Inventor · disambiguated record
Jacob Wylie
Also filed as: WYLIE JACOB · WYLIE JACOB E
8 granted patents·2 pending applications·10 citations·filing 2006–2013
79Inventor score
Top patents by PatentIndex Score
10 records- 0168US8314027B2Wafer electroless plating system and associated methodsTHIE WILLIAM·Filed 2011·Granted Nov 20, 2012·2 cites·15 claims
- 0267US7811423B2Proximity processing using controlled batch volume with an integrated proximity headLAM RES CORP·Filed 2006·Granted Oct 12, 2010·2 cites·18 claims
- 0361US8485120B2Method and apparatus for wafer electroless platingTHIE WILLIAM·Filed 2007·Granted Jul 16, 2013·1 cites·14 claims
- 0457US8069813B2Wafer electroless plating system and associated methodsTHIE WILLIAM·Filed 2007·Granted Dec 6, 2011·1 cites·18 claims
- 0556US8083207B1Apparatus for gate valve movement in a minimum-space wet process environmentWYLIE JACOB·Filed 2008·Granted Dec 27, 2011·4 cites·14 claims
- 0652US9287110B2Method and apparatus for wafer electroless platingLAM RES CORP·Filed 2013·Granted Mar 15, 2016·0 cites·20 claims
- 0748US2009211644A1Instant Hot Water Delivery SystemWYLIE JACOB E·Filed 2009·Application pending·0 cites
- 0843US8844461B2Fluid handling system for wafer electroless plating and associated methodsTHIE WILLIAM·Filed 2007·Granted Sep 30, 2014·0 cites·23 claims
- 0941US8221608B2Proximity processing using controlled batch volume with an integrated proximity headWOODS CARL A·Filed 2010·Granted Jul 17, 2012·0 cites·7 claims
- 1041US2010096018A1Instant hot water delivery systemWYLIE JACOB E·Filed 2009·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →