Inventor · disambiguated record
Thomas Heaton
Also filed as: HEATON THOMAS · HEATON THOMAS S · HEATON THOMAS STANLEY
10 granted patents·14 pending applications·19 citations·filing 2018–2025
84Inventor score
Top patents by PatentIndex Score
24 records- 0194US10431537B1Electromigration resistant and profile consistent contact arraysINTEL CORP·Filed 2018·Granted Oct 1, 2019·11 cites·26 claims
- 0290US11309239B2Electromigration resistant and profile consistent contact arraysINTEL CORP·Filed 2020·Granted Apr 19, 2022·2 cites·20 claims
- 0389US11935857B2Surface finishes with low RBTV for fine and mixed bump pitch architecturesINTEL CORP·Filed 2022·Granted Mar 19, 2024·1 cites·22 claims
- 0481US11488918B2Surface finishes with low rBTV for fine and mixed bump pitch architecturesINTEL CORP·Filed 2018·Granted Nov 1, 2022·3 cites·15 claims
- 0577US12362250B2Protruding SN substrate features for epoxy flow controlINTEL CORP·Filed 2024·Granted Jul 15, 2025·0 cites·19 claims
- 0677US2025273599A1Soldered metallic reservoirs for enhanced transient and steady-state thermal performanceINTEL CORP·Filed 2025·Application pending·0 cites
- 0776US12009271B2Protruding SN substrate features for epoxy flow controlINTEL CORP·Filed 2019·Granted Jun 11, 2024·2 cites·26 claims
- 0876US11699648B2Electromigration resistant and profile consistent contact arraysTAHOE RES LTD·Filed 2022·Granted Jul 11, 2023·0 cites·20 claims
- 0975US12334453B2Soldered metallic reservoirs for enhanced transient and steady-state thermal performanceINTEL CORP·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
- 1070US2024243088A1Copperless regions to control plating growthINTEL CORP·Filed 2024·Application pending·0 cites
- 1162US10854541B2Electromigration resistant and profile consistent contact arraysINTEL CORP·Filed 2019·Granted Dec 1, 2020·0 cites·24 claims
- 1261US2025132239A1Porous liners for through-glass vias and associated methodsINTEL CORP·Filed 2024·Application pending·0 cites
- 1355US2025379163A1Microelectronic assemblies having a glass layer substrate with integrated capacitorsINTEL CORP·Filed 2024·Application pending·0 cites
- 1454US2021035921A1Soldered metallic reservoirs for enhanced transient and steady-state thermal performanceINTEL CORP·Filed 2019·Application pending·0 cites
- 1553US2025112136A1Glass core protection using peripheral buffer layersINTEL CORP·Filed 2023·Application pending·0 cites
- 1651US2021082852A1Copperless regions to control plating growthINTEL CORP·Filed 2019·Application pending·0 cites
- 1751US2024222295A1Stacked inorganic-organic dielectrics for thin film capacitors in package substratesINTEL CORP·Filed 2022·Application pending·0 cites
- 1851US2024217216A1Ultrathin laminated glass and glass stiffeners for coreless packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 1951US2025183182A1Microelectronic assemblies with through-glass via stress alleviation in glass coresSHAN BOHAN·Filed 2023·Application pending·0 cites
- 2048US2024186136A1Polymeric films as an adhesive promotion/buffer layer at glass-dielectric or metal-dielectric interfacesINTEL CORP·Filed 2022·Application pending·0 cites
- 2147US11776864B2Corner guard for improved electroplated first level interconnect bump height rangeINTEL CORP·Filed 2019·Granted Oct 3, 2023·0 cites·25 claims
- 2247US2024096561A1Thin film capacitorsINTEL CORP·Filed 2022·Application pending·0 cites
- 2341US2021066162A1Semiconductor package with attachment and/or stop structuresINTEL CORP·Filed 2019·Application pending·0 cites
- 2435US2020066626A1Pocket structures, materials, and methods for integrated circuit package supportsINTEL CORP·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →