Inventor · disambiguated record
James M. Wark
Also filed as: WARK JAMES · WARK JAMES M
173 granted patents·8 pending applications·7,882 citations·filing 1996–2018
99Inventor score
Files withMICRON TECHNOLOGY INC164AKRAM SALMAN6APTINA IMAGING CORP4WARK JAMES M4MIRCON TECHNOLOGY INC1
Top patents by PatentIndex Score
181 records- 0199US7498675B2Semiconductor component having plate, stacked dice and conductive viasMICRON TECHNOLOGY INC·Filed 2007·Granted Mar 3, 2009·292 cites·20 claims
- 0299US6841883B1Multi-dice chip scale semiconductor components and wafer level methods of fabricationMICRON TECHNOLOGY INC·Filed 2003·Granted Jan 11, 2005·659 cites·71 claims
- 0399US5866953APackaged die on PCB with heat sink encapsulantMICRON TECHNOLOGY INC·Filed 1996·Granted Feb 2, 1999·290 cites·61 claims
- 0498US7683458B2Through-wafer interconnects for photoimager and memory wafersMICRON TECHNOLOGY INC·Filed 2007·Granted Mar 23, 2010·54 cites·17 claims
- 0598US6613662B2Method for making projected contact structures for engaging bumped semiconductor devicesMICRON TECHNOLOGY INC·Filed 2001·Granted Sep 2, 2003·128 cites·121 claims
- 0698US6078186AForce applying probe card and test system for semiconductor wafersMICRON TECHNOLOGY INC·Filed 1997·Granted Jun 20, 2000·197 cites·44 claims
- 0798US5973403ADevice and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit diceMICRON TECHNOLOGY INC·Filed 1997·Granted Oct 26, 1999·255 cites·18 claims
- 0898US5696031ADevice and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit diceMICRON TECHNOLOGY INC·Filed 1996·Granted Dec 9, 1997·196 cites·32 claims
- 0997US7300857B2Through-wafer interconnects for photoimager and memory wafersMICRON TECHNOLOGY INC·Filed 2004·Granted Nov 27, 2007·166 cites·32 claims
- 1097US6841868B2Memory modules including capacity for additional memoryMICRON TECHNOLOGY INC·Filed 2001·Granted Jan 11, 2005·83 cites·14 claims
- 1197US6025730ADirect connect interconnect for testing semiconductor dice and wafersMICRON TECHNOLOGY INC·Filed 1997·Granted Feb 15, 2000·162 cites·22 claims
- 1297US5952840AApparatus for testing semiconductor wafersMICRON TECHNOLOGY INC·Filed 1996·Granted Sep 14, 1999·128 cites·21 claims
- 1397US5929521AProjected contact structure for bumped semiconductor device and resulting articles and assembliesMICRON TECHNOLOGY INC·Filed 1997·Granted Jul 27, 1999·179 cites·78 claims
- 1497US5817540AMethod of fabricating flip-chip on leads devices and resulting assembliesMICRON TECHNOLOGY INC·Filed 1996·Granted Oct 6, 1998·262 cites·26 claims
- 1596US7452743B2Microelectronic imaging units and methods of manufacturing microelectronic imaging units at the wafer levelAPTINA IMAGING CORP·Filed 2005·Granted Nov 18, 2008·52 cites·34 claims
- 1695US7956443B2Through-wafer interconnects for photoimager and memory wafersMICRON TECHNOLOGY INC·Filed 2010·Granted Jun 7, 2011·16 cites·17 claims
- 1795US6605956B2Device and method for testing integrated circuit dice in an integrated circuit moduleMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 12, 2003·70 cites·17 claims
- 1895US6531772B2Electronic system including memory module with redundant memory capabilityMICRON TECHNOLOGY INC·Filed 2001·Granted Mar 11, 2003·62 cites·20 claims
- 1995US6420892B1Calibration target for calibrating semiconductor wafer test systemsMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 16, 2002·62 cites·16 claims
- 2095US6252308B1Packaged die PCB with heat sink encapsulantMICRON TECHNOLOGY INC·Filed 1998·Granted Jun 26, 2001·120 cites·69 claims
- 2195US6165814AThin film capacitor coupons for memory modules and multi-chip modulesMICRON TECHNOLOGY INC·Filed 1999·Granted Dec 26, 2000·138 cites·13 claims
- 2295US6060769AFlip-chip on leads devicesMICRON TECHNOLOGY INC·Filed 1997·Granted May 9, 2000·158 cites·15 claims
- 2395US5931685AInterconnect for making temporary electrical connections with bumped semiconductor componentsMICRON TECHNOLOGY INC·Filed 1997·Granted Aug 3, 1999·158 cites·24 claims
- 2495US5915977ASystem and interconnect for making temporary electrical connections with bumped semiconductor componentsMICRON TECHNOLOGY INC·Filed 1998·Granted Jun 29, 1999·164 cites·24 claims
- 2595US5894218AMethod and apparatus for automatically positioning electronic dice within component packagesMICRON TECHNOLOGY INC·Filed 1996·Granted Apr 13, 1999·137 cites·42 claims
- 2695US5893726ASemiconductor package with pre-fabricated cover and method of fabricationMICRON TECHNOLOGY INC·Filed 1997·Granted Apr 13, 1999·174 cites·23 claims
- 2794US6342724B1Thin film capacitor coupons for memory modules and multi-chip modulesMICRON TECHNOLOGY INC·Filed 2000·Granted Jan 29, 2002·80 cites·20 claims
- 2894US6295978B1Method for reducing damage to wafer cutting blades during wafer dicingMICRON TECHNOLOGY INC·Filed 2000·Granted Oct 2, 2001·38 cites·20 claims
- 2994US6239590B1Calibration target for calibrating semiconductor wafer test systemsMICRON TECHNOLOGY INC·Filed 1998·Granted May 29, 2001·70 cites·28 claims
- 3094US6072323ATemporary package, and method system for testing semiconductor dice having backside electrodesMICRON TECHNOLOGY INC·Filed 1997·Granted Jun 6, 2000·97 cites·32 claims
- 3194US5982018AThin film capacitor coupons for memory modules and multi-chip modulesMICRON TECHNOLOGY INC·Filed 1997·Granted Nov 9, 1999·121 cites·33 claims
- 3294US5766982AMethod and apparatus for underfill of bumped or raised dieMICRON TECHNOLOGY INC·Filed 1996·Granted Jun 16, 1998·114 cites·54 claims
- 3393US7205661B2Projected contact structures for engaging bumped semiconductor devices and methods of making the sameMICRON TECHNOLOGY INC·Filed 2005·Granted Apr 17, 2007·18 cites·219 claims
- 3493US6720652B2Apparatus providing redundancy for fabricating highly reliable memory modulesMICRON TECHNOLOGY INC·Filed 2002·Granted Apr 13, 2004·45 cites·8 claims
- 3593US5809987AApparatus for reducing damage to wafer cutting blades during wafer dicingMICRON TECHNOLOGY INC·Filed 1996·Granted Sep 22, 1998·57 cites·2 claims
- 3692US7459393B2Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contactsMICRON TECHNOLOGY INC·Filed 2006·Granted Dec 2, 2008·58 cites·15 claims
- 3792US6399416B1Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit diceMICRON TECHNOLOGY INC·Filed 2000·Granted Jun 4, 2002·40 cites·32 claims
- 3892US6057597ASemiconductor package with pre-fabricated coverMICRON TECHNOLOGY INC·Filed 1998·Granted May 2, 2000·107 cites·27 claims
- 3991US7115495B2Methods of making projected contact structures for engaging bumped semiconductor devicesMICRON TECHNOLOGY INC·Filed 2003·Granted Oct 3, 2006·39 cites·119 claims
- 4091US7060526B2Wafer level methods for fabricating multi-dice chip scale semiconductor componentsMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 13, 2006·96 cites·38 claims
- 4191US6600334B1Force applying probe card and test system for semiconductor wafersMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 29, 2003·43 cites·21 claims
- 4291US6553276B2Method of using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairsMICRON TECHNOLOGY INC·Filed 2002·Granted Apr 22, 2003·48 cites·35 claims
- 4391US6025731AHybrid interconnect and system for testing semiconductor diceMICRON TECHNOLOGY INC·Filed 1997·Granted Feb 15, 2000·75 cites·23 claims
- 4491US5807762AMulti-chip module system and method of fabricationMICRON TECHNOLOGY INC·Filed 1996·Granted Sep 15, 1998·83 cites·40 claims
- 4590US6362637B2Apparatus for testing semiconductor wafers including base with contact members and terminal contactsMICRON TECHNOLOGY INC·Filed 1999·Granted Mar 26, 2002·61 cites·20 claims
- 4690US6140149ADevice and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit diceMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 31, 2000·55 cites·32 claims
- 4790US5907492AMethod for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairsMICRON TECHNOLOGY INC·Filed 1997·Granted May 25, 1999·81 cites·26 claims
- 4889US6900459B2Apparatus for automatically positioning electronic dice within component packagesMICRON TECHNOLOGY INC·Filed 2002·Granted May 31, 2005·28 cites·42 claims
- 4989US6008538AMethod and apparatus providing redundancy for fabricating highly reliable memory modulesMICRON TECHNOLOGY INC·Filed 1996·Granted Dec 28, 1999·60 cites·19 claims
- 5088US7928579B2Devices including sloped vias in a substrate and devices including spring-like deflecting contactsMICRON TECHNOLOGY INC·Filed 2006·Granted Apr 19, 2011·14 cites·30 claims
Showing the top 50 of 181 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →