filed 2020·Granted Apr 6, 2021·0 cites·21 claims
- 3069US2023345621A1Microelectronic assemblies having conductive structures with different thicknessesINTEL CORP·Filed 2023·Application pending·0 cites
- 3168US11901115B2Substrate assembly with encapsulated magnetic featureINTEL CORP·Filed 2022·Granted Feb 13, 2024·0 cites·20 claims
- 3267US11205626B2Coreless organic packages with embedded die and magnetic inductor structuresINTEL CORP·Filed 2020·Granted Dec 21, 2021·0 cites·30 claims
- 3366US11652071B2Electronic device package including a capacitorINTEL CORP·Filed 2021·Granted May 16, 2023·0 cites·5 claims
- 3464US11139264B2Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrateINTEL CORP·Filed 2019·Granted Oct 5, 2021·0 cites·20 claims
- 3564US2022230951A1Magnetic inductor structures for package devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 3656US11450471B2Methods to selectively embed magnetic materials in substrate and corresponding structuresINTEL CORP·Filed 2018·Granted Sep 20, 2022·0 cites·19 claims
- 3755US11417614B2Methods to embed magnetic material as first layer on coreless substrates and corresponding structuresINTEL CORP·Filed 2018·Granted Aug 16, 2022·0 cites·22 claims
- 3855US10923443B2Electronic device package including a capacitorINTEL CORP·Filed 2019·Granted Feb 16, 2021·0 cites·25 claims
- 3954US2021035921A1Soldered metallic reservoirs for enhanced transient and steady-state thermal performanceINTEL CORP·Filed 2019·Application pending·0 cites
- 4053US9820386B2Plasma etching of solder resist openingsINTEL CORP·Filed 2016·Granted Nov 14, 2017·0 cites·14 claims
- 4153US2019244922A1Nickel-tin microbump structures and method of making sameINTEL CORP·Filed 2019·Application pending·0 cites
- 4251US10672859B2Embedded magnetic inductorINTEL CORP·Filed 2018·Granted Jun 2, 2020·0 cites·12 claims
- 4347US11776864B2Corner guard for improved electroplated first level interconnect bump height rangeINTEL CORP·Filed 2019·Granted Oct 3, 2023·0 cites·25 claims
- 4447US11432405B2Methods for attaching large components in a package substrate for advanced power deliveryINTEL CORP·Filed 2018·Granted Aug 30, 2022·0 cites·17 claims
- 4547US11355459B2Embedding magnetic material, in a cored or coreless semiconductor packageINTEL CORP·Filed 2018·Granted Jun 7, 2022·0 cites·25 claims
- 4647US11244912B2Semiconductor package having a coaxial first layer interconnectINTEL CORP·Filed 2017·Granted Feb 8, 2022·0 cites·20 claims
- 4746US11610706B2Release layer-assisted selective embedding of magnetic material in cored and coreless organic substratesINTEL CORP·Filed 2018·Granted Mar 21, 2023·0 cites·12 claims
- 4845US11651902B2Patterning of thin film capacitors in organic substrate packagesINTEL CORP·Filed 2018·Granted May 16, 2023·0 cites·17 claims
- 4945US10705293B2Substrate integrated waveguideINTEL CORP·Filed 2015·Granted Jul 7, 2020·0 cites·16 claims
- 5043US12334447B2Lithographically defined vertical interconnect access (VIA) for a bridge die first level interconnect (FLI)INTEL CORP·Filed 2019·Granted Jun 17, 2025·0 cites·23 claims
Showing the top 50 of 54 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →