Inventor · disambiguated record
Edvin Cetegen
Also filed as: CETEGEN EDVIN
31 granted patents·24 pending applications·48 citations·filing 2012–2025
94Inventor score
Top patents by PatentIndex Score
55 records- 0194US12261150B2Mold shelf package design and process flow for advanced package architecturesINTEL CORP·Filed 2023·Granted Mar 25, 2025·1 cites·20 claims
- 0294US12087731B2No mold shelf package design and process flow for advanced package architecturesINTEL CORP·Filed 2023·Granted Sep 10, 2024·1 cites·18 claims
- 0392US10192810B2Underfill material flow control for reduced die-to-die spacing in semiconductor packagesINTEL CORP·Filed 2013·Granted Jan 29, 2019·13 cites·9 claims
- 0484US9741692B2Methods to form high density through-mold interconnectionsKARHADE OMKAR G·Filed 2014·Granted Aug 22, 2017·7 cites·14 claims
- 0582US11464139B2Conformable heat sink interface with a high thermal conductivityINTEL CORP·Filed 2018·Granted Oct 4, 2022·3 cites·20 claims
- 0680US11574851B2Coupled cooling fins in ultra-small systemsINTEL CORP·Filed 2019·Granted Feb 7, 2023·3 cites·23 claims
- 0779US11901333B2No mold shelf package design and process flow for advanced package architecturesINTEL CORP·Filed 2019·Granted Feb 13, 2024·1 cites·25 claims
- 0878US11282717B2Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gapINTEL CORP·Filed 2018·Granted Mar 22, 2022·2 cites·12 claims
- 0978US2025192101A1No mold shelf package design and process flow for advanced package architecturesINTEL CORP·Filed 2025·Application pending·0 cites
- 1077US12362250B2Protruding SN substrate features for epoxy flow controlINTEL CORP·Filed 2024·Granted Jul 15, 2025·0 cites·19 claims
- 1177US12068222B2Dummy die structures of a packaged integrated circuit deviceINTEL CORP·Filed 2020·Granted Aug 20, 2024·1 cites·15 claims
- 1277US2025273599A1Soldered metallic reservoirs for enhanced transient and steady-state thermal performanceINTEL CORP·Filed 2025·Application pending·0 cites
- 1376US12009271B2Protruding SN substrate features for epoxy flow controlINTEL CORP·Filed 2019·Granted Jun 11, 2024·2 cites·26 claims
- 1475US12334453B2Soldered metallic reservoirs for enhanced transient and steady-state thermal performanceINTEL CORP·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
- 1574US11551994B2Liquid metal TIM with STIM-like performance with no BSM and BGA compatibleINTEL CORP·Filed 2018·Granted Jan 10, 2023·2 cites·22 claims
- 1674US9477275B2Thermal management solution for circuit productsCHOUDHURY ARNAB·Filed 2013·Granted Oct 25, 2016·5 cites·17 claims
- 1771US10290561B2Thermal interfaces for integrated circuit packagesINTEL CORP·Filed 2016·Granted May 14, 2019·2 cites·13 claims
- 1870US2024136292A1Microelectronic structures including bridgesINTEL CORP·Filed 2023·Application pending·0 cites
- 1969US11776821B2Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gapINTEL CORP·Filed 2022·Granted Oct 3, 2023·0 cites·19 claims
- 2069US11735495B2Active package cooling structures using molded substrate packaging technologyINTEL CORP·Filed 2019·Granted Aug 22, 2023·1 cites·14 claims
- 2168US8951846B2Controlling thermal interface material bleed outKRISHNAN GOPI·Filed 2012·Granted Feb 10, 2015·4 cites·21 claims
- 2259US2025391807A1Dynamic substrate thermal displacement compensationINTEL CORP·Filed 2024·Application pending·0 cites
- 2358US2022199536A1Microelectronic structures including bridgesKARHADE OMKAR G·Filed 2020·Application pending·0 cites
- 2458US2025218998A1Low temperature solder interconnect for package pitch scalingINTEL CORP·Filed 2023·Application pending·0 cites
- 2557US2025112174A1Annealed shape memory alloy on a substrateINTEL CORP·Filed 2023·Application pending·0 cites
- 2655US11942393B2Substrate with thermal insulationINTEL CORP·Filed 2020·Granted Mar 26, 2024·0 cites·16 claims
- 2755US11854945B2Underfill material flow control for reduced die-to-die spacing in semiconductor packagesTAHOE RES LTD·Filed 2018·Granted Dec 26, 2023·0 cites·28 claims
- 2855US2025112164A1Controlling substrate bump heightINTEL CORP·Filed 2023·Application pending·0 cites
- 2954US11935861B2Underfill flow management in electronic assembliesINTEL CORP·Filed 2020·Granted Mar 19, 2024·0 cites·16 claims
- 3054US2021035921A1Soldered metallic reservoirs for enhanced transient and steady-state thermal performanceINTEL CORP·Filed 2019·Application pending·0 cites
- 3153US2025112136A1Glass core protection using peripheral buffer layersINTEL CORP·Filed 2023·Application pending·0 cites
- 3252US12176268B2Open cavity bridge co-planar placement architectures and processesINTEL CORP·Filed 2020·Granted Dec 24, 2024·0 cites·6 claims
- 3351US11887962B2Microelectronic structures including bridgesINTEL CORP·Filed 2020·Granted Jan 30, 2024·0 cites·7 claims
- 3451US11832419B2Full package vapor chamber with IHSINTEL CORP·Filed 2019·Granted Nov 28, 2023·0 cites·26 claims
- 3551US11791274B2Multichip semiconductor package including a bridge die disposed in a cavity having non-planar interconnectsINTEL CORP·Filed 2020·Granted Oct 17, 2023·0 cites·17 claims
- 3651US2024186280A1Thermocompression bonding tool for panel-level thermo-compression bondingINTEL CORP·Filed 2022·Application pending·0 cites
- 3751US2024213074A1Enhanced nozzle for disaggregated die handling during thermal compression bondingINTEL CORP·Filed 2022·Application pending·0 cites
- 3850US11646274B2Multi-package assemblies having foam structures for warpage controlINTEL CORP·Filed 2019·Granted May 9, 2023·0 cites·21 claims
- 3949US2024186251A1Symmetric dummy bridge design for fli alignment improvementINTEL CORP·Filed 2022·Application pending·0 cites
- 4048US2025006691A1Compliant inserts for pin dipping processesINTEL CORP·Filed 2023·Application pending·0 cites
- 4147US11776864B2Corner guard for improved electroplated first level interconnect bump height rangeINTEL CORP·Filed 2019·Granted Oct 3, 2023·0 cites·25 claims
- 4247US11545407B2Thermal management solutions for integrated circuit packagesINTEL CORP·Filed 2019·Granted Jan 3, 2023·0 cites·20 claims
- 4345US2023086180A1Deformable semiconductor device connectionINTEL CORP·Filed 2021·Application pending·0 cites
- 4444US11769753B2Thermally-optimized tunable stack in cavity package-on-packageINTEL CORP·Filed 2018·Granted Sep 26, 2023·0 cites·11 claims
- 4544US2023086649A1Semiconductor Chip Package Having Internal I/O Structures With Modulated Thickness To Compensate For Die/Substrate WarpageINTEL CORP·Filed 2021·Application pending·0 cites
- 4643US12002727B2Barrier structures for underfill containmentINTEL CORP·Filed 2020·Granted Jun 4, 2024·0 cites·13 claims
- 4743US11502008B2Dual strip backside metallization for improved alt-FLI plating, KOZ minimization, test enhancement and warpage controlINTEL CORP·Filed 2017·Granted Nov 15, 2022·0 cites·13 claims
- 4843US2022102231A1Dummy die in a recessed mold structure of a packaged integrated circuit deviceINTEL CORP·Filed 2020·Application pending·0 cites
- 4941US2021066162A1Semiconductor package with attachment and/or stop structuresINTEL CORP·Filed 2019·Application pending·0 cites
- 5041US2021028084A1Variable-thickness integrated heat spreader (ihs)INTEL CORP·Filed 2019·Application pending·0 cites
Showing the top 50 of 55 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →