Microelectronic structures including bridges

Abstract

Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.

1 . A microelectronic assembly, comprising:
 a substrate having a first conductive contact;   a bridge component having a second conductive contact on a first face of the bridge component and a third conductive contact on a second, opposing face of the bridge component, wherein the first conductive contact is coupled to the second conductive contact by first solder, and the first solder contacts side faces of the first conductive contact and the second conductive contact; and   a microelectronic component having a fourth conductive contact, wherein the third conductive contact is coupled to the fourth conductive contact by second solder, and the third conductive contact contacts the fourth conductive contact.   
     
     
         2 . The microelectronic assembly of  claim 1 , wherein the second solder does not contact solder coupling another conductive contact at the second face of the bridge component to another conductive contact of the microelectronic component. 
     
     
         3 . The microelectronic assembly of  claim 1 , wherein a diameter of the fourth conductive contact is different than a diameter of the third conductive contact. 
     
     
         4 . The microelectronic assembly of  claim 3 , wherein the diameter of one of the third conductive contact and the fourth conductive contact is less than 60% of the diameter of an other of the third conductive contact and the fourth conductive contact. 
     
     
         5 . The microelectronic assembly of  claim 1 , wherein the second solder contacts side faces of the fourth conductive contact. 
     
     
         6 . The microelectronic assembly of  claim 1 , wherein a center of the first conductive contact is not aligned with a center of the second conductive contact. 
     
     
         7 . The microelectronic assembly of  claim 1 , wherein the substrate includes an organic dielectric material. 
     
     
         8 . The microelectronic assembly of  claim 1 , wherein the microelectronic component is a first microelectronic component, the microelectronic assembly further includes a second microelectronic component, and the bridge component is at least partially between the second microelectronic component and the substrate. 
     
     
         9 . A microelectronic assembly, comprising:
 a substrate having a first conductive contact;   a bridge component having a second conductive contact on a first face of the bridge component and a third conductive contact on a second, opposing face of the bridge component, wherein the first conductive contact is coupled to the second conductive contact by first solder, and the first solder contacts side faces of the first conductive contact and the second conductive contact; and   a microelectronic component having a fourth conductive contact, wherein the third conductive contact is coupled to the fourth conductive contact by second solder.   
     
     
         10 . The microelectronic assembly of  claim 9 , wherein a diameter of the fourth conductive contact is less than a diameter of the third conductive contact. 
     
     
         11 . The microelectronic assembly of  claim 9 , wherein the second solder contacts side faces of the fourth conductive contact. 
     
     
         12 . The microelectronic assembly of  claim 9 , wherein a center of the first conductive contact is not aligned with a center of the second conductive contact. 
     
     
         13 . The microelectronic assembly of  claim 9 , wherein the first conductive contact is one of a plurality of first conductive contacts having a pitch that is greater than 50 microns. 
     
     
         14 . The microelectronic assembly of  claim 9 , wherein the substrate includes an organic dielectric material. 
     
     
         15 . A microelectronic assembly, comprising:
 a substrate having a first conductive contact;   a bridge component having a second conductive contact on a first face of the bridge component and a third conductive contact on a second, opposing face of the bridge component, wherein the first conductive contact is coupled to the second conductive contact by first solder; and   a microelectronic component having a fourth conductive contact, wherein the third conductive contact is coupled to the fourth conductive contact by second solder, and a diameter of the fourth conductive contact is different than a diameter of the third conductive contact.   
     
     
         16 . The microelectronic assembly of  claim 15 , wherein the diameter of one of the third conductive contact and the fourth conductive contact is less than 60% of the diameter of an other of the third conductive contact and the fourth conductive contact. 
     
     
         17 . The microelectronic assembly of  claim 15 , wherein the diameter of one of the third conductive contact and the fourth conductive contact is less than 50% of the diameter of an other of the third conductive contact and the fourth conductive contact. 
     
     
         18 . The microelectronic assembly of  claim 15 , wherein the second solder contacts side faces of the fourth conductive contact. 
     
     
         19 . The microelectronic assembly of  claim 15 , wherein the first solder contacts side faces of the first conductive contact and the second conductive contact. 
     
     
         20 . The microelectronic assembly of  claim 15 , wherein a center of the first conductive contact is not aligned with a center of the second conductive contact.