Inventor · disambiguated record
Jason Wright
Also filed as: WRIGHT JASON · WRIGHT JASON R · WRIGHT JASON ROBERT
35 granted patents·10 pending applications·378 citations·filing 2002–2025
97Inventor score
Files withTECHNETICS GROUP LLC6SYNCHRON AUSTRALIA PTY LTD4VINCENT MICHAEL B4FREESCALE SEMICONDUCTOR INC3GONG ZHIWEI3
Top patents by PatentIndex Score
45 records- 0197US9299670B2Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereofYAP WENG F·Filed 2013·Granted Mar 29, 2016·39 cites·20 claims
- 0295US8900364B2High productivity vapor processing systemWRIGHT JASON·Filed 2011·Granted Dec 2, 2014·188 cites·19 claims
- 0394US8216918B2Method of forming a packaged semiconductor deviceGONG ZHIWEI·Filed 2010·Granted Jul 10, 2012·22 cites·5 claims
- 0492US12223106B2Systems and methods for generic control using a neural signalSYNCHRON AUSTRALIA PTY LTD·Filed 2023·Granted Feb 11, 2025·2 cites·16 claims
- 0589US9331029B2Microelectronic packages having mold-embedded traces and methods for the production thereofVINCENT MICHAEL B·Filed 2014·Granted May 3, 2016·11 cites·20 claims
- 0688US7845308B1Systems incorporating microwave heaters within fluid supply lines of substrate processing chambers and methods for use of such systemsLAM RES CORP·Filed 2006·Granted Dec 7, 2010·11 cites·16 claims
- 0787US9093457B2Stacked microelectronic packages having patterned sidewall conductors and methods for the fabrication thereofGONG ZHIWEI·Filed 2012·Granted Jul 28, 2015·10 cites·13 claims
- 0887US8733280B2Showerhead for processing chamberYAP LIPYEOW·Filed 2010·Granted May 27, 2014·6 cites·15 claims
- 0986US9142502B2Semiconductor device packaging having pre-encapsulation through via formation using drop-in signal conduitsGONG ZHIWEI·Filed 2011·Granted Sep 22, 2015·9 cites·13 claims
- 1085US8592241B2Method for packaging an electronic device assembly having a capped device interconnectHAYES SCOTT M·Filed 2011·Granted Nov 26, 2013·12 cites·19 claims
- 1185US6832950B2Polishing pad with windowAPPLIED MATERIALS INC·Filed 2002·Granted Dec 21, 2004·26 cites·33 claims
- 1283US9899298B2Microelectronic packages having mold-embedded traces and methods for the production thereofFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Feb 20, 2018·1 cites·20 claims
- 1383US8609519B2Combinatorial approach for screening of ALD film stacksLEE ALBERT·Filed 2011·Granted Dec 17, 2013·5 cites·18 claims
- 1482US9761570B1Electronic component package with multple electronic componentsFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Sep 12, 2017·4 cites·22 claims
- 1581US9190390B2Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereofGONG ZHIWEI TONY·Filed 2012·Granted Nov 17, 2015·8 cites·20 claims
- 1678US10340251B2Method for making an electronic component packageNXP USA INC·Filed 2017·Granted Jul 2, 2019·3 cites·18 claims
- 1775US12359306B2Deposition processing systems having active temperature control and associated methodsTECHNETICS GROUP LLC·Filed 2022·Granted Jul 15, 2025·0 cites·12 claims
- 1875US9502363B2Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layersVINCENT MICHAEL B·Filed 2014·Granted Nov 22, 2016·4 cites·16 claims
- 1975US9025340B2Devices and stacked microelectronic packages with in-trench package surface conductors and methods of their fabricationWRIGHT JASON R·Filed 2013·Granted May 5, 2015·5 cites·4 claims
- 2074US9305911B2Devices and stacked microelectronic packages with package surface conductors and adjacent trenches and methods of their fabricationVINCENT MICHAEL B·Filed 2013·Granted Apr 5, 2016·3 cites·20 claims
- 2173US12333074B2Systems for controlling one or more devices using a signal control unitSYNCHRON AUSTRALIA PTY LTD·Filed 2024·Granted Jun 17, 2025·0 cites·26 claims
- 2273US2025335030A1Systems for controlling one or more devices using a signal control unitSYNCHRON AUSTRALIA PTY LTD·Filed 2025·Application pending·0 cites
- 2373US2024419248A1Systems and methods for generic control using a neural signalSYNCHRON AUSTRALIA PTY LTD·Filed 2024·Application pending·0 cites
- 2467US11332821B2Deposition processing systems having active temperature control and associated methodsTECHNETICS GROUP LLC·Filed 2018·Granted May 17, 2022·0 cites·21 claims
- 2567US10998231B2Method for increasing semiconductor device wafer strengthNXP USA INC·Filed 2019·Granted May 4, 2021·1 cites·16 claims
- 2666US8906790B2Combinatorial approach for screening of ALD film stacksINTERMOLECULAR INC·Filed 2013·Granted Dec 9, 2014·1 cites·20 claims
- 2764US10596503B1Metal seal with an integral filterTECHNETICS GROUP LLC·Filed 2017·Granted Mar 24, 2020·1 cites·19 claims
- 2864US9257415B2Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereofVINCENT MICHAEL B·Filed 2015·Granted Feb 9, 2016·1 cites·20 claims
- 2962US7892950B2Methodology for processing a panel during semiconductor device fabricationFREESCALE SEMICONDUCTOR INC·Filed 2009·Granted Feb 22, 2011·2 cites·19 claims
- 3059US9064977B2Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereofGONG TONY ZHIWEI·Filed 2012·Granted Jun 23, 2015·2 cites·18 claims
- 3159US2014236728A1Interactive service and advertising systems and methodsSEELN SYSTEMS INC·Filed 2014·Application pending·0 cites
- 3255US11307970B2Systems and methods for quality control application and testing from profile discoveryT MOBILE USA INC·Filed 2019·Granted Apr 19, 2022·0 cites·20 claims
- 3355US8925481B2Systems and methods for measuring, monitoring and controlling ozone concentrationSHAO SHOUQIAN·Filed 2011·Granted Jan 6, 2015·1 cites·15 claims
- 3453US2024296318A1Neuromonitoring systemsOXLEY THOMAS JAMES·Filed 2024·Application pending·0 cites
- 3549US8851010B2Systems and methods for measuring, monitoring and controlling ozone concentrationSHAO SHOUQIAN·Filed 2011·Granted Oct 7, 2014·0 cites·12 claims
- 3648US2013125818A1Combinatorial deposition based on a spot apparatusWRIGHT JASON·Filed 2011·Application pending·0 cites
- 3745US11673161B2Methods of manufacturing electrostatic chucksTECHNETICS GROUP LLC·Filed 2020·Granted Jun 13, 2023·0 cites·20 claims
- 3844US9281293B2Microelectronic packages having layered interconnect structures and methods for the manufacture thereofMAGNUS ALAN J·Filed 2013·Granted Mar 8, 2016·0 cites·20 claims
- 3943US11718905B2Functionally integrated coating structuresTECHNETICS GROUP LLC·Filed 2018·Granted Aug 8, 2023·0 cites·5 claims
- 4043US10727195B2Bond materials with enhanced plasma resistant characteristics and associated methodsTECHNETICS GROUP LLC·Filed 2018·Granted Jul 28, 2020·0 cites·20 claims
- 4142US2014130922A1Control Methods and Hardware Configurations for Ozone Delivery SystemsINTERMOLECULAR INC·Filed 2012·Application pending·0 cites
- 4238US2013152857A1Substrate Processing Fluid Delivery System and MethodWRIGHT JASON·Filed 2011·Application pending·0 cites
- 4337US2013270103A1Method Of Enabling And Controlling Ozone Concentration And FlowSHAO SHOUQIAN·Filed 2012·Application pending·0 cites
- 4435US2013154091A1Semiconductor device packaging using encapsulated conductive balls for package-on-package back side couplingWRIGHT JASON R·Filed 2011·Application pending·0 cites
- 4529US2013164948A1Methods for improving wafer temperature uniformityROMERO MARTIN·Filed 2011·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Jason Wright files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →