Inventor · disambiguated record
Sergio Antonio Chan Arguedas
Also filed as: CHAN ARGUEDAS SERGIO · CHAN ARGUEDAS SERGIO A · CHAN ARGUEDAS SERGIO ANTONIO
24 granted patents·13 pending applications·30 citations·filing 2016–2025
92Inventor score
Files withINTEL CORP37
Top patents by PatentIndex Score
37 records- 0192US12238892B2Immersion cooling for integrated circuit devicesINTEL CORP·Filed 2020·Granted Feb 25, 2025·3 cites·15 claims
- 0292US11735552B2Microelectronic package with solder array thermal interface material (SA-TIM)INTEL CORP·Filed 2019·Granted Aug 22, 2023·6 cites·20 claims
- 0390US11328978B2Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispenseINTEL CORP·Filed 2017·Granted May 10, 2022·6 cites·25 claims
- 0481US11112841B25G mmWave cooling through PCBINTEL CORP·Filed 2017·Granted Sep 7, 2021·3 cites·14 claims
- 0580US2025096178A1Microelectronic package with solder array thermal interface material (sa-tim)INTEL CORP·Filed 2024·Application pending·0 cites
- 0679US12205915B2Microelectronic package with solder array thermal interface material (SA-TIM)INTEL CORP·Filed 2023·Granted Jan 21, 2025·0 cites·20 claims
- 0777US12362250B2Protruding SN substrate features for epoxy flow controlINTEL CORP·Filed 2024·Granted Jul 15, 2025·0 cites·19 claims
- 0877US11894282B2Vented lids for integrated circuit packagesINTEL CORP·Filed 2019·Granted Feb 6, 2024·2 cites·20 claims
- 0977US2025273599A1Soldered metallic reservoirs for enhanced transient and steady-state thermal performanceINTEL CORP·Filed 2025·Application pending·0 cites
- 1076US12009271B2Protruding SN substrate features for epoxy flow controlINTEL CORP·Filed 2019·Granted Jun 11, 2024·2 cites·26 claims
- 1176US11682605B2Integrated circuit packages with asymmetric adhesion material regionsINTEL CORP·Filed 2019·Granted Jun 20, 2023·3 cites·20 claims
- 1275US12334453B2Soldered metallic reservoirs for enhanced transient and steady-state thermal performanceINTEL CORP·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
- 1372US12272614B2Integrated circuit packages with solder thermal interface materials with embedded particlesINTEL CORP·Filed 2019·Granted Apr 8, 2025·2 cites·20 claims
- 1470US12062592B2Integrated circuit packages with thermal interface materials with different material compositionsINTEL CORP·Filed 2019·Granted Aug 13, 2024·2 cites·30 claims
- 1570US11776869B2Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispenseINTEL CORP·Filed 2022·Granted Oct 3, 2023·0 cites·20 claims
- 1665US11328979B2Substrate integrated posts and heat spreader customization for enhanced package thermomechanicsINTEL CORP·Filed 2017·Granted May 10, 2022·1 cites·25 claims
- 1761US2022256715A15G mmWAVE COOLING THROUGH PCBINTEL CORP·Filed 2021·Application pending·0 cites
- 1860US2025309008A1Solder thermal interface core attached with low-temperature solder paste for microelectronic devicesINTEL CORP·Filed 2024·Application pending·0 cites
- 1957US2025309030A1Microelectronic structures including ihs coupling enhancement structures for thermal degradation mitigationINTEL CORP·Filed 2024·Application pending·0 cites
- 2056US2025306312A1Photonic integrated circuit packages including a barrier material to confine a thermal interface materialINTEL CORP·Filed 2024·Application pending·0 cites
- 2154US2021035921A1Soldered metallic reservoirs for enhanced transient and steady-state thermal performanceINTEL CORP·Filed 2019·Application pending·0 cites
- 2252US11881438B2First-level integration of second-level thermal interface material for integrated circuit assembliesINTEL CORP·Filed 2020·Granted Jan 23, 2024·0 cites·18 claims
- 2351US12080620B2Additively manufactured structures for heat dissipation from integrated circuit devicesINTEL CORP·Filed 2020·Granted Sep 3, 2024·0 cites·21 claims
- 2451US11832419B2Full package vapor chamber with IHSINTEL CORP·Filed 2019·Granted Nov 28, 2023·0 cites·26 claims
- 2551US11798861B2Integrated heat spreader (IHS) with heating elementINTEL CORP·Filed 2019·Granted Oct 24, 2023·0 cites·20 claims
- 2651US2024222288A1Socket interface frames for devices with improved-performance substratesINTEL CORP·Filed 2022·Application pending·0 cites
- 2751US2024006378A1Multiple composition thermal interface materials for multi-die packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 2847US11817369B2Lids for integrated circuit packages with solder thermal interface materialsINTEL CORP·Filed 2019·Granted Nov 14, 2023·0 cites·20 claims
- 2947US11776864B2Corner guard for improved electroplated first level interconnect bump height rangeINTEL CORP·Filed 2019·Granted Oct 3, 2023·0 cites·25 claims
- 3046US11935799B2Integrated circuit package lids with polymer featuresINTEL CORP·Filed 2019·Granted Mar 19, 2024·0 cites·18 claims
- 3146US11791237B2Microelectronic assemblies including a thermal interface materialINTEL CORP·Filed 2018·Granted Oct 17, 2023·0 cites·13 claims
- 3245US10672625B2Electronic device package with recessed substrate for underfill containmentINTEL CORP·Filed 2016·Granted Jun 2, 2020·0 cites·16 claims
- 3342US2021020537A1Integrated heat spreader (ihs) with solder thermal interface material (stim) bleed-out restricting featureINTEL CORP·Filed 2019·Application pending·0 cites
- 3441US11004768B2Multi-chip package with partial integrated heat spreaderINTEL CORP·Filed 2019·Granted May 11, 2021·0 cites·15 claims
- 3541US2020411407A1Integrated circuit packages with solder thermal interface materialINTEL CORP·Filed 2019·Application pending·0 cites
- 3641US2021066162A1Semiconductor package with attachment and/or stop structuresINTEL CORP·Filed 2019·Application pending·0 cites
- 3741US2021028084A1Variable-thickness integrated heat spreader (ihs)INTEL CORP·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →