Inventor · disambiguated record
James Wilder
Also filed as: WILDER JAMES · WILDER JAMES G
30 granted patents·16 pending applications·976 citations·filing 2000–2017
98Inventor score
Files withSTAKTEK GROUP LP23ENTORIAN TECHNOLOGIES LP11CADY JAMES W43M INNOVATIVE PROPERTIES CO2STAKTEK GROUP L P A TEXAS LTD2
Top patents by PatentIndex Score
46 records- 0198US6576992B1Chip scale stacking system and methodSTAKTEK GROUP LP·Filed 2001·Granted Jun 10, 2003·162 cites·42 claims
- 0297US7595550B2Flex-based circuit moduleENTORIAN TECHNOLOGIES LP·Filed 2005·Granted Sep 29, 2009·36 cites·4 claims
- 0397US7053478B2Pitch change and chip scale stacking systemSTAKTEK GROUP LP·Filed 2004·Granted May 30, 2006·139 cites·34 claims
- 0497US6956284B2Integrated circuit stacking system and methodSTAKTEK GROUP LP·Filed 2004·Granted Oct 18, 2005·88 cites·14 claims
- 0597US6914324B2Memory expansion and chip scale stacking system and methodSTAKTEK GROUP LP·Filed 2003·Granted Jul 5, 2005·98 cites·15 claims
- 0696US7026708B2Low profile chip scale stacking system and methodSTAKTEK GROUP LP·Filed 2003·Granted Apr 11, 2006·79 cites·25 claims
- 0795US7443023B2High capacity thin module systemENTORIAN TECHNOLOGIES LP·Filed 2005·Granted Oct 28, 2008·31 cites·13 claims
- 0895US7094632B2Low profile chip scale stacking system and methodSTAKTEK GROUP LP·Filed 2004·Granted Aug 22, 2006·51 cites·6 claims
- 0994US7180167B2Low profile stacking system and methodSTAKTEK GROUP LP·Filed 2004·Granted Feb 20, 2007·61 cites·10 claims
- 1093US7446410B2Circuit module with thermal casing systemsENTORIAN TECHNOLOGIES LP·Filed 2005·Granted Nov 4, 2008·30 cites·34 claims
- 1190US7459784B2High capacity thin module systemENTORIAN TECHNOLOGIES LP·Filed 2007·Granted Dec 2, 2008·14 cites·10 claims
- 1290US6940729B2Integrated circuit stacking system and methodSTAKTEK GROUP LP·Filed 2002·Granted Sep 6, 2005·37 cites·3 claims
- 1390US6608763B1Stacking system and methodSTAKTEK GROUP LP·Filed 2000·Granted Aug 19, 2003·58 cites·24 claims
- 1489US7626259B2Heat sink for a high capacity thin module systemENTORIAN TECHNOLOGIES LP·Filed 2008·Granted Dec 1, 2009·13 cites·12 claims
- 1583US7524703B2Integrated circuit stacking system and methodENTORIAN TECHNOLOGIES LP·Filed 2005·Granted Apr 28, 2009·7 cites·13 claims
- 1681US7495334B2Stacking system and methodENTORIAN TECHNOLOGIES LP·Filed 2005·Granted Feb 24, 2009·6 cites·30 claims
- 1780US8841553B2Enclosure for a cable connectionDOWER WILLIAM V·Filed 2011·Granted Sep 23, 2014·10 cites·8 claims
- 1877US6955945B2Memory expansion and chip scale stacking system and methodSTAKTEK GROUP LP·Filed 2004·Granted Oct 18, 2005·13 cites·31 claims
- 1971US9543746B2Enclosure for a cable connection3M INNOVATIVE PROPERTIES CO·Filed 2014·Granted Jan 10, 2017·5 cites·8 claims
- 2070US10116086B2Enclosure for a cable connection3M INNOVATIVE PROPERTIES CO·Filed 2017·Granted Oct 30, 2018·2 cites·20 claims
- 2168US7737549B2Circuit module with thermal casing systemsENTORIAN TECHNOLOGIES LP·Filed 2008·Granted Jun 15, 2010·2 cites·6 claims
- 2262US7202555B2Pitch change and chip scale stacking system and methodSTAKTEK GROUP LP·Filed 2005·Granted Apr 10, 2007·2 cites·7 claims
- 2361US7586758B2Integrated circuit stacking systemENTORIAN TECHNOLOGIES LP·Filed 2004·Granted Sep 8, 2009·6 cites·13 claims
- 2460US7626273B2Low profile stacking system and methodENTORIAN TECHNOLOGIES L P·Filed 2009·Granted Dec 1, 2009·1 cites·7 claims
- 2557US7335975B2Integrated circuit stacking system and methodSTAKTEK GROUP LP·Filed 2004·Granted Feb 26, 2008·4 cites·30 claims
- 2656US7256484B2Memory expansion and chip scale stacking system and methodSTAKTEK GROUP LP·Filed 2004·Granted Aug 14, 2007·3 cites·12 claims
- 2756US6618257B1Wide data path stacking system and methodSTAKTEK GROUP LP·Filed 2001·Granted Sep 9, 2003·6 cites·34 claims
- 2854US7606048B2Integrated circuit stacking systemENTHORIAN TECHNOLOGIES LP·Filed 2004·Granted Oct 20, 2009·5 cites·20 claims
- 2953US2009273069A1Low profile chip scale stacking system and methodCADY JAMES W·Filed 2009·Application pending·0 cites
- 3052US7485951B2Modularized die stacking system and methodENTORIAN TECHNOLOGIES LP·Filed 2003·Granted Feb 3, 2009·6 cites·14 claims
- 3152US2007114649A1Low Profile Stacking System and MethodSTAKTEK GROUP L P A TEXAS LTD·Filed 2007·Application pending·0 cites
- 3252US2007117262A1Low Profile Stacking System and MethodSTAKTEK GROUP L P A TEXAS LTD·Filed 2007·Application pending·0 cites
- 3351US2006131716A1Stacking system and methodCADY JAMES W·Filed 2005·Application pending·0 cites
- 3451US2006091521A1Stacking system and methodCADY JAMES W·Filed 2005·Application pending·0 cites
- 3548US2009073661A1Thin circuit module and methodSTAKTEK GROUP LP·Filed 2007·Application pending·0 cites
- 3647US2008211077A1Low profile chip scale stacking system and methodCADY JAMES W·Filed 2006·Application pending·0 cites
- 3745US2004235222A1Integrated circuit stacking system and methodSTAKTEK GROUP LP·Filed 2004·Application pending·0 cites
- 3845US2008067662A1Modularized Die Stacking System and MethodSTAKTEK GROUP LP·Filed 2007·Application pending·0 cites
- 3945US2005067683A1Memory expansion and chip scale stacking system and methodSTAKTEK GROUP LP·Filed 2004·Application pending·0 cites
- 4044US7542304B2Memory expansion and integrated circuit stacking system and methodENTORIAN TECHNOLOGIES LP·Filed 2004·Granted Jun 2, 2009·1 cites·17 claims
- 4144US2004178496A1Memory expansion and chip scale stacking system and methodSTAKTEK GROP L P·Filed 2004·Application pending·0 cites
- 4243US2003137048A1Stacking system and methodSTAKTEK GROUP LP·Filed 2003·Application pending·0 cites
- 4342US2006033187A1Rugged CSP module system and methodSTAKTEK GROUP LP·Filed 2004·Application pending·0 cites
- 4442US2003234443A1Low profile stacking system and methodSTAKTEK GROUP LP·Filed 2003·Application pending·0 cites
- 4540US2004245615A1Point to point memory expansion system and methodSTAKTEK GROUP LP·Filed 2003·Application pending·0 cites
- 4639US2006043558A1Stacked integrated circuit cascade signaling system and methodSTAKTEK GROUP LP·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →