Inventor · disambiguated record
Tarek A. Ibrahim
Also filed as: IBRAHIM TAREK · IBRAHIM TAREK A · IBRAHIM TAREK ADLY
34 granted patents·55 pending applications·21 citations·filing 2013–2025
94Inventor score
Top patents by PatentIndex Score
89 records- 0197US11302643B2Microelectronic component having molded regions with through-mold viasINTEL CORP·Filed 2020·Granted Apr 12, 2022·5 cites·19 claims
- 0296US12176292B2Microelectronic component having molded regions with through-mold viasINTEL CORP·Filed 2023·Granted Dec 24, 2024·2 cites·20 claims
- 0395US11817390B2Microelectronic component having molded regions with through-mold viasINTEL CORP·Filed 2022·Granted Nov 14, 2023·2 cites·20 claims
- 0493US11164818B2Inorganic-based embedded-die layers for modular semiconductive devicesINTEL CORP·Filed 2019·Granted Nov 2, 2021·7 cites·19 claims
- 0587US2025070030A1Microelectronic component having molded regions with through-mold viasINTEL CORP·Filed 2024·Application pending·0 cites
- 0685US12422615B2Nested glass packaging architecture for hybrid electrical and optical communication devicesINTEL CORP·Filed 2021·Granted Sep 23, 2025·1 cites·11 claims
- 0783US12504581B2Photonic interconnect and components in glassINTEL CORP·Filed 2021·Granted Dec 23, 2025·1 cites·21 claims
- 0883US2025226323A1Microelectronic component having molded regions with through-mold viasINTEL CORP·Filed 2025·Application pending·0 cites
- 0980US12230564B2Package substrate z-disaggregation with liquid metal interconnectsINTEL CORP·Filed 2021·Granted Feb 18, 2025·1 cites·25 claims
- 1080US2025060531A1Photonic integrated circuit packaging architectureINTEL CORP·Filed 2024·Application pending·0 cites
- 1179US12300620B2Inorganic-based embedded-die layers for modular semiconductive devicesINTEL CORP·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 1277US12362250B2Protruding SN substrate features for epoxy flow controlINTEL CORP·Filed 2024·Granted Jul 15, 2025·0 cites·19 claims
- 1377US11640942B2Microelectronic component having molded regions with through-mold viasINTEL CORP·Filed 2022·Granted May 2, 2023·0 cites·20 claims
- 1477US2025273599A1Soldered metallic reservoirs for enhanced transient and steady-state thermal performanceINTEL CORP·Filed 2025·Application pending·0 cites
- 1576US12009271B2Protruding SN substrate features for epoxy flow controlINTEL CORP·Filed 2019·Granted Jun 11, 2024·2 cites·26 claims
- 1675US12334453B2Soldered metallic reservoirs for enhanced transient and steady-state thermal performanceINTEL CORP·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
- 1771US11798887B2Inorganic-based embedded-die layers for modular semiconductive devicesINTEL CORP·Filed 2021·Granted Oct 24, 2023·0 cites·20 claims
- 1870US12181710B2Photonic integrated circuit packaging architectureINTEL CORP·Filed 2021·Granted Dec 31, 2024·0 cites·20 claims
- 1964US12272484B2Coreless electronic substrates having embedded inductorsINTEL CORP·Filed 2021·Granted Apr 8, 2025·0 cites·21 claims
- 2063US2025062207A1Methods and apparatus to reduce cracking in glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 2162US12439826B2Integrated MEMS resonator and methodINTEL CORP·Filed 2021·Granted Oct 7, 2025·0 cites·21 claims
- 2262US12345932B2Die last and waveguide last architecture for silicon photonic packagingINTEL CORP·Filed 2021·Granted Jul 1, 2025·0 cites·19 claims
- 2361US12313890B2Through-substrate optical viasINTEL CORP·Filed 2021·Granted May 27, 2025·0 cites·20 claims
- 2461US12057252B2Electronic substrates having embedded inductorsINTEL CORP·Filed 2020·Granted Aug 6, 2024·0 cites·11 claims
- 2561US2024355758A1Methods and apparatus to reduce stress between sockets and associated integrated circuit packages having glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 2660US2025309522A1Antenna structures in glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 2759US12512396B2Flexible die to floor planning with bump pitch scale through glass core via pitchINTEL CORP·Filed 2021·Granted Dec 30, 2025·0 cites·16 claims
- 2859US2025300086A1Optical and electrical glass interposer with embedded bridgeINTEL CORP·Filed 2024·Application pending·0 cites
- 2958US12381029B2Stepped coax MIL PTHS for modulating inductance within a packageINTEL CORP·Filed 2020·Granted Aug 5, 2025·0 cites·19 claims
- 3058US2025096143A1Microelectronic assembly with bridge die and selective metallization layersINTEL CORP·Filed 2023·Application pending·0 cites
- 3158US2025112100A1Die embedded in glass layer with two-side connectivityINTEL CORP·Filed 2023·Application pending·0 cites
- 3257US2023089093A1In-built magnetic inductor schemes for glass core substratesINTEL CORP·Filed 2021·Application pending·0 cites
- 3357US2025096053A1Microelectronic assemblies having a bridge die over a glass patchINTEL CORP·Filed 2023·Application pending·0 cites
- 3457US2025112124A1Deep cavity arrangements on integrated circuit packagingINTEL CORP·Filed 2023·Application pending·0 cites
- 3557US2025293122A1Multi-die assemblies with glass support structuresINTEL CORP·Filed 2024·Application pending·0 cites
- 3657US2025273582A1Interconnections to package substrates for interconnect bridgesINTEL CORP·Filed 2024·Application pending·0 cites
- 3756US2024213156A1Liquid metal wells for interconnect architecturesINTEL CORP·Filed 2022·Application pending·0 cites
- 3856US2025107112A1Inductors for semiconductor package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 3956US2025183180A1Direct bonding for embedded bridges with viasINTEL CORP·Filed 2023·Application pending·0 cites
- 4055US2025112179A1Technologies for a coaxial inductor in a glass coreINTEL CORP·Filed 2023·Application pending·0 cites
- 4155US2024329333A1Co-packaging of photonic & electronic integrated circuit dieINTEL CORP·Filed 2023·Application pending·0 cites
- 4254US2024222301A1Methods and apparatus for optical thermal treatment in semiconductor packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 4354US2021035921A1Soldered metallic reservoirs for enhanced transient and steady-state thermal performanceINTEL CORP·Filed 2019·Application pending·0 cites
- 4454US2024113049A1Package substrate with open air gap structuresINTEL CORP·Filed 2022·Application pending·0 cites
- 4553US2024219660A1Optical semiconductor package and methodINTEL CORP·Filed 2022·Application pending·0 cites
- 4652US12249584B2Microelectronic assemblies having integrated magnetic core inductorsINTEL CORP·Filed 2021·Granted Mar 11, 2025·0 cites·20 claims
- 4752US2023317592A1Substrate with low-permittivity core and buildup layersINTEL CORP·Filed 2022·Application pending·0 cites
- 4852US2025004225A1Technologies for substrate features for a pluggable optical connectorINTEL CORP·Filed 2023·Application pending·0 cites
- 4952US2024027697A1Pluggable optical connector with interfacial alignment featuresINTEL CORP·Filed 2022·Application pending·0 cites
- 5052US2024006297A1Silicide and silicon nitride layers between a dielectric and copperINTEL CORP·Filed 2022·Application pending·0 cites
Showing the top 50 of 89 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →